公开(公告)号：US20240338139A1

公开(公告)日：2024-10-10

申请号：US18748715

申请日：2024-06-20

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Wai Leong Chin ,  Francis Chee Khai Chew ,  Trismardawi Tanadi ,  Chun Sum Yeung ,  Lawrence Dumalag ,  Ekamdeep Singh

IPC: G06F3/06 ,  G06F12/06

CPC classification number: G06F3/064 ,  G06F3/0604 ,  G06F3/0653 ,  G06F3/0679 ,  G06F12/0646 ,  G06F2212/7202 ,  G06F2212/7204 ,  G06F2212/7206

Abstract: A memory sub-system causing execution of a first wordline leakage test of a first wordline group of a set of wordline groups of a memory block in response to determining a temperature of the memory block is within a threshold temperature range. A first result of the first wordline leakage test is determined. A second wordline leakage test of a second wordline group is caused to be executed and a second result is determined. A determination is made that the first result of the first wordline leakage test of the first wordline group satisfies a first condition. A determination is made that the second result of the second wordline leakage test of the second wordline group satisfies a second condition. In response to satisfaction of the conditions, an action is executed.

公开(公告)号：US12045482B2

公开(公告)日：2024-07-23

申请号：US17877240

申请日：2022-07-29

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Wai Leong Chin ,  Francis Chee Khai Chew ,  Trismardawi Tanadi ,  Chun Sum Yeung ,  Lawrence Dumalag ,  Ekamdeep Singh

IPC: G06F3/06 ,  G06F12/06

CPC classification number: G06F3/064 ,  G06F3/0604 ,  G06F3/0653 ,  G06F3/0679 ,  G06F12/0646 ,  G06F2212/7202 ,  G06F2212/7204 ,  G06F2212/7206

Abstract: A processing device in a memory sub-system determines whether a media endurance metric associated with a memory block of a memory device satisfies one or more conditions. In response to the one or more conditions being satisfied, a temperature of the memory block is compared to a threshold temperature range. In response to determining the temperature of the memory block is within the threshold temperature range, the processing device causes execution of a wordline leakage test of a wordline group of a set of wordline groups of the memory block. A result of the wordline leakage test of the target wordline group is determined and an action is executed based on the result of the wordline leakage test.

公开(公告)号：US20170207195A1

公开(公告)日：2017-07-20

申请号：US14995925

申请日：2016-01-14

Applicant: Micron Technology, Inc.

Inventor： Nathan J. Sirocka ,  Trismardawi Tanadi ,  Andrew D. Proescholdt

IPC: H01L25/065 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2225/06506 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture are disclosed herein. In one embodiment, a semiconductor device package includes a plurality of package contacts and a semiconductor die having a plurality of first die bond pads, a plurality of second die bond pads, and a plurality of duplicate die bond pads having the same pin assignments as the first die bond pads. The semiconductor die further includes an integrated circuit operably coupled to the package contacts via the plurality of first die bond pads and either the second die bond pads or the duplicate die bond pads, but not both. The integrated circuit is configured to be programmed into one of (1) a first pad state in which the first and second die bond pads are enabled for use with the package contacts and (2) a second pad state in which the first and duplicate die bond pads are enabled for use with the package contacts.

公开(公告)号：US11107795B2

公开(公告)日：2021-08-31

申请号：US16455590

申请日：2019-06-27

Applicant: Micron Technology, Inc.

Inventor： Nathan J. Sirocka ,  Trismardawi Tanadi ,  Andrew D. Proescholdt

IPC: H01L25/065 ,  H01L25/00

Abstract: Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture are disclosed herein. In one embodiment, a semiconductor device package includes a plurality of package contacts and a semiconductor die having a plurality of first die bond pads, a plurality of second die bond pads, and a plurality of duplicate die bond pads having the same pin assignments as the first die bond pads. The semiconductor die further includes an integrated circuit operably coupled to the package contacts via the plurality of first die bond pads and either the second die bond pads or the duplicate die bond pads, but not both. The integrated circuit is configured to be programmed into one of (1) a first pad state in which the first and second die bond pads are enabled for use with the package contacts and (2) a second pad state in which the first and duplicate die bond pads are enabled for use with the package contacts.

公开(公告)号：US20170336820A1

公开(公告)日：2017-11-23

申请号：US15671960

申请日：2017-08-08

Applicant: Micron Technology, Inc.

Inventor： Trismardawi Tanadi

IPC: G05F1/66 ,  H01L25/10 ,  H03K17/22 ,  H01L25/11 ,  H01L25/065 ,  H03K5/14 ,  H03K5/00 ,  G06F1/26

CPC classification number: G05F1/66 ,  G06F1/26 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/117 ,  H01L2924/0002 ,  H03K5/14 ,  H03K17/223 ,  H03K2005/00234 ,  H01L2924/00

Abstract: An apparatus including semiconductor dies in a stack. The semiconductor dies are configured to power-up in a staggered manner. Methods for powering up an electronic device include detecting a power-up event with the semiconductor dies in the stack, and responsive to the power-up event, powering up a first semiconductor die in the stack at a first time, and powering up a second semiconductor die in the stack at a second time that is different from the first time.

