公开(公告)号：US20140141544A1

公开(公告)日：2014-05-22

申请号：US14166490

申请日：2014-01-28

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Meow Koon Eng ,  Sui Waf Low ,  Min Yu Chan ,  Yong Poo Chia ,  Bok Leng Ser ,  Wei Zhou

IPC: H01L21/48 ,  H01L25/00 ,  H01L21/66

CPC classification number: H01L21/4842 ,  H01L22/10 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/03 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic component package includes a plurality of electrical leads which are coupled to a microelectronic component and which have exposed lengths extending outwardly beyond a peripheral edge of an encapsulant. A plurality of terminals may be positioned proximate a terminal face of the encapsulant and these terminals may be electrically coupled to the same leads. This can facilitate connection of the microelectronic component to a substrate using the leads as a conventional leaded package. The terminals, however, can facilitate stacking of the leaded package with one or more additional microelectronic components, e.g., a BGA package.

Abstract translation: 微电子部件封装包括耦合到微电子部件并且具有向外延伸超过密封剂的外围边缘的暴露长度的多个电引线。 多个端子可以位于密封剂的端面附近，并且这些端子可以电耦合到相同的引线。 这可以有助于使用引线作为常规引线封装将微电子部件连接到基板。 然而，这些端子可以促进引线封装与一个或多个额外的微电子部件例如BGA封装的堆叠。

公开(公告)号：US09418872B2

公开(公告)日：2016-08-16

申请号：US14166490

申请日：2014-01-28

Applicant: Micron Technology, Inc.

Inventor： Meow Koon Eng ,  Sui Waf Low ,  Min Yu Chan ,  Yong Poo Chia ,  Bok Leng Ser ,  Wei Zhou

IPC: H01L21/66 ,  H01L21/50 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00 ,  H01L25/10 ,  H01L25/03 ,  H01L25/00

CPC classification number: H01L21/4842 ,  H01L22/10 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/03 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic component package includes a plurality of electrical leads which are coupled to a microelectronic component and which have exposed lengths extending outwardly beyond a peripheral edge of an encapsulant. A plurality of terminals may be positioned proximate a terminal face of the encapsulant and these terminals may be electrically coupled to the same leads. This can facilitate connection of the microelectronic component to a substrate using the leads as a conventional leaded package. The terminals, however, can facilitate stacking of the leaded package with one or more additional microelectronic components, e.g., a BGA package.

Abstract translation: 微电子部件封装包括耦合到微电子部件并且具有向外延伸超过密封剂的外围边缘的暴露长度的多个电引线。 多个端子可以位于密封剂的端面附近，并且这些端子可以电耦合到相同的引线。 这可以有助于使用引线作为常规引线封装将微电子部件连接到基板。 然而，这些端子可以促进引线封装与一个或多个额外的微电子部件例如BGA封装的堆叠。