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公开(公告)号：US07393712B2
公开(公告)日：2008-07-01
申请号：US11350662
申请日：2006-02-08
IPC分类号： H01L21/00
CPC分类号： B81B7/0061
摘要： A method of manufacturing a fluidic MEMS package includes attaching a cover plate with a plurality of openings to a substrate with a plurality of bond rings with breaches such that the cover plate, the substrate and the bond rings define a plurality of respective inner cavities. The cover plate, the substrate and the breaches define a plurality of respective fill ports. The method also includes filling the inner cavities with fluid, sealing the fluid in the inner cavities, and singulating a plurality of MEMS packages from the substrate.
摘要翻译： 一种制造流体MEMS封装的方法包括将具有多个开口的盖板附接到具有多个具有破裂的粘结环的基板上，使得盖板，基板和接合环限定多个相应的内腔。 盖板，基板和破口限定多个相应的填充端口。 该方法还包括用流体填充内腔，密封内腔中的流体，以及从衬底分离多个MEMS封装。
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公开(公告)号：US07436571B2
公开(公告)日：2008-10-14
申请号：US10971637
申请日：2004-10-20
申请人： John R Sterner , Charles C Haluzak , William R Boucher , Scott Lerner , James W. Ring , Brett Dahlgren , Chien-Hua Chen , Arthur Piehl , Quan Qi
发明人： John R Sterner , Charles C Haluzak , William R Boucher , Scott Lerner , James W. Ring , Brett Dahlgren , Chien-Hua Chen , Arthur Piehl , Quan Qi
CPC分类号： G03B21/008 , G03B21/2073
摘要： A micro-display has a device chip with a transparent layer overlying one or more micro-electromechanical system devices. A transparent cover overlies the transparent layer. An index-of-refraction-matching medium is interposed between the transparent layer and the transparent cover. An index of refraction of the index-of-refraction-matching medium is substantially equal to an index of refraction of the transparent layer and the transparent cover.
摘要翻译： 微型显示器具有覆盖一个或多个微机电系统设备的透明层的器件芯片。 透明盖覆盖透明层。 折射率匹配介质夹在透明层和透明罩之间。 折射率匹配介质的折射率基本上等于透明层和透明盖的折射率。
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公开(公告)号：US06917099B2
公开(公告)日：2005-07-12
申请号：US10650572
申请日：2003-08-27
申请人： Ronald A. Hellekson , Chien-Hua Chen , William R Boucher , Joshua W. Smith , David M Craig , Gary J. Watts
发明人： Ronald A. Hellekson , Chien-Hua Chen , William R Boucher , Joshua W. Smith , David M Craig , Gary J. Watts
IPC分类号： B81B7/02 , B81B7/00 , B81C99/00 , H01L23/473 , H01L23/02
CPC分类号： B81B7/0093 , B01L2200/10 , B01L2200/12 , B81B7/0058 , B81B7/0061 , H01L2924/0002 , H01L2924/00
摘要： A die carrier has a body with a primary surface adapted for attachment to a substrate die. The body at least partially defines a fluid chamber. A fill port and an evacuate port are each fluidically connected to the fluid chamber.
摘要翻译： 模具载体具有主体，该主体具有适于附接到基底模具的主表面。 主体至少部分地限定流体室。 填充口和排出口各自流体连接到流体室。
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公开(公告)号：US06641254B1
公开(公告)日：2003-11-04
申请号：US10121394
申请日：2002-04-12
IPC分类号： B41J216
CPC分类号： H01L23/3185 , B41J2/14072 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/05073 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05664 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48664 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48764 , H01L2224/85207 , H01L2224/8592 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01045 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07811 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： An electronic device includes a substrate, a substrate electrical connector disposed on the substrate, and a carrier lead electrically coupled to the substrate electrical connector. In addition, the electronic device further includes a polymer enclosing the substrate electrical connector, and an inorganic film disposed over the substrate electrical connector in contact with the polymer.
摘要翻译： 电子设备包括基板，设置在基板上的基板电连接器以及电耦合到基板电连接器的载体引线。 另外，电子装置还包括封装基板电连接器的聚合物和设置在与聚合物接触的基板电连接器上的无机膜。
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