公开(公告)号：US20060186179A1

公开(公告)日：2006-08-24

申请号：US11064283

申请日：2005-02-23

申请人： Lee Levine ,  Matthew Osborne ,  Stephen Babinetz ,  Jon Brunner

发明人： Lee Levine ,  Matthew Osborne ,  Stephen Babinetz ,  Jon Brunner

IPC分类号： B23K31/02

CPC分类号： H01L24/85 ,  B23K20/007 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/4554 ,  H01L2224/45669 ,  H01L2224/48463 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/48824

摘要： A wire bonder and a method of bonding a bonding wire to a bonding pad of a bonding location using the wire bonder are provided. The method includes forming a bonding ball at an end of the bonding wire, pre-deforming at least a portion of the bonding ball and bonding the pre-deformed ball to the bonding pad. The wire bonder includes a source of heat disposed adjacent a bonding tool to melt a portion of the bonding wire to produce the bonding ball at an end thereof, and a pre-deforming unit including a deforming surface to pre-deform at least a portion of the bonding ball.

摘要翻译： 提供了一种引线接合器和使用引线接合器将接合线接合到接合位置的接合焊盘的方法。 该方法包括在接合线的端部形成接合球，对接合球的至少一部分进行预变形，并将预变形的球接合到接合焊盘。 引线接合器包括邻近焊接工具设置的熔化源，以熔化接合线的一部分以在其一端产生接合球;以及预变形单元，其包括变形表面以预变形至少一部分 粘接球。