公开(公告)号：US20060035450A1

公开(公告)日：2006-02-16

申请号：US10917055

申请日：2004-08-12

申请人： Martin Frank ,  Alexander Reznicek ,  Evgeni Gousev ,  Eduard Cartier

发明人： Martin Frank ,  Alexander Reznicek ,  Evgeni Gousev ,  Eduard Cartier

IPC分类号： H01L21/3205 ,  H01L21/4763

CPC分类号： H01L29/495 ,  H01L21/76254 ,  H01L21/823828 ,  H01L29/517

摘要： A method of forming a gate stack for semiconductor electronic devices utilizing wafer bonding of at least one structure containing a high-k dielectric material is provided. The method of the present invention includes a step of first selecting a first and second structure having a major surface respectively. In accordance with the present invention, at least one, or both, of the first and second structures includes at least a high-k dielectric material. Next, the major surfaces of the first and second structures are bonded together to provide a bonded structure containing at least the high-k dielectric material of a gate stack.

摘要翻译： 提供了一种利用至少一种包含高介电材料的结构的晶片接合形成用于半导体电子器件的栅叠层的方法。 本发明的方法包括分别首先选择具有主表面的第一和第二结构的步骤。 根据本发明，第一和第二结构中的至少一个或两者包括至少一个高k电介质材料。 接下来，将第一和第二结构的主表面结合在一起，以提供至少包含栅叠层的高k电介质材料的键合结构。

公开(公告)号：US20070090471A1

公开(公告)日：2007-04-26

申请号：US11259644

申请日：2005-10-26

申请人： Eduard Cartier ,  Mathew Copel ,  Martin Frank ,  Evgeni Gousev ,  Paul Jamison ,  Rajarao Jammy ,  Barry Linder ,  Vijay Narayanan

发明人： Eduard Cartier ,  Mathew Copel ,  Martin Frank ,  Evgeni Gousev ,  Paul Jamison ,  Rajarao Jammy ,  Barry Linder ,  Vijay Narayanan

IPC分类号： H01L29/94 ,  H01L21/8238

CPC分类号： H01L29/513 ,  H01L21/28194 ,  H01L21/28238 ,  H01L21/823807 ,  H01L29/105 ,  H01L29/1083 ,  H01L29/517 ,  H01L29/518 ,  H01L29/6659 ,  H01L29/7833

摘要： A semiconductor structure, particularly a pFET, which includes a dielectric material that has a dielectric constant of greater than that of SiO2 and a Ge or Si content of greater than 50% and at least one other means for threshold/flatband voltage tuning by material stack engineering is provided. The other means contemplated in the present invention include, for example, utilizing an insulating interlayer atop the dielectric for charge fixing and/or by forming an engineered channel region. The present invention also relates to a method of fabricating such a CMOS structure.

摘要翻译： 一种半导体结构，特别是pFET，其包括介电常数大于SiO 2的介电常数和大于50％的Ge或Si含量的至少一种其它装置， 提供材料堆栈工程的阈值/平带电压调谐。 本发明中考虑的其它方法包括例如在用于电荷固定的电介质的顶部和/或通过形成工程化的沟道区域之间使用绝缘夹层。 本发明还涉及一种制造这种CMOS结构的方法。

公开(公告)号：US20050258491A1

公开(公告)日：2005-11-24

申请号：US10845719

申请日：2004-05-14

申请人： Nestor Bojarczuk ,  Eduard Cartier ,  Martin Frank ,  Evgeni Gousev ,  Supratik Guha ,  Vijay Narayanan

发明人： Nestor Bojarczuk ,  Eduard Cartier ,  Martin Frank ,  Evgeni Gousev ,  Supratik Guha ,  Vijay Narayanan

IPC分类号： H01L21/8234 ,  H01L21/28 ,  H01L21/8238 ,  H01L27/088 ,  H01L27/092 ,  H01L29/49 ,  H01L29/51 ,  H01L29/76 ,  H01L29/78 ,  H01L29/786 ,  H01L51/00 ,  H01L51/05

CPC分类号： H01L21/28202 ,  H01L21/28194 ,  H01L21/823857 ,  H01L29/4916 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518

摘要： An insulating interlayer for use in complementary metal oxide semiconductor (CMOS) that prevents unwanted shifts in threshold voltage and flatband voltage is provided. The insulating interlayer is located between a gate dielectric having a dielectric constant of greater than 4.0 and a Si-containing gate conductor. The insulating interlayer of the present invention is any metal nitride, that optionally may include oxygen, that is capable of stabilizing the threshold and flatband voltages. In a preferred embodiment, the insulating interlayer is aluminum nitride or aluminum oxynitride and the gate dielectric is hafnium oxide, hafnium silicate or hafnium silicon oxynitride. The present invention is particularly useful in stabilizing the threshold and flatband voltage of p-type field effect transistors.

