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公开(公告)号：US5239156A
公开(公告)日：1993-08-24
申请号：US766947
申请日：1991-09-27
CPC分类号： B23K1/0053 , H01L39/02 , Y10S505/925 , Y10S505/927
摘要： Two Nb.sub.3 Sn superconducting tapes are overlapped by an amount equal to about two times the width of the superconducting tapes. A filler material of material substantially similar to the tapes is placed between the two tapes in the overlapped region. A NdYAG laser (4) sends a 20-40 watt beam focused by a lens that heats the tapes to create a bridge of superconductivity material formed over the region where the tapes are joined.
摘要翻译： 两个Nb3Sn超导带的重叠量超过超导带的宽度的两倍。 基本上类似于带的材料的填充材料被放置在重叠区域中的两个带之间。 NdYAG激光器（4）发送由透镜聚焦的20-40瓦的光束，该透镜加热带以在带被连接的区域上形成超导材料桥。
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公开(公告)号：US5121869A
公开(公告)日：1992-06-16
申请号：US767448
申请日：1991-09-30
CPC分类号： H01L39/2409 , B23K1/16
摘要： An apparatus for solder joining metal tapes to form laminated metal tapes comprises an alignment box having a base and a sidewall means extending therefrom to define a tapered inner channel extending through the box. The tapered channel having an entrance end and narrowing to an exit end. At least one tapered wall extending from the base and within the inner channel to define subchannels that are spaced at the entrance end and converge into the inner channel before the exit end. The sidewall means and tapered wall extending from the base to respective wall tops, and a cover extending over the channel and subchannels is mounted on the wall tops. The base, sidewalls, inner wall, and cover being configured to form the channel and subchannels to have a first preselected distance between the base and cover that is greater than the width of the tapes. A second preselected distance between oppositely facing walls bordering the subchannels that is greater than the thickness of the tapes, and a third preselected distance between oppositely facing walls at the exit end that is greater than the thickness of the laminated tapes. A solder duct means mounted on the box for directing molten solder into the inner channel to flow from the exit end to the entrance end. The solder duct means having a slot extending therethrough and aligned with the exit end. A seal means mounted on the solder duct means adjacent the slot for minimizing solder escaping from the slot while solder coated tapes pass therefrom, and a wiper means mounted on the solder duct means and positioned from the seal means removes excess solder from tapes passing through the seal means.
摘要翻译： 用于焊接金属带以形成层压金属带的装置包括具有基座和从其延伸的侧壁装置的对准盒，以限定延伸穿过箱体的锥形内部通道。 锥形通道具有入口端并变窄到出口端。 至少一个锥形壁，其从底部延伸并且在内部通道内，以限定在入口端处间隔开并在出口端之前会聚到内部通道中的子通道。 侧壁装置和锥形壁从基座延伸到相应的壁顶，并且在通道和子通道上延伸的盖安装在壁顶上。 基座，侧壁，内壁和盖被构造成形成通道和子通道，以使得基座和盖之间的第一预选距离大于带的宽度。 邻近子通道的相对面对的墙壁之间的第二个预选距离大于带子的厚度，以及在出口端处相对面对的壁之间的第三个预选距离大于层压带的厚度。 安装在盒子上的焊接管道装置，用于将熔融焊料引导到内部通道中以从出口端流到入口端。 焊料管道装置具有延伸穿过其并与出口端对齐的槽。 密封装置安装在邻近槽的焊料管道装置上，用于使焊料从槽中逸出而最小化，同时焊接涂覆的带从其中通过，并且安装在焊料管道装置上并从密封装置定位的擦拭装置从穿过 密封方式。
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3.发明授权
公开(公告)号：US5109593A
公开(公告)日：1992-05-05
申请号：US561438
申请日：1990-08-01
CPC分类号： H01L39/02 , Y10S505/925 , Y10S505/927 , Y10T29/49014 , Y10T29/49201
摘要： Superconducting tapes having an inner laminate comprised of a parent-metal layer, a superconductive alloy layer on the parent-metal, a reactive-metal layer, and an outer laminate soldered thereon are joined in a superconducting joint by the method of this invention. The outer laminate is removed to form exposed sections, and the tapes are positioned so that the exposed sections are in contact. A melt zone within the exposed sections where the exposed sections are in contact is melted. The melt zone is at least large enough to provide sufficient parent-metal, superconductive alloy, and reactive-metal to form a melt that resolidifies as a continuous precipitate of the superconductive alloy. The melt resolidifies as a continuous precipitate of the superconductive alloy that is continuous with the superconductive alloy on the superconducting tape. Optionally, sections of the outer laminate material corresponding to the size of the exposed sections are bonded to the outermost surfaces of the joined exposed sections.
