公开(公告)号：US20170016985A1

公开(公告)日：2017-01-19

申请号：US15280023

申请日：2016-09-29

申请人： Murata Manufacturing Co., Ltd.

发明人： Koichi TAKIZAWA ,  Yoshiharu YOSHII ,  Yoshiyuki TOKIWA

IPC分类号： G01S13/84

CPC分类号： G01S13/84 ,  G01S13/825 ,  G01S2013/0245

摘要： A measurement apparatus outputs from a first antenna pair transmission signals (St11) and (St12) whose phase difference (Δφ1) changes over time. A target object simultaneously receives the transmission signals (St11) and (St12) from a target-side antenna and returns to the measurement apparatus information (Dφ) according to the positional relationship between the target object and the measurement apparatus determined from a reception signal (Sr1). The measurement apparatus outputs from a second antenna pair transmission signals (St21) and (St22) whose phase difference (Δφ2) changes over time. The target object simultaneously receives the transmission signals (St21) and (St22) from the target-side antenna and returns to the measurement apparatus the information (Dφ) corresponding to the positional relationship between the target object and the measurement apparatus determined from a reception signal (Sr2). The measurement apparatus identifies a direction (θ) of the target object on the basis of these two pieces of information (Dφ).

摘要翻译： 测量装置从相位差（Δφ1）随时间变化的第一天线对传输信号（St11）和（St12）输出。 目标对象同时从目标侧天线接收发送信号（St11）和（St12），并根据从接收信号确定的目标对象与测量装置之间的位置关系返回到测量装置信息（Dφ） Sr1）。 测量装置从相位差（Δφ2）随时间变化的第二天线对传输信号（St21）和（St22）输出。 目标对象同时从目标侧天线接收发送信号（St21）和（St22），并且向测量装置返回与从接收信号确定的目标对象和测量装置之间的位置关系相对应的信息（Dφ） （Sr2）。 测量装置基于这两条信息（Dφ）来识别目标对象的方向（θ）。

公开(公告)号：US20140173862A1

公开(公告)日：2014-06-26

申请号：US14068007

申请日：2013-10-31

申请人： Murata Manufacturing Co., Ltd.

发明人： Hajime KANDO ,  Yoshiharu YOSHII

IPC分类号： H01L41/27

CPC分类号： H01L41/27 ,  G02F1/035 ,  H01L41/187 ,  H01L41/25 ,  H01L41/257 ,  H01L41/312 ,  H01L41/335 ,  H01L41/337 ,  H03H3/02 ,  H03H3/08 ,  H03H2003/021 ,  H03H2003/023 ,  H03H2003/027 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49155

摘要： In a method for manufacturing a composite piezoelectric substrate, a piezoelectric substrate and a supporting substrate are prepared, ions are implanted from a surface of the piezoelectric substrate to form a defective layer at a predetermined depth, impurities adhered to the surface of the piezoelectric substrate in which the defective layer is formed and/or a surface of the supporting substrate are removed to directly expose the constituent atoms of the surfaces and activate the surfaces, the supporting substrate is bonded to the piezoelectric substrate to form a bonded substrate body, the bonded substrate body is separated at the defective layer so that a separation layer between the surface of the piezoelectric substrate and the defective layer is separated from the piezoelectric substrate and bonded to the supporting substrate to form a composite piezoelectric substrate, and the surface of the separation layer of the composite piezoelectric substrate is smoothed.

摘要翻译： 在制造复合压电基板的方法中，制备压电基板和支撑基板，从压电基板的表面注入离子以形成预定深度的缺陷层，附着在压电基板的表面上的杂质 形成有缺陷层和/或支撑基板的表面以直接暴露表面的构成原子并激活表面，支撑基板接合到压电基板以形成键合的基板主体，键合的基板 在缺陷层分离主体，使得压电基板的表面与缺陷层之间的分离层与压电基板分离并结合到支撑基板上以形成复合压电基板，并且分离层的表面 使复合压电基板平滑。

公开(公告)号：US20150084090A1

公开(公告)日：2015-03-26

申请号：US14556404

申请日：2014-12-01

申请人： MURATA MANUFACTURING CO., LTD.

发明人： Masakazu FUKUMITSU ,  Yoshiharu YOSHII

IPC分类号： H01L23/60 ,  H05F3/00 ,  H01L23/48 ,  H01L33/62 ,  H01L23/12

CPC分类号： H01L23/60 ,  H01L23/12 ,  H01L23/48 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/131 ,  H01L2224/16235 ,  H01L2924/0002 ,  H05F3/00 ,  H05K1/0259 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/421 ,  H05K2201/10106 ,  H01L2924/00 ,  H01L2924/014

摘要： External connection conductors are arranged on a back surface of a base material, and wiring conductors are arranged on a front surface. An insulating layer is provided on surfaces of the wiring conductors. Component mounting conductors are provided on a surface of the insulating layer. The component mounting conductor and the wiring conductor are electrically coupled to each other, and the component mounting conductor and the wiring conductor are electrically coupled to each other. The wiring conductor and the external connection conductor are electrically coupled by a conductor film on an inner wall surface of a hole provided between forming areas of the component mounting conductors. The wiring conductor and the external connection conductor are electrically coupled by a conductor film on an inner wall surface of a hole provided between the forming areas of the component mounting conductors.

摘要翻译： 外部连接导体布置在基材的后表面上，并且布线导体布置在前表面上。 绝缘层设置在布线导体的表面上。 元件安装导体设置在绝缘层的表面上。 部件安装导体和布线导体彼此电耦合，并且部件安装导体和布线导体彼此电耦合。 布线导体和外部连接导体通过设置在部件安装导体的形成区域之间的孔的内壁表面上的导体膜电耦合。 布线导体和外部连接导体通过设置在部件安装导体的形成区域之间的孔的内壁表面上的导体膜电耦合。