Abstract:
Methods and apparatus for twin chamber processing systems are disclosed, and, in some embodiments, may include a first process chamber and a second process chamber having independent processing volumes and a plurality of shared resources between the first and second process chambers. In some embodiments, the shared resources include at least one of a shared vacuum pump, a shared gas panel, or a shared heat transfer source.
Abstract:
Methods for processing substrates in twin chamber processing systems having first and second process chambers and shared processing resources are provided herein. In some embodiments, a method may include flowing a process gas from a shared gas panel to a processing volume of the first process chamber and to a processing volume of the second process chamber; forming a first plasma in the first processing volume to process the first substrate and a second plasma to process the second substrate; monitoring the first processing volume and the second processing volume to determine if a process endpoint is reached in either volume; and either terminating the first and second plasma simultaneously when a first endpoint is reached; or terminating the first plasma when a first endpoint is reached in the first processing volume while continuing to provide the second plasma in the second processing volume until a second endpoint is reached.
Abstract:
Methods and apparatus for twin chamber processing systems are disclosed, and, in some embodiments, may include a first process chamber having a first vacuum pump to maintain a first operating pressure in a first processing volume selectively isolatable by a first gate valve disposed between the first processing volume and the first vacuum pump; a second process chamber having a second vacuum pump for maintaining a second operating pressure in a second processing volume selectively isolatable by a second gate valve disposed between the second processing volume and the second vacuum pump; and a shared vacuum pump coupled to the first and second processing volumes to reduce a pressure in each processing volume below a critical pressure level, wherein the shared vacuum pump can be selectively isolated from any of the first or second process chambers or the first or second vacuum pumps.
Abstract:
Methods and apparatus for calibrating a plurality of gas flows in a substrate processing system are provided herein. In some embodiments, a substrate processing system may include a cluster tool comprising a first process chamber and a second process chamber coupled to a central vacuum transfer chamber; a first flow controller to provide a process gas to the first process chamber; a second flow controller to provide the process gas to the second process chamber; a mass flow verifier to verify a flow rate from each of the first and second flow controllers; a first conduit to selectively couple the first flow controller to the mass flow verifier; and a second conduit to selectively couple the second flow controller to the mass flow verifier.
Abstract:
Methods and apparatus for gas delivery to a process chamber are provided herein. In some embodiments, an apparatus for processing substrates may include a mass flow controller to provide a desired total fluid flow; a first flow control manifold comprising a first inlet, a first outlet, and a first plurality of orifices selectably coupled therebetween, wherein the first inlet is coupled to the mass flow controller; and a second flow control manifold comprising a second inlet, a second outlet, and a second plurality of orifices selectably coupled therebetween, wherein the second inlet is coupled to the mass flow controller; wherein a desired flow ratio between the first outlet and the second outlet is selectably obtainable when causing the fluid to flow through one or more of the first plurality of orifices of the first manifold and one or more of the second plurality of orifices of the second manifold.
Abstract:
Process chambers having shared resources and methods of use are provided. In some embodiments, substrate processing systems may include a first process chamber having a first substrate support disposed within the first process chamber, wherein the first substrate support has a first heater and a first cooling plate to control a temperature of the first substrate support; a second process chamber having a second substrate support disposed within the second process chamber, wherein the second substrate support has a second heater and a second cooling plate to control a temperature of the second substrate support; and a shared heat transfer fluid source having an outlet to provide a heat transfer fluid to the first cooling plate and the second cooling plate and an inlet to receive the heat transfer fluid from the first cooling plate and the second cooling plate.
Abstract:
Heat sensitive inks are disclosed that reduce kogation in the print heads of thermal ink jet printers. The ink incorporates heat sensitive colorants/sublimation dye solid particles that are larger in size but smaller in quantity than particles that are not heat sensitive at the operating temperature of the heating elements. The smaller particles do not contribute to kogation, whereas the larger colorant particles contribute to kogation if they contact the heating element of the print heads. The smaller particles move more rapidly toward the heating element as the thermally induced bubble collapses and provide a barrier between the heating element and the heat activated or heat sensitive colorants/sublimation dye solids (hereinafter heat sensitive colorants).
Abstract:
A power system for a vehicle may comprise an electric machine attached to an engine of the vehicle. The electric machine may comprise only one stator core; a stator main winding wound on the one stator core; a stator exciter winding wound on the one stator core. The stator main winding and the stator exciter winding may be magnetically independent from one another even though magnetic-field-isolation material is not interposed between the stator main winding and the stator exciter winding.
Abstract:
A multi-sage controlled frequency generator is described that has a low size, weight and cost. The new generator requires an electronic controller that requires only 25% of the total generated power (100%) when the generator shaft speed varies by +/−25% around its synchronous speed. The shaft driving the generator in the direct-drive controlled frequency generator may be moved at a variable speed. The output frequency of the generator may be controlled by electrically controlling the frequency of the first stator stage and by selecting the control frequency, the number of poles, and the number of stages, such that the output of the last stage will be maintained constant at the desired grid frequency.
Abstract:
A controlled frequency generating system (CFG) may be constructed with a main generator and an exciter driven by a common shaft. Excitation power may be provided from the common shaft; as distinct from prior-art systems which may require independent excitation power sources. While controlling the output voltage and frequency of the main generator, the bi-directional controller extracts power from a main generator output and may supply the extracted power to supplement excitation power when needed at certain rotational speeds. The controller may extract power from the exciter when, at other rotational speeds, the exciter produces excess power. The extracted excess power may be delivered to the output of the main generator to maintain a desired level of output power at a desired frequency, irrespective of speed of rotation of the CFG.