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公开(公告)号：US5176742A
公开(公告)日：1993-01-05
申请号：US767452
申请日：1991-09-30
CPC分类号： B23K1/085 , B23K35/26 , C22B9/023 , Y02P10/234
摘要： An apparatus for filtering a molten solder bath comprises, a housing having an entrance end and an exit end enclosing a channel means extending from the entrance end to a filter means adjacent the exit end. The channel means being configured for receiving molten solder at the entrance end and directing the solder to the filter means in a turbulent flow. The filter means being configured to filter particles from the flow and direct the filtered flow to the exit end. A cooling means is positioned on the housing for cooling solder flowing through the channel means without reacting with the solder. A method for filtering a molten solder bath comprises, directing solder from the bath in a turbulent flow and cooling the flow to form a precipitate of an impurity in the molten solder. The cooled flow is filtered to remove particles and form a high-purity solder, and the high-purity solder is returned to the bath. Preferably, the molten solder is protected by an inert atmosphere that does not react with the solder.
摘要翻译： 用于过滤熔融焊料浴的设备包括：壳体，其具有入口端和封闭从入口端延伸到靠近出口端的过滤器装置的通道装置的出口端。 通道装置被配置为在入口端处接收熔融焊料并且以湍流将焊料引导到过滤器装置。 过滤装置被配置为从流中过滤颗粒并将过滤的流引导到出口端。 冷却装置位于壳体上，用于冷却流过通道装置的焊剂，而不与焊料反应。 用于过滤熔融焊料浴的方法包括：以湍流方式从焊锡引导焊料并冷却流动以在熔融焊料中形成杂质沉淀物。 将冷却的流过滤以除去颗粒并形成高纯度焊料，并将高纯度焊料返回到熔池中。 优选地，熔融焊料由不与焊料反应的惰性气氛保护。
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公开(公告)号：US5169128A
公开(公告)日：1992-12-08
申请号：US880430
申请日：1992-05-08
CPC分类号： C22B9/023 , B23K1/085 , B23K35/26 , Y02P10/234
摘要： An apparatus for filtering a molten solder bath comprises, a housing having an entrance end and an exit end enclosing a chanel means extending from the entrance end to a filter means adjacent the exit end. The channel means being configured for receiving molten solder at the entrance end and directing the solder to the filter means in a turbulent flow. The filter means being configured to filter particles from the flow and direct the filtered flow to the exit end. A cooling means is positioned on the housing for cooling solder flowing through the channel means without reacting with the solder. A method for filtering a molten solder bath comprises, directing solder from the bath in a turbulent flow and cooling the flow to form a precipitate of an impurity in the molten solder. The cooled flow is filtered to remove particles and form a high-purity solder, and the high-purity solder is returned to the bath. Preferably, the molten solder is protected by an inert atmosphere that does not react with the solder.
摘要翻译： 用于过滤熔融焊料浴的设备包括：壳体，其具有入口端和出口端，所述出口端包围从入口端延伸到靠近出口端的过滤器装置的香烟装置。 通道装置被配置为在入口端处接收熔融焊料并且以湍流将焊料引导到过滤器装置。 过滤装置被配置为从流中过滤颗粒并将过滤的流引导到出口端。 冷却装置位于壳体上，用于冷却流过通道装置的焊剂，而不与焊料反应。 用于过滤熔融焊料浴的方法包括：以湍流方式从焊锡引导焊料并冷却流动以在熔融焊料中形成杂质沉淀物。 将冷却的流过滤以除去颗粒并形成高纯度焊料，并将高纯度焊料返回到熔池中。 优选地，熔融焊料由不与焊料反应的惰性气氛保护。
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公开(公告)号：US5134040A
公开(公告)日：1992-07-28
申请号：US732892
申请日：1991-07-19
IPC分类号： H01L39/02
CPC分类号： H01L39/02 , Y10S428/93 , Y10S505/927 , Y10T428/12708 , Y10T428/12819
摘要： Superconducting tapes have an inner laminate comprised of a parent-metal layer selected from the group niobium, tantalum, technetium, and vanadium, a superconductive intermetallic compound layer on the parent-metal layer, and a reactive-metal layer that is capable of combining with the parent-metal and forming the superconductive intermetallic compound. A superconducting joint between contiguous tapes comprises, a continuous precipitate of the superconductive intermetallic compound fused to the tapes forming a continuous superconducting path between the tapes.
摘要翻译： 超导带具有由选自铌，钽，锝和钒的母体金属层，母金属层上的超导金属间化合物层和反应性金属层组成的内层叠体，其能够与 母金属并形成超导金属间化合物。 连续带之间的超导接头包括与形成在带之间的连续超导路径的带的熔融的超导金属间化合物的连续沉淀物。
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公开(公告)号：US5082164A
公开(公告)日：1992-01-21
申请号：US561439
申请日：1990-08-01
申请人： Lee E. Rumaner , Mark G. Benz , Bruce A. Knudsen
发明人： Lee E. Rumaner , Mark G. Benz , Bruce A. Knudsen
CPC分类号： H01L39/02 , H01R43/02 , Y10S505/925 , Y10S505/927 , Y10T29/49194 , Y10T29/49201
摘要： Superconducting tapes having an inner laminate comprised of a parent-metal layer, a superconductive alloy layer on the parent-metal, a reactive-metal layer, and an outer laminate soldered thereon are joined in a superconducting joint by the method of this invention. The outer laminate, reactive-metal layer, and superconductive alloy layer are removed to form exposed sections of the parent metal layer. The tapes are positioned so that the exposed sections are in contact. Metallurgical bonding, for example by spot welding, forms bridges between the parent-metal layers. The joined exposed sections are heated in a protective atmosphere, and in the presence of excess reactive metal to form a continuous layer of the superconductive alloy on the bridge and the exposed areas that is continuous with the superconductive alloy layer on the superconducting tape. Optionally, sections of the outer laminate material corresponding to the size of the exposed sections are bonded to the outermost surfaces of the joined exposed sections.