摘要翻译： 提供了用于防止阈值电压和平带电压的不期望的偏移的互补金属氧化物半导体（CMOS）中的绝缘夹层。 绝缘中间层位于介电常数大于4.0的栅极电介质和含Si的栅极导体之间​​。 本发明的绝缘中间层是能够稳定阈值和平带电压的任何金属氮化物，其可任选地包括氧。 在优选实施例中，绝缘中间层为氮化铝或氮氧化铝，栅极电介质为氧化铪，硅酸铪或铪硅氮氧化物。 本发明在稳定p型场效应晶体管的阈值和平带电压方面特别有用。

公开(公告)号：US20060275977A1

公开(公告)日：2006-12-07

申请号：US11500254

申请日：2006-08-07

申请人： Nestor Bojarczuk ,  Cyril Cabral ,  Eduard Cartier ,  Matthew Copel ,  Martin Frank ,  Evgeni Gousev ,  Supratik Guha ,  Rajarao Jammy ,  Vijay Narayanan ,  Vamsi Paruchuri

发明人： Nestor Bojarczuk ,  Cyril Cabral ,  Eduard Cartier ,  Matthew Copel ,  Martin Frank ,  Evgeni Gousev ,  Supratik Guha ,  Rajarao Jammy ,  Vijay Narayanan ,  Vamsi Paruchuri

IPC分类号： H01L21/8238

CPC分类号： H01L29/513 ,  H01L21/28079 ,  H01L21/28088 ,  H01L21/823857 ,  H01L29/495 ,  H01L29/4966 ,  H01L29/517

摘要： A method of forming a CMOS structure, and the device produced therefrom, having improved threshold voltage and flatband voltage stability. The inventive method includes the steps of providing a semiconductor substrate having an nFET region and a pFET region; forming a dielectric stack atop the semiconductor substrate comprising an insulating interlayer atop a high k dielectric; removing the insulating interlayer from the nFET region without removing the insulating interlayer from the pFET region; and providing at least one gate stack in the pFET region and at least one gate stack in the nFET region. The insulating interlayer can be AlN or AlOxNy. The high k dielectric can be HfO2, hafnium silicate or hafnium silicon oxynitride. The insulating interlayer can be removed from the nFET region by a wet etch including a HCl/H2O2 peroxide solution.

公开(公告)号：US20050269635A1

公开(公告)日：2005-12-08

申请号：US10957342

申请日：2004-10-01

申请人： Nestor Bojarczuk ,  Cyril Cabral ,  Eduard Cartier ,  Matthew Copel ,  Martin Frank ,  Evgeni Gousev ,  Supratik Guha ,  Rajarao Jammy ,  Vijay Narayanan ,  Vamsi Paruchuri

发明人： Nestor Bojarczuk ,  Cyril Cabral ,  Eduard Cartier ,  Matthew Copel ,  Martin Frank ,  Evgeni Gousev ,  Supratik Guha ,  Rajarao Jammy ,  Vijay Narayanan ,  Vamsi Paruchuri

IPC分类号： H01L21/28 ,  H01L21/8238 ,  H01L29/49 ,  H01L29/51 ,  H01L31/113 ,  H01L31/119

CPC分类号： H01L29/513 ,  H01L21/28079 ,  H01L21/28088 ,  H01L21/823857 ,  H01L29/495 ,  H01L29/4966 ,  H01L29/517

摘要： The present invention provides a semiconductor structure comprising a semiconductor substrate having source and drain diffusion regions located therein, the source and drain diffusion regions being separated by a device channel; and a gate stack located on top of the device channel, the gate stack comprising a high-k gate dielectric, an insulating interlayer and a fully silicided metal gate conductor, the insulating interlayer located between the high-k gate dielectric and the fully silicided metal gate conductor, wherein the insulating interlayer is capable of stabilizing threshold voltage and flatband voltage of the semiconductor structure to a targeted value.

