Reliable method and system for efficiently transporting dynamic data across a network
    2.
    发明授权
    Reliable method and system for efficiently transporting dynamic data across a network 有权
    通过网络有效传输动态数据的可靠方法和系统

    公开(公告)号:US07451381B2

    公开(公告)日:2008-11-11

    申请号:US10772034

    申请日:2004-02-03

    IPC分类号: H03M13/35

    摘要: A data networking system designed to provide efficient, yet reliable, transportation of data across a time division multiplexed network. This invention allows for redundantly sending data segments wherein if bad data segments are received, they can be resent in a dynamic manner depending on the network condition and segments can be fragmented, resized and sent with low overhead due to dynamic header sizes, segment sizes, forward error correction, and cyclic redundancy checks. The result is a very adaptive network that meets the demanding requirements of networks such as power line and wireless while still being able to transport data for voice, audio, video, computer, control, and the like.

    摘要翻译: 一种数据网络系统,旨在通过时分复用网络提供高效,可靠的数据传输。 本发明允许冗余地发送数据段,其中如果接收到不良数据段,则可以根据网络条件以动态方式重新发送数据段,并且由于动态报头大小,段大小,段可以被分段,调整大小并以低开销发送, 前向纠错和循环冗余校验。 结果是一个非常适合的网络,满足诸如电力线和无线等网络的苛刻要求,同时仍然能够传输语音,音频,视频,计算机,控制等数据。

    Integrated circuit package with segregated Tx and Rx data channels
    4.
    发明授权
    Integrated circuit package with segregated Tx and Rx data channels 有权
    集成电路封装,具有隔离的Tx和Rx数据通道

    公开(公告)号:US08368217B2

    公开(公告)日:2013-02-05

    申请号:US13541658

    申请日:2012-07-03

    IPC分类号: H01L23/48

    摘要: A chip layout isolates Rx terminals and Rx ports from Tx terminals and Tx ports. Tx terminals are grouped contiguously to each other, and are segregated as a group to a given edge of the package, Rx terminals are similarly grouped and segregated to a different edge of the package. Tx and Rx data channels are disposed in a respective single layer of the package, or both are disposed in a same single layer of the package. Rx ports and Tx ports are located at an approximate center of the package, with Tx and Rx ports disposed on respective opposite sides of an axis bisecting the package. Data signals received by, and transmitted from, the chip flow in a same direction, from a first edge of the package to the center of the package and from the center of the package to a second edge of the package, respectively.

    摘要翻译: 芯片布局将Rx端子和Rx端口与Tx端子和Tx端口隔离。 Tx端子彼此连续分组,并且作为组分离到包装的给定边缘,Rx端子被类似地分组并分离到包装的不同边缘。 Tx和Rx数据通道设置在封装的相应单层中,或者两者都被布置在封装的相同的单层中。 Rx端口和Tx端口位于封装的大致中心处,Tx和Rx端口设置在平分封装的轴的相应相对两侧。 分别从包装的第一边缘到包装的中心以及从包装的中心到包装的第二边缘的相同方向从芯片流接收和传输的数据信号。

    INTEGRATED CIRCUIT PACKAGE WITH SEGREGATED TX AND RX DATA CHANNELS
    5.
    发明申请
    INTEGRATED CIRCUIT PACKAGE WITH SEGREGATED TX AND RX DATA CHANNELS 有权
    集成电路封装与分离的TX和RX数据通道

    公开(公告)号:US20120267769A1

    公开(公告)日:2012-10-25

    申请号:US13541658

    申请日:2012-07-03

    IPC分类号: H01L23/58

    摘要: A chip layout isolates Rx terminals and Rx ports from Tx terminals and Tx ports. Tx terminals are grouped contiguously to each other, and are segregated as a group to a given edge of the package, Rx terminals are similarly grouped and segregated to a different edge of the package. Tx and Rx data channels are disposed in a respective single layer of the package, or both are disposed in a same single layer of the package. Rx ports and Tx ports are located at an approximate center of the package, with Tx and Rx ports disposed on respective opposite sides of an axis bisecting the package. Data signals received by, and transmitted from, the chip flow in a same direction, from a first edge of the package to the center of the package and from the center of the package to a second edge of the package, respectively.

