Abstract:
The invention relates to an apparatus (1) for producing a reflection-reducing layer on a surface (21) of a plastics substrate (20). The apparatus comprises a first sputtering device (3) for applying a base layer (22) to the surface (21) of the plastics substrate (20), a plasma source (4) for plasma-etching the coated substrate surface (21), and a second sputtering device (5) for applying a protective layer (24) to the substrate surface (21). These processing devices (3, 4, 5) are arranged jointly in a vacuum chamber (2), which has inlets (8) for processing gases. In order to move the substrate (20) between the processing devices (3, 4, 5) in the interior of the vacuum chamber (2), a conveying apparatus (10) is provided which is preferably in the form of a rotary table (11).—Furthermore, the invention relates to a method for producing such a reflection-reducing layer on the surface (21) of the plastics substrate (20).
Abstract:
The invention concerns an optical coating (3, 3′), having a high refractive index and good optical properties (i.e., low absorption and scatter) and limited internal stresses in a spectral range extending from the visible to the near UV range (i.e., up to a wavelength of 220 nm). The coating (3, 3′) according to the invention consists of a hafnium- or zirconium-containing oxide HfxSiyOz or ZrxSiyOz containing an silicon fraction (y) between 1 at. % and 10 at. %, especially between 1.5 at. % and 3 at. %.
Abstract:
The invention concerns an optical coating (3, 3′), having a high refractive index and good optical properties (i.e., low absorption and scatter) and limited internal stresses in a spectral range extending from the visible to the near UV range (i.e., up to a wavelength of 220 nm). The coating (3, 3′) according to the invention consists of a hafnium- or zirconium-containing oxide HfxSiyOz or ZrxSiyOz containing an silicon fraction (y) between 1 at. % and 10 at. %, especially between 1.5 at. % and 3 at. %.
Abstract translation:本发明涉及一种具有高折射率和良好的光学性质(即低吸收和散射)以及从可见光范围延伸到近紫外范围的光谱范围内的有限内应力的光学涂层(3,3')(即, 直到波长为220nm)。 根据本发明的涂层(3,3')由含有铪或锆的氧化物Hf x Sb y O z或Zr x S y O z z组成,其中硅含量(y)为1at。 %和10在。 %,特别是1.5 at。 %和3在。 %。
Abstract:
A method for reducing the optical loss of the multilayer coating below a predetermined value in a zone by producing coating on a displaceable substrate in a vacuum chamber with the aid of a residual gas using a sputtering device. Reactive depositing a coating on the substrate by adding a reactive component with a predetermined stoichiometric deficit in a zone of the sputtering device. Displacing the substrate with the deposited coating into the vicinity of a plasma source, which is located in the vacuum chamber at a predetermined distance from the sputtering device. The plasma action of the plasma source modifying the structure and/or stoichiometry of the coating, preferably by adding a predetermined quantity of the reactive component to reduce the optical loss of the coating.
Abstract:
The invention relates to an apparatus (1) for producing a reflection-reducing layer on a surface (21) of a plastics substrate (20). The apparatus comprises a first sputtering device (3) for applying a base layer (22) to the surface (21) of the plastics substrate (20), a plasma source (4) for plasma-etching the coated substrate surface (21), and a second sputtering device (5) for applying a protective layer (24) to the substrate surface (21). These processing devices (3, 4, 5) are arranged jointly in a vacuum chamber (2), which has inlets (8) for processing gases. In order to move the substrate (20) between the processing devices (3, 4, 5) in the interior of the vacuum chamber (2), a conveying apparatus (10) is provided which is preferably in the form of a rotary table (11). Furthermore, the invention relates to a method for producing such a reflection-reducing layer on the surface (21) of the plastics substrate (20).
Abstract:
A method for reducing the optical loss of the multilayer coating below a predetermined value in a zone by producing coating on a displaceable substrate in a vacuum chamber with the aid of a residual gas using a sputtering device. Reactive depositing a coating on the substrate by adding a reactive component with a predetermined stoichiometric deficit in a zone of the sputtering device. Displacing the substrate with the deposited coating into the vicinity of a plasma source, which is located in the vacuum chamber at a predetermined distance from the sputtering device. The plasma action of the plasma source modifying the structure and/or stoichiometry of the coating, preferably by adding a predetermined quantity of the reactive component to reduce the optical loss of the coating.