公开(公告)号：US20030207073A1

公开(公告)日：2003-11-06

申请号：US10409400

申请日：2003-04-07

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Hiroaki Takezawa ,  Tsutomu Mitani ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Kazuo Eda

IPC: B32B005/12 ,  B32B009/00 ,  B05D005/10 ,  B05D001/36

CPC classification number: H05K3/321 ,  B32B7/02 ,  B32B7/12 ,  H05K2201/09909 ,  H05K2201/10636 ,  H05K2201/10984 ,  H05K2203/0783 ,  H05K2203/121 ,  Y02P70/611 ,  Y10S428/901 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T428/24066 ,  Y10T428/24917 ,  Y10T428/2495 ,  Y10T428/24975 ,  Y10T428/269 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

公开(公告)号：US20020098609A1

公开(公告)日：2002-07-25

申请号：US10046265

申请日：2002-01-16

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Masahiro Ono ,  Minehiro Itagaki

IPC: H01L021/00

CPC classification number: H01L31/0203 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4232 ,  H01L24/81 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29035 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83104 ,  H01L2224/83874 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12036 ,  H01L2924/12043 ,  H01L2924/15151 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: In a photo-semiconductor module of the present invention, a light-receiving photo-semiconductor device is mounted flip-chip-wise on a circuit board to then fix an optical fiber to a mounting face of the light-receiving photo-semiconductor or a back face of this mounting face, thus improving a high-frequency characteristic.

Abstract translation: 在本发明的光半导体模块中，将光接收光电半导体装置倒装在电路板上，然后将光纤固定在受光光半导体的安装面上，或 该安装面的背面，从而提高了高频特性。

公开(公告)号：US20020034620A1

公开(公告)日：2002-03-21

申请号：US09965768

申请日：2001-09-27

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Hiroaki Takezawa ,  Tsutomu Mitani ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Kazuo Eda

IPC: B32B003/00

CPC classification number: H05K3/321 ,  B32B7/02 ,  B32B7/12 ,  H05K2201/09909 ,  H05K2201/10636 ,  H05K2201/10984 ,  H05K2203/0783 ,  H05K2203/121 ,  Y02P70/611 ,  Y10S428/901 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T428/24066 ,  Y10T428/24917 ,  Y10T428/2495 ,  Y10T428/24975 ,  Y10T428/269 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

Abstract translation: 在包括通过导电粘合剂彼此电连接的第一电极和第二电极的安装结构中，至少一个电极和导电粘合剂之间的粘合部分的周边被电绝缘层覆盖，由此附着 部分从外围加强。 电绝缘层可以通过将导电粘合剂的粘合剂树脂组分溶解在溶剂中而形成。 这增加了导电粘合剂中的导电填料的浓度，从而也增强了粘合部分的导电性。