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公开(公告)号：US11041774B2
公开(公告)日：2021-06-22
申请号：US15923574
申请日：2018-03-16
Applicant: LINGSEN PRECISION INDUSTRIES, LTD.
Inventor： Ming-Te Tu , Chiung-Yueh Tien , Cheng-Yao Chang , Mei-Yen Su
Abstract: A pressure sensor package includes a package lead frame including a molding plastic layer with a top surface and a plurality of lead frame units mounted in the molding plastic layer, a sidewall disposed on the top surface of the molding plastic layer and surrounding a receiving chamber, a pressure sensor module mounted on the top surface of the molding plastic layer and disposed in the receiving chamber, and a packaging silicone mounted in the receiving chamber to encapsulate the pressure sensor module.
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公开(公告)号：US10362406B2
公开(公告)日：2019-07-23
申请号：US15334773
申请日：2016-10-26
Applicant: LINGSEN PRECISION INDUSTRIES, LTD.
Inventor： Yao-Ting Yeh , Hsien-Ken Liao , Jyong-Yue Tian , Ming-Te Tu
Abstract: A MEMS microphone package includes a substrate including a base layer, a sound hole cut through the base layer, a conduction part arranged on the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to the conduction part, a cover plate connected to an opposite end of the sidewall and having a solder pad and a third contact disposed in conduction with the solder pad and electrically connected to the conducting line, an acoustic wave sensor mounted on the top surface of the base layer to face toward the sound hole, a processor chip mounted on the top surface of the base layer and electrically connected to the acoustic wave sensor and the conduction part, and one or multiple electronic components electrically bonded to the cover plate.
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公开(公告)号：US10312169B1
公开(公告)日：2019-06-04
申请号：US15895259
申请日：2018-02-13
Applicant: LINGSEN PRECISION INDUSTRIES, LTD.
Inventor： Yu-Shiang Chen , Chao-Wei Yu , Yu-Lin Hsiao , Ming-Te Tu
IPC: H01L23/10 , H01L23/057 , H01L23/60
CPC classification number: H01L23/10 , H01L23/057 , H01L23/60
Abstract: A substrate includes a substrate body and an interconnection layer disposed on a bearing surface of the substrate body and having an annular portion and a plurality of protrusions extending outward from an outer periphery of the annular portion. A package module is formed by the substrate, a chip mounted on the bearing surface of the substrate body, and a cap enclosing the chip and having a bottom thereof adhered to the interconnection layer of the substrate by an adhesive. By means of the protrusions of the interconnection layer, the bonding area of the adhesive is increased and the spread of the adhesive is effectively concentrated.
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公开(公告)号：US10103286B2
公开(公告)日：2018-10-16
申请号：US15438164
申请日：2017-02-21
Applicant: LINGSEN PRECISION INDUSTRIES, LTD.
Inventor： Ching-I Lin , Ming-Te Tu
IPC: H01L31/173 , H01L31/18 , H01L33/58 , H01L31/0232 , H01L33/54 , H01L31/0203 , H01L33/52
Abstract: A package structure of a long-distance sensor includes a substrate, a light-emitting chip, a sensing chip, two packaging gel bodies, and a cap. The substrate has a bearing surface. The light-emitting chip and the sensing chip are disposed on the bearing surface and separated from each other. The two packaging gel bodies cover the light-emitting chip and the sensing chip respectively and are separated from each other. The cap is disposed on the bearing surface and the packaging gel bodies, fastened to the bearing surface and the packaging gel bodies by adhesive, and provided with a light-emitting hole located above the light-emitting chip and a light-receiving hole located above the sensing chip.
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5.发明授权Micro optical package structure with filtration layer and method for making the same 有权具有过滤层的微型光学封装结构及其制造方法公开(公告)号：US09312402B2
公开(公告)日：2016-04-12
申请号：US14171328
申请日：2014-02-03
Applicant: LINGSEN PRECISION INDUSTRIES, LTD.
Inventor： Ming-Te Tu , Yao-Ting Yeh
IPC: H01L33/00 , H01L31/0203 , H01L31/173 , H01L31/18
CPC classification number: H01L31/0203 , H01L31/16 , H01L31/173 , H01L31/18 , H01L2224/48091 , H01L2224/48227 , H01L2924/181 , Y02P70/521 , H01L2924/00012 , H01L2924/00014
Abstract: A micro optical package structure with filtration layers includes a substrate having a light-emitting area and a light-receiving area, a light-emitting chip being deposited in a light-emitting area, a light-receiving chip being deposited in a light-receiving area, two packaging resin bodies for enclosing the light-emitting chip and the light-receiving chip, respectively, and being separately deposited in the light-emitting area and the light-receiving area, respectively, and the filtration layers formed on the packaging resin bodies surface for filtering out lights of different wavelengths. The micro optical package structure needs neither barrier nor protective cover between or outside the packaging resin bodies, so can be microminiaturized. The micro optical package structure can filter out visible lights of specific wavelengths without using any additional filters.
Abstract translation: 具有过滤层的微型光学封装结构包括具有发光区域和受光区域的基板，在发光区域中沉积的发光芯片，在受光区域中沉积的光接收芯片 分别包围发光芯片和受光芯片的两个包装树脂体，分别沉积在发光区域和光接收区域中，以及形成在包装树脂上的过滤层 身体表面用于过滤不同波长的光。 微型光学封装结构在包装树脂体之间或之外既不需要屏障也不需要保护层，因此可以微型化。 微型光学封装结构可以滤除特定波长的可见光，而无需使用任何额外的滤光片。
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Patent Agency Ranking
公开(公告)号：US09309108B2
公开(公告)日：2016-04-12
申请号：US14531222
申请日：2014-11-03
Applicant: LINGSEN PRECISION INDUSTRIES, LTD.