公开(公告)号：US09305905B2

公开(公告)日：2016-04-05

申请号：US14020549

申请日：2013-09-06

Applicant: Micron Technology, Inc.

Inventor： Trismardawi Tanadi

IPC: H03L7/00 ,  H01L25/11 ,  H01L25/10 ,  G06F1/26

CPC classification number: G05F1/66 ,  G06F1/26 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/117 ,  H01L2924/0002 ,  H03K5/14 ,  H03K17/223 ,  H03K2005/00234 ,  H01L2924/00

Abstract: An apparatus including semiconductor dies in a stack. The semiconductor dies are configured to power-up in a staggered manner. Methods for powering up an electronic device include detecting a power-up event with the semiconductor dies in the stack, and responsive to the power-up event, powering up a first semiconductor die in the stack at a first time, and powering up a second semiconductor die in the stack at a second time that is different from the first time.

Abstract translation: 一种包括堆叠中的半导体管芯的设备。 半导体管芯被配置为以交错方式上电。 为电子设备供电的方法包括：利用堆叠中的半导体管芯检测上电事件，并且响应于上电事件，在第一时间对堆叠中的第一半导体管芯供电，并且为第二个电源加电 半导体芯片在第二时间处于与第一次不同的第二时间。

公开(公告)号：US11594522B2

公开(公告)日：2023-02-28

申请号：US17385681

申请日：2021-07-26

Applicant: Micron Technology, Inc.

Inventor： Nathan J. Sirocka ,  Trismardawi Tanadi ,  Andrew D. Proescholdt

IPC: H01L25/065 ,  H01L25/00

Abstract: Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture are disclosed herein. In one embodiment, a semiconductor device package includes a plurality of package contacts and a semiconductor die having a plurality of first die bond pads, a plurality of second die bond pads, and a plurality of duplicate die bond pads having the same pin assignments as the first die bond pads. The semiconductor die further includes an integrated circuit operably coupled to the package contacts via the plurality of first die bond pads and either the second die bond pads or the duplicate die bond pads, but not both. The integrated circuit is configured to be programmed into one of (1) a first pad state in which the first and second die bond pads are enabled for use with the package contacts and (2) a second pad state in which the first and duplicate die bond pads are enabled for use with the package contacts.

公开(公告)号：US20210351164A1

公开(公告)日：2021-11-11

申请号：US17385681

申请日：2021-07-26

Applicant: Micron Technology, Inc.

Inventor： Nathan J. Sirocka ,  Trismardawi Tanadi ,  Andrew D. Proescholdt

IPC: H01L25/065 ,  H01L25/00

Abstract: Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture are disclosed herein. In one embodiment, a semiconductor device package includes a plurality of package contacts and a semiconductor die having a plurality of first die bond pads, a plurality of second die bond pads, and a plurality of duplicate die bond pads having the same pin assignments as the first die bond pads. The semiconductor die further includes an integrated circuit operably coupled to the package contacts via the plurality of first die bond pads and either the second die bond pads or the duplicate die bond pads, but not both. The integrated circuit is configured to be programmed into one of (1) a first pad state in which the first and second die bond pads are enabled for use with the package contacts and (2) a second pad state in which the first and duplicate die bond pads are enabled for use with the package contacts.

公开(公告)号：US10120404B2

公开(公告)日：2018-11-06

申请号：US15671960

申请日：2017-08-08

Applicant: Micron Technology, Inc.

Inventor： Trismardawi Tanadi

IPC: H03L7/00 ,  G05F1/66 ,  H01L25/10 ,  H03K5/14 ,  H01L25/065 ,  H03K17/22 ,  H01L25/11 ,  G06F1/26 ,  H03K5/00

Abstract: An apparatus including semiconductor dies in a stack. The semiconductor dies are configured to power-up in a staggered manner. Methods for powering up an electronic device include detecting a power-up event with the semiconductor dies in the stack, and responsive to the power-up event, powering up a first semiconductor die in the stack at a first time, and powering up a second semiconductor die in the stack at a second time that is different from the first time.

公开(公告)号：US09875993B2

公开(公告)日：2018-01-23

申请号：US14995925

申请日：2016-01-14

Applicant: Micron Technology, Inc.

Inventor： Nathan J. Sirocka ,  Trismardawi Tanadi ,  Andrew D. Proescholdt

IPC: H01L25/065 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2225/06506 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture are disclosed herein. In one embodiment, a semiconductor device package includes a plurality of package contacts and a semiconductor die having a plurality of first die bond pads, a plurality of second die bond pads, and a plurality of duplicate die bond pads having the same pin assignments as the first die bond pads. The semiconductor die further includes an integrated circuit operably coupled to the package contacts via the plurality of first die bond pads and either the second die bond pads or the duplicate die bond pads, but not both. The integrated circuit is configured to be programmed into one of (1) a first pad state in which the first and second die bond pads are enabled for use with the package contacts and (2) a second pad state in which the first and duplicate die bond pads are enabled for use with the package contacts.