    摘要翻译: 芯片布局将Rx端子和Rx端口与Tx端子和Tx端口隔离。 Tx端子彼此连续分组,并且作为组分离到包装的给定边缘,Rx端子被类似地分组并分离到包装的不同边缘。 Tx和Rx数据通道设置在封装的相应单层中,或者两者都被布置在封装的相同的单层中。 Rx端口和Tx端口位于封装的大致中心处,Tx和Rx端口设置在平分封装的轴的相应相对两侧。 分别从包装的第一边缘到包装的中心以及从包装的中心到包装的第二边缘的相同方向从芯片流接收和传输的数据信号。

    VLSI Package for High Performance Integrated Circuit
    6.
    发明申请
    VLSI Package for High Performance Integrated Circuit 审中-公开
    用于高性能集成电路的VLSI封装

    公开(公告)号:US20120068339A1

    公开(公告)日:2012-03-22

    申请号:US12887298

    申请日:2010-09-21

    IPC分类号: H01L23/498 H01L21/60

    摘要: A packaged integrated circuit is presented for placement on a printed circuit board (PCB) layer providing power lines and data access channels. The packaged integrated circuit includes; a package substrate having data channels and power lines; a circuit substrate having functional components, wherein (a) the power lines and the data channels in the package substrate are coupled to the functional components of the substrate by conducting bumps, (b) the conducting balls coupling the data access channels in the PCB to the data channels in the package substrate are located along the edges of the package substrate; and (c) the conducting balls coupling the power lines in the PCB and the power lines in the package substrate are located in an interior portion of the package substrate. Also, an integrated circuit may further include a circuit substrate having active components, including a SerDes circuit at a center portion of the substrate.

    摘要翻译: 提供封装的集成电路用于放置在提供电力线和数据访问通道的印刷电路板(PCB)层上。 封装的集成电路包括: 具有数据通道和电源线的封装基板; 具有功能部件的电路基板,其中(a)封装基板中的电源线和数据通道通过传导凸块而耦合到基板的功能部件,(b)将PCB中的数据访问通道耦合到的导电球到 封装衬底中的数据通道沿封装衬底的边缘定位; 和(c)将PCB中的电力线和封装衬底中的电力线耦合的导电球位于封装衬底的内部。 此外,集成电路还可以包括具有有源部件的电路基板,在基板的中心部分包​​括SerDes电路。

    Semiconductor Chip Layout
    7.
    发明申请
    Semiconductor Chip Layout 有权
    半导体芯片布局

    公开(公告)号:US20120025397A1

    公开(公告)日:2012-02-02

    申请号:US12846763

    申请日:2010-07-29

    IPC分类号: H01L23/52

    摘要: A chip layout for a high speed semiconductor device is disclosed. The chip layout isolates Rx terminals and Rx ports from Tx terminals and Tx ports. A serial interface is centrally located to reduce latency, power and propagation delays. Stacked die that contain one or more devices with the chip layout are characterized by having improved latency, bandwidth, power consumption, and propagation delays.

    摘要翻译: 公开了一种用于高速半导体器件的芯片布局。 芯片布局将Rx端子和Rx端口与Tx端子和Tx端口隔离。 串行接口位于中心位置,以减少延迟,功率和传播延迟。 包含一个或多个具有芯片布局的器件的堆叠裸片的特征在于具有改进的延迟,带宽,功耗和传播延迟。

    Method and apparatus for detecting faults in a current sensing device
    8.
    发明授权
    Method and apparatus for detecting faults in a current sensing device 有权
    用于检测电流感测装置中的故障的方法和装置

    公开(公告)号:US08005632B2

    公开(公告)日:2011-08-23

    申请号:US11936291

    申请日:2007-11-07

    IPC分类号: G01R19/00

    摘要: A method and article of manufacture are provided to monitor a sensing system operative to monitor electrical current in a transmission line between an electrical storage device and an electrical machine. The sensing system comprises first and second sensors, operative to monitor first and second ranges of electrical current. The method comprises determining outputs of the first and second sensors are valid, and comparing outputs of the first and second sensors when current is substantially zero. The method comprises comparing magnitudes of the outputs of the first and second sensors when the monitored electrical current, and monitoring polarity of each of the outputs of the first and second sensors.