Inventor： Hsien-Ken Liao , Ming-Te Tu
CPC classification number: B81C1/0023 , B81C1/00301 , B81C1/00357 , B81C2203/037 , H01L2224/48091 , H01L2224/48137 , H01L2224/8592 , H01L2924/15151 , H04R1/08 , H04R19/04 , H04R2201/003 , H01L2924/00014
Abstract: A MEMS microphone packaging method includes the steps of: providing a substrate having a conducting part and a through hole; mounting a processor chip on the substrate and electrically connecting the processor chip to the conducting part; mounting a sensor chip on the substrate over the through hole and adjacent to the processor chip and electrically connecting the sensor chip to the processor chip; and mounting a cover on the substrate over the processor chip and the sensor chip. The cover has a conducting circuit, and the conducting circuit electrically coupled with the conducting part. Thus, the method of the invention can make a flip architecture MEMS microphone, reducing the steps of the packaging process and lowering the degree of difficulty of the manufacturing process and the manufacturing costs.
Abstract translation: MEMS麦克风封装方法包括以下步骤：提供具有导电部分和通孔的基板; 将处理器芯片安装在基板上并将处理器芯片电连接到导电部件; 将传感器芯片安装在通孔上并与处理器芯片相邻并将传感器芯片电连接到处理器芯片上的基板上; 以及在处理器芯片和传感器芯片上的基板上安装盖。 盖具有导电电路，并且导电电路与导电部分电耦合。 因此，本发明的方法可以制造翻转架构的MEMS麦克风，减少了封装过程的步骤，降低了制造过程的难度和制造成本。
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公开(公告)号：US11410856B2
公开(公告)日：2022-08-09
申请号：US17109540
申请日：2020-12-02
Applicant: LINGSEN PRECISION INDUSTRIES, LTD.
Inventor： Ming-Te Tu
IPC: H01L21/56 , H01L21/768 , H01L21/60
Abstract: A chip packaging method begins by fixing a chip to the top side of a substrate. The chip is then encapsulated in an encapsulant. After that, the encapsulant is drilled from its top side in order to have a through hole adjacent to the chip. Lastly, an area extending between the chip and the through hole and the hole wall of the through hole are plated with an electrically conductive metal to enable electrical connection between the chip and the substrate through the electrically conductive metal. The chip packaging method solves the problems of the conventional wire bonding method, simplifies the packaging process, and provides the packaged chips with high transmission efficiency.
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公开(公告)号：US10696543B1
公开(公告)日：2020-06-30
申请号：US16415491
申请日：2019-05-17
Applicant: LINGSEN PRECISION INDUSTRIES, LTD.
Inventor： Chiung-Yueh Tien , Ming-Te Tu
Abstract: A waterproof MEMS chip package structure includes a substrate having aa through hole cut through opposing top and bottom surface thereof, a waterproof membrane disposed in the through hole, an along chip bonded to the top surface of the substrate, a MEMS chip stacked on the analog chip and electrically connected to the substrate and the analog chip by wire bonding, and a top cover mounted on the substrate to form an accommodation chamber that accommodates the analog chip and the MEMS chip and communicates with the outside through the through hole. Therefore, the MEMS chip package structure of the present invention utilizes the waterproof membrane to block water vapor from entering the accommodation chamber through the through hole, thereby achieving the effect of protecting the chips.
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公开(公告)号：US10299046B2
公开(公告)日：2019-05-21
申请号：US15335742
申请日：2016-10-27
Applicant: LINGSEN PRECISION INDUSTRIES, LTD.
Inventor： Hsien-Ken Liao , Ming-Te Tu , Jyong-Yue Tian , Yao-Ting Yeh
Abstract: A MEMS microphone package includes a substrate including a base layer, a sound hole cut through opposing top and bottom surfaces of the base layer, a conduction part arranged on the base layer and a notch located on the top surface of the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to the conduction part, a cover plate connected to an opposite end of the sidewall and having a solder pad and a third contact disposed in conduction with the solder pad and electrically connected to the conducting line, a processor chip mounted in the notch and electrically connected to the conduction part, and an acoustic wave sensor mounted on the base layer to face toward the sound hole and electrically connected to the processor chip.
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公开(公告)号：US09952089B2
公开(公告)日：2018-04-24
申请号：US14536210
申请日：2014-11-07
Applicant: Lingsen Precision Industries, Ltd.
Inventor： Ming-Te Tu , Yu-Chang Huang
CPC classification number: G01J1/0271 , G01J1/0209 , G01J1/0233 , G01J1/42 , G01S7/4813 , G01S7/4815 , G01S17/026
Abstract: An optical sensing module includes a substrate, a cover, a plurality of light-emitting chips, a light-receiving chip, and a plurality of encapsulants. The cover is disposed on the substrate. A plurality of first chambers and a second chamber are formed between the cover and the substrate. The cover has a plurality of light-emitting holes communicating with the first chambers, respectively, and a light-receiving hole communicating with the second chamber. The light-emitting chips are disposed on the substrate and in the first chambers, respectively. The light-receiving chip is disposed on the substrate and in the second chamber. The encapsulants fill the first and second chambers and enclose the light-emitting chips and the light-receiving chip, respectively. Hence, characterized in that: the light-emitting chips and the light-receiving chip are disposed on the substrate, and the light-emitting chips emit light beams in different colors to enhance light emission efficiency.
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