Apparatus for solder joining metal tapes with improved cover
    2.
    发明授权
    Apparatus for solder joining metal tapes with improved cover 失效
    用于焊接金属带的改进盖的装置

    公开(公告)号:US5156317A

    公开(公告)日:1992-10-20

    申请号:US856425

    申请日:1992-03-23

    CPC分类号: B23K1/16 H01L39/2409

    摘要: An apparatus for solder joining metal tapes to form laminated metal tapes comprises a channel means having a base, and sidewall means extending therefrom to a cover extending over the sidewall means. The sidewall means define converging channels having an entrance end for admitting the tapes spaced apart, and an exit end where facing tape surfaces can come into contact. The sidewall means separate the base and cover by a distance selected to align the tapes in the width dimension. The cover having a first section extending from the exit end, and a second section extending from the first section to the entrance end, the second section being formed with a cavity facing the channel that permits a solder flow therethrough that minimizes accumulation of particles in the channels. A solder duct means mounted on the channel means for directing molten solder into the channels to flow from the exit end to the entrance end. The solder duct means having a slot extending therethrough and aligned with the exit end. A seal means mounted on the solder duct means adjacent the slot for minimizing solder escaping from the slot while solder coated tapes pass therefrom, and a wiper means mounted on the solder duct means and positioned from the seal means removes exess solder from tapes passing through the seal means.

    Method of melt forming a superconducting joint between superconducting
tapes
    3.
    发明授权
    Method of melt forming a superconducting joint between superconducting tapes 失效
    在超级磁带之间形成超导体接头的熔融方法

    公开(公告)号:US5109593A

    公开(公告)日:1992-05-05

    申请号:US561438

    申请日:1990-08-01

    IPC分类号: H01R43/00 H01L39/02 H01R43/02

    摘要: Superconducting tapes having an inner laminate comprised of a parent-metal layer, a superconductive alloy layer on the parent-metal, a reactive-metal layer, and an outer laminate soldered thereon are joined in a superconducting joint by the method of this invention. The outer laminate is removed to form exposed sections, and the tapes are positioned so that the exposed sections are in contact. A melt zone within the exposed sections where the exposed sections are in contact is melted. The melt zone is at least large enough to provide sufficient parent-metal, superconductive alloy, and reactive-metal to form a melt that resolidifies as a continuous precipitate of the superconductive alloy. The melt resolidifies as a continuous precipitate of the superconductive alloy that is continuous with the superconductive alloy on the superconducting tape. Optionally, sections of the outer laminate material corresponding to the size of the exposed sections are bonded to the outermost surfaces of the joined exposed sections.

    Apparatus for solder joining metal tapes
    5.
    发明授权
    Apparatus for solder joining metal tapes 失效
    用于焊接金属带的装置

    公开(公告)号:US5121869A

    公开(公告)日:1992-06-16

    申请号:US767448

    申请日:1991-09-30

    IPC分类号: B23K1/16 H01L39/24

    CPC分类号: H01L39/2409 B23K1/16

    摘要: An apparatus for solder joining metal tapes to form laminated metal tapes comprises an alignment box having a base and a sidewall means extending therefrom to define a tapered inner channel extending through the box. The tapered channel having an entrance end and narrowing to an exit end. At least one tapered wall extending from the base and within the inner channel to define subchannels that are spaced at the entrance end and converge into the inner channel before the exit end. The sidewall means and tapered wall extending from the base to respective wall tops, and a cover extending over the channel and subchannels is mounted on the wall tops. The base, sidewalls, inner wall, and cover being configured to form the channel and subchannels to have a first preselected distance between the base and cover that is greater than the width of the tapes. A second preselected distance between oppositely facing walls bordering the subchannels that is greater than the thickness of the tapes, and a third preselected distance between oppositely facing walls at the exit end that is greater than the thickness of the laminated tapes. A solder duct means mounted on the box for directing molten solder into the inner channel to flow from the exit end to the entrance end. The solder duct means having a slot extending therethrough and aligned with the exit end. A seal means mounted on the solder duct means adjacent the slot for minimizing solder escaping from the slot while solder coated tapes pass therefrom, and a wiper means mounted on the solder duct means and positioned from the seal means removes excess solder from tapes passing through the seal means.