摘要翻译： 具有由母金属层，母金属上的超导合金层，反应性金属层和焊接在其上的外层叠体构成的内层叠体的超导带通过本发明的方法接合在超导接头中。 去除外部层压体，反应性金属层和超导合金层以形成母体金属层的暴露部分。 这些带被定位成使得暴露部分接触。 冶金结合，例如通过点焊，在母金属层之间形成桥。 接合的暴露部分在保护气氛中并且在过量的反应性金属的存在下加热，以在桥上形成超导合金的连续层，并且与超导带上的超导合金层连续的暴露区域。 可选地，对应于暴露部分的尺寸的外层压材料的部分被结合到接合的暴露部分的最外表面。
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公开(公告)号：US5156317A
公开(公告)日：1992-10-20
申请号：US856425
申请日：1992-03-23
申请人： Robert J. Zabala , Bruce A. Knudsen , Mark G. Benz
发明人： Robert J. Zabala , Bruce A. Knudsen , Mark G. Benz
IPC分类号： B23K1/00 , B23K1/08 , B23K1/16 , B23K1/19 , B23K3/06 , B23K103/16 , B32B15/01 , C23C2/08 , C23C2/10 , H01B12/06 , H01B13/00 , H01L39/24
CPC分类号： B23K1/16 , H01L39/2409
摘要： An apparatus for solder joining metal tapes to form laminated metal tapes comprises a channel means having a base, and sidewall means extending therefrom to a cover extending over the sidewall means. The sidewall means define converging channels having an entrance end for admitting the tapes spaced apart, and an exit end where facing tape surfaces can come into contact. The sidewall means separate the base and cover by a distance selected to align the tapes in the width dimension. The cover having a first section extending from the exit end, and a second section extending from the first section to the entrance end, the second section being formed with a cavity facing the channel that permits a solder flow therethrough that minimizes accumulation of particles in the channels. A solder duct means mounted on the channel means for directing molten solder into the channels to flow from the exit end to the entrance end. The solder duct means having a slot extending therethrough and aligned with the exit end. A seal means mounted on the solder duct means adjacent the slot for minimizing solder escaping from the slot while solder coated tapes pass therefrom, and a wiper means mounted on the solder duct means and positioned from the seal means removes exess solder from tapes passing through the seal means.
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公开(公告)号：US5472936A
公开(公告)日：1995-12-05
申请号：US270629
申请日：1994-07-05
申请人： Mark G. Benz , Neil A. Johnson , Melissa L. Murray , Robert J. Zabala , Louis E. Hibbs, Jr. , Bruce A. Knudsen
发明人： Mark G. Benz , Neil A. Johnson , Melissa L. Murray , Robert J. Zabala , Louis E. Hibbs, Jr. , Bruce A. Knudsen
CPC分类号： H01L39/2409 , Y10S505/813 , Y10S505/818 , Y10S505/821
摘要： A method for making triniobium tin foil is disclosed where the niobium-based foil with an oxide layer is passed continuously at a set speed into an enclosed chamber. The enclosed chamber has an inert atmosphere which is substantially oxygen free. Upon entering the chamber, the foil passes through a decomposition anneal furnace, a low temperature tin dip, and then a high temperature reaction anneal furnace before exiting the chamber as triniobium tin foil.
摘要翻译： 公开了一种制造铌锡箔的方法，其中具有氧化物层的铌基箔以设定的速度连续地进入封闭的室。 封闭的室具有基本上无氧的惰性气氛。 当进入室时，箔片通过分解退火炉，低温锡浸渍，然后通过高温反应退火炉，然后作为三铌锡箔离开室。
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公开(公告)号：US5505790A
公开(公告)日：1996-04-09
申请号：US303803
申请日：1994-09-09
申请人： Mark G. Benz , Howard R. Hart, Jr. , Melissa L. Murray , Robert J. Zabala , Bruce A. Knudsen , Thomas R. Raber
发明人： Mark G. Benz , Howard R. Hart, Jr. , Melissa L. Murray , Robert J. Zabala , Bruce A. Knudsen , Thomas R. Raber
CPC分类号： H01L39/14 , Y10S505/918 , Y10S505/927
摘要： A method is described which increases the critical current of triniobium tin by bonding thermal contraction control layers to the triniobium tin superconducting articles at a process temperature to form a composite, and subsequently cooling the composite to a test temperature.
摘要翻译： 描述了一种方法，其通过在热处理温度下将热收缩控制层粘合到三铌锡超导制品上来增加三铌锡的临界电流，以形成复合材料，随后将复合材料冷却至测试温度。
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