MEMORY ELEMENTS USING SELF-ALIGNED PHASE CHANGE MATERIAL LAYERS AND METHODS OF MANUFACTURING SAME
    5.
    发明申请
    MEMORY ELEMENTS USING SELF-ALIGNED PHASE CHANGE MATERIAL LAYERS AND METHODS OF MANUFACTURING SAME 有权
    使用自对准相变材料层的记忆元件及其制造方法

    公开(公告)号:US20130248810A1

    公开(公告)日:2013-09-26

    申请号:US13889777

    申请日:2013-05-08

    Abstract: A memory element and method of forming the same. The memory element includes a substrate supporting a first electrode, a dielectric layer over the first electrode having a via exposing a portion of the first electrode, a phase change material layer formed over sidewalls of the via and contacting the exposed portion of the first electrode, insulating material formed over the phase change material layer and a second electrode formed over the insulating material and contacting the phase change material layer.

    Abstract translation: 记忆元件及其形成方法。 存储元件包括支撑第一电极的基板,在第一电极上的电介质层,具有暴露第一电极的一部分的通孔,形成在通孔的侧壁上并与第一电极的暴露部分接触的相变材料层, 形成在相变材料层上的绝缘材料和形成在绝缘材料上并与相变材料层接触的第二电极。

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