    摘要翻译: 用于焊接金属带以形成层压金属带的装置包括具有基座和从其延伸的侧壁装置的对准盒,以限定延伸穿过箱体的锥形内部通道。 锥形通道具有入口端并变窄到出口端。 至少一个锥形壁,其从底部延伸并且在内部通道内,以限定在入口端处间隔开并在出口端之前会聚到内部通道中的子通道。 侧壁装置和锥形壁从基座延伸到相应的壁顶,并且在通道和子通道上延伸的盖安装在壁顶上。 基座,侧壁,内壁和盖被构造成形成通道和子通道,以使得基座和盖之间的第一预选距离大于带的宽度。 邻近子通道的相对面对的墙壁之间的第二个预选距离大于带子的厚度,以及在出口端处相对面对的壁之间的第三个预选距离大于层压带的厚度。 安装在盒子上的焊接管道装置,用于将熔融焊料引导到内部通道中以从出口端流到入口端。 焊料管道装置具有延伸穿过其并与出口端对齐的槽。 密封装置安装在邻近槽的焊料管道装置上,用于使焊料从槽中逸出而最小化,同时焊接涂覆的带从其中通过,并且安装在焊料管道装置上并从密封装置定位的擦拭装置从穿过 密封方式。

    Method for filtering a molten solder bath
    7.
    发明授权
    Method for filtering a molten solder bath 失效
    过滤熔融焊料浴的方法

    公开(公告)号:US5176742A

    公开(公告)日:1993-01-05

    申请号:US767452

    申请日:1991-09-30

    IPC分类号: B23K1/08 B23K35/26 C22B9/02

    摘要: An apparatus for filtering a molten solder bath comprises, a housing having an entrance end and an exit end enclosing a channel means extending from the entrance end to a filter means adjacent the exit end. The channel means being configured for receiving molten solder at the entrance end and directing the solder to the filter means in a turbulent flow. The filter means being configured to filter particles from the flow and direct the filtered flow to the exit end. A cooling means is positioned on the housing for cooling solder flowing through the channel means without reacting with the solder. A method for filtering a molten solder bath comprises, directing solder from the bath in a turbulent flow and cooling the flow to form a precipitate of an impurity in the molten solder. The cooled flow is filtered to remove particles and form a high-purity solder, and the high-purity solder is returned to the bath. Preferably, the molten solder is protected by an inert atmosphere that does not react with the solder.

    摘要翻译: 用于过滤熔融焊料浴的设备包括:壳体,其具有入口端和封闭从入口端延伸到靠近出口端的过滤器装置的通道装置的出口端。 通道装置被配置为在入口端处接收熔融焊料并且以湍流将焊料引导到过滤器装置。 过滤装置被配置为从流中过滤颗粒并将过滤的流引导到出口端。 冷却装置位于壳体上,用于冷却流过通道装置的焊剂,而不与焊料反应。 用于过滤熔融焊料浴的方法包括:以湍流方式从焊锡引导焊料并冷却流动以在熔融焊料中形成杂质沉淀物。 将冷却的流过滤以除去颗粒并形成高纯度焊料,并将高纯度焊料返回到熔池中。 优选地,熔融焊料由不与焊料反应的惰性气氛保护。

    Molten solder filter
    8.
    发明授权
    Molten solder filter 失效
    熔融焊料过滤器

    公开(公告)号:US5169128A

    公开(公告)日:1992-12-08

    申请号:US880430

    申请日:1992-05-08

    IPC分类号: B23K1/08 B23K35/26 C22B9/02

    摘要: An apparatus for filtering a molten solder bath comprises, a housing having an entrance end and an exit end enclosing a chanel means extending from the entrance end to a filter means adjacent the exit end. The channel means being configured for receiving molten solder at the entrance end and directing the solder to the filter means in a turbulent flow. The filter means being configured to filter particles from the flow and direct the filtered flow to the exit end. A cooling means is positioned on the housing for cooling solder flowing through the channel means without reacting with the solder. A method for filtering a molten solder bath comprises, directing solder from the bath in a turbulent flow and cooling the flow to form a precipitate of an impurity in the molten solder. The cooled flow is filtered to remove particles and form a high-purity solder, and the high-purity solder is returned to the bath. Preferably, the molten solder is protected by an inert atmosphere that does not react with the solder.