    摘要翻译: 提供了一种制造方法和监视感测系统,该感测系统可操作以监测电存储装置和电机之间的传输线路中的电流。 感测系统包括第一和第二传感器,用于监视第一和第二电流范围。 该方法包括确定第一和第二传感器的输出是有效的,并且当电流基本上为零时,比较第一和第二传感器的输出。 该方法包括:当监测的电流和第一和第二传感器的每个输出的监视极性时,比较第一和第二传感器的输出的幅度。

    System for automated device-to-device transfer system
    9.
    发明申请
    System for automated device-to-device transfer system 失效
    用于自动化设备到设备传输系统的系统

    公开(公告)号:US20100042729A1

    公开(公告)日:2010-02-18

    申请号:US12588433

    申请日:2009-10-15

    申请人: Michael J. Miller

    发明人: Michael J. Miller

    IPC分类号: G06F15/16

    摘要: A session transfer module of a session server provides the capability to a user to direct a transfer of an on-going session from one device to another device while maintaining the session. The session transfer module is invoked by a user in a way consistent with the user interface of the client application, including by a graphical user command, a command line prompt, or a voice command. The client provides a selection of possible devices that may receive the redirected session. The session transfer module receives the selected device with the session redirect command over a communication network. The communication network may be wired (e.g., public switched telephone network (“PSTN”), Internet, etc.,) a wireless network (e.g., digital telephone network, pager network, etc.,) or a combination of the wired and wireless networks. The session transfer module may be configured to discontinue the session with the current device and to block any subsequent messages of the transferring session from reaching the device. The session transfer module may be further configured to access a device profile from a device profile database to convert the blocked messages into a format compatible to the format and/or modality of the redirected device. The session transfer module may be further configured to push the session to the redirected device in response to an activation (e.g., log-on) of the redirected device by the user. Alternatively, the session transfer module may be further configured to push the session back to the device in response to a time-out in the activation of the redirected device.

    摘要翻译: 会话服务器的会话传送模块向用户提供能力,以指导将持续会话从一个设备传送到另一个设备,同时保持会话。 会话转移模块由用户以与客户端应用程序的用户界面一致的方式调用,包括图形用户命令,命令行提示符或语音命令。 客户端提供可能接收重定向会话的可能设备的选择。 会话转移模块通过通信网络接收具有会话重定向命令的所选择的设备。 通信网络可以是有线的(例如,公共交换电话网络(“PSTN”),因特网等)无线网络(例如,数字电话网络,寻呼机网络等)或有线和无线的组合 网络。 会话传送模块可以被配置为中断与当前设备的会话,并且阻止传送会话的任何后续消息到达设备。 会话转移模块还可以被配置为从设备配置文件数据库访问设备简档,以将被阻止的消息转换成与重定向设备的格式和/或模式兼容的格式。 会话转移模块还可以被配置为响应于用户对重定向设备的激活(例如,登录)而将会话推送到重定向设备。 或者,会话传送模块还可以被配置为响应于重定向设备的激活中的超时而将会话推回设备。

    CAM circuit with radiation resistance

    公开(公告)号:US06560156B2

    公开(公告)日:2003-05-06

    申请号:US10099913

    申请日:2002-03-14

    IPC分类号: G11C700

    摘要: A CAM circuit including a RAM array, a CAM array, and a control circuit that systematically writes data from the RAM array to the CAM array, thereby preventing soft errors by continually restoring data that has been corrupted by radiation. The RAM and CAM arrays can be formed on the same substrate, but are preferably fabricated on separate substrates and mounted in a single package or on a PCB. Both the CAM and RAM can be formed using any conventional memory type (e.g., SRAM, DRAM, NVRAM), and the CAM array can be a binary, ternary, or quad CAM array. The CAM and RAM arrays can be formed on different substrates, or the same substrate. A system including an SRAM ternary CAM array and a RAM array perform quad CAM functions by performing read functions utilizing only the RAM array, while performing lookup functions using the ternary CAM array.