    摘要翻译: 用于过滤熔融焊料浴的设备包括:壳体,其具有入口端和出口端,所述出口端包围从入口端延伸到靠近出口端的过滤器装置的香烟装置。 通道装置被配置为在入口端处接收熔融焊料并且以湍流将焊料引导到过滤器装置。 过滤装置被配置为从流中过滤颗粒并将过滤的流引导到出口端。 冷却装置位于壳体上,用于冷却流过通道装置的焊剂,而不与焊料反应。 用于过滤熔融焊料浴的方法包括:以湍流方式从焊锡引导焊料并冷却流动以在熔融焊料中形成杂质沉淀物。 将冷却的流过滤以除去颗粒并形成高纯度焊料,并将高纯度焊料返回到熔池中。 优选地,熔融焊料由不与焊料反应的惰性气氛保护。

    Melt formed superconducting joint between superconducting tapes
    9.
    发明授权
    Melt formed superconducting joint between superconducting tapes 失效
    熔体在超导磁带之间形成超导接头

    公开(公告)号:US5134040A

    公开(公告)日:1992-07-28

    申请号:US732892

    申请日:1991-07-19

    IPC分类号: H01L39/02

    摘要: Superconducting tapes have an inner laminate comprised of a parent-metal layer selected from the group niobium, tantalum, technetium, and vanadium, a superconductive intermetallic compound layer on the parent-metal layer, and a reactive-metal layer that is capable of combining with the parent-metal and forming the superconductive intermetallic compound. A superconducting joint between contiguous tapes comprises, a continuous precipitate of the superconductive intermetallic compound fused to the tapes forming a continuous superconducting path between the tapes.

    摘要翻译: 超导带具有由选自铌,钽,锝和钒的母体金属层,母金属层上的超导金属间化合物层和反应性金属层组成的内层叠体,其能够与 母金属并形成超导金属间化合物。 连续带之间的超导接头包括与形成在带之间的连续超导路径的带的熔融的超导金属间化合物的连续沉淀物。

    Strippable mask patterning of stop-off for diffusion bond processing
    10.
    发明授权
    Strippable mask patterning of stop-off for diffusion bond processing 失效
    可剥离掩模图案化用于扩散键合处理

    公开(公告)号:US5513791A

    公开(公告)日:1996-05-07

    申请号:US218925

    申请日:1994-03-28

    IPC分类号: B23K1/20 B23K20/18 H05K3/34

    CPC分类号: B23K1/20 B23K20/18

    摘要: An improved method for forming fluid inflatable metal structures is taught. The improvement concerns the patterning of the portion of the structure to be inflated. Patterning is accomplished by first applying a strippable flexible mask coating and then scoring this coating so that a patterned portion may be removed therefrom. The parent portion is the portion of the sheet article to be inflated by subsequent processing. After the patterned portion has been removed, a stop-off is applied to the exposed surface of the first sheet. After the stop-off material has been applied, the remainder of the strippable mask is removed and washed with a detergent to remove the residue from the mask. The sheet having stop-off applied in the pattern to the first sheet is then superposed over a second sheet, and heat and pressure are applied to cause diffusion bonding between the exposed surfaces of the two sheets. Following this bonding, the portion of the sheet carrying the stop-off is inflated to give the article its final configuration.

    摘要翻译: 教导了一种用于形成流体充气金属结构的改进方法。 改进涉及要膨胀的结构的部分的图案化。 通过首先施加可剥离的柔性掩模涂层,然后对该涂层进行刻痕,从而从其中去除图案化部分,来实现图案化。 母体部分是通过后续处理来膨胀的片材制品的部分。 在图案化部分被去除之后,将停止施加到第一片材的暴露表面。 在施加停止材料之后,除去剩余的可剥离掩模并用洗涤剂洗涤以从掩模中除去残余物。 然后将以图案形式停止的第一片材​​的片材叠加在第二片材上,并且施加热和压力以引起两片材的暴露表面之间的扩散接合。 在该接合之后,承载停止的片材的部分被充气以使制品成为其最终构型。