摘要翻译： 本发明提供一种半导体结构，其包括具有位于其中的源极和漏极扩散区域的半导体衬底，源极和漏极扩散区域被器件沟道分离; 以及位于器件沟道顶部的栅极堆叠，栅极堆叠包括高k栅极电介质，绝缘中间层和完全硅化金属栅极导体，位于高k栅极电介质和完全硅化金属之间的绝缘中间层 栅极导体，其中所述绝缘中间层能够将所述半导体结构的阈值电压和平带电压稳定到目标值。

公开(公告)号：US20060102968A1

公开(公告)日：2006-05-18

申请号：US10988733

申请日：2004-11-15

申请人： Nestor Bojarczuk ,  Cyril Cabral ,  Eduard Cartier ,  Martin Frank ,  Evgeni Gousev ,  Supratik Guha ,  Paul Jamison ,  Rajarao Jammy ,  Vijay Narayanan ,  Vamsi Paruchuri

发明人： Nestor Bojarczuk ,  Cyril Cabral ,  Eduard Cartier ,  Martin Frank ,  Evgeni Gousev ,  Supratik Guha ,  Paul Jamison ,  Rajarao Jammy ,  Vijay Narayanan ,  Vamsi Paruchuri

IPC分类号： H01L29/94

CPC分类号： H01L29/513 ,  H01L21/28194 ,  H01L21/2822 ,  H01L21/823828 ,  H01L21/823857 ,  H01L29/495 ,  H01L29/4966 ,  H01L29/4975 ,  H01L29/517 ,  H01L29/518

摘要： A semiconductor structure is provided that includes a Vt stabilization layer between a gate dielectric and a gate electrode. The Vt stabilization layer is capable of stabilizing the structure's threshold voltage and flatband voltage to a targeted value and comprises a nitrided metal oxide, or a nitrogen-free metal oxide, with the proviso that when the Vt stabilization layer comprises a nitrogen-free metal oxide, at least one of the semiconductor substrate or the gate dielectric includes nitrogen. The present invention also provides a method of fabricating such a structure.

摘要翻译： 提供了一种半导体结构，其包括在栅极电介质和栅电极之间的V 1稳定层。 VST稳定层能够将结构的阈值电压和平带电压稳定到目标值，并且包括氮化金属氧化物或无氮金属氧化物，条件是当V < 稳定层包括无氮金属氧化物，半导体衬底或栅极电介质中的至少一个包括氮。 本发明还提供一种制造这种结构的方法。

公开(公告)号：US20050269634A1

公开(公告)日：2005-12-08

申请号：US10863830

申请日：2004-06-04

申请人： Nestor Bojarczuk ,  Cyril Cabral ,  Eduard Cartier ,  Matthew Copel ,  Martin Frank ,  Evgeni Gousev ,  Supratik Guha ,  Rajarao Jammy ,  Vijay Narayanan ,  Vamsi Paruchuri

发明人： Nestor Bojarczuk ,  Cyril Cabral ,  Eduard Cartier ,  Matthew Copel ,  Martin Frank ,  Evgeni Gousev ,  Supratik Guha ,  Rajarao Jammy ,  Vijay Narayanan ,  Vamsi Paruchuri

IPC分类号： H01L21/28 ,  H01L21/8238 ,  H01L29/49 ,  H01L29/51 ,  H01L31/113 ,  H01L31/119

CPC分类号： H01L29/513 ,  H01L21/28079 ,  H01L21/28088 ,  H01L21/823857 ,  H01L29/495 ,  H01L29/4966 ,  H01L29/517

摘要： A method of forming a CMOS structure, and the device produced therefrom, having improved threshold voltage and flatband voltage stability. The inventive method includes the steps of providing a semiconductor substrate having an nFET region and a pFET region; forming a dielectric stack atop the semiconductor substrate comprising an insulating interlayer atop a high k dielectric; removing the insulating interlayer from the nFET region without removing the insulating interlayer from the pFET region; and providing at least one gate stack in the pFET region and at least one gate stack in the nFET region. The insulating interlayer can be AlN or AlOxNy. The high k dielectric can be HfO2, hafnium silicate or hafnium silicon oxynitride. The insulating interlayer can be removed from the nFET region by a wet etch including a HCl/H2O2 peroxide solution.

摘要翻译： 一种形成CMOS结构的方法及其制造的器件，具有改进的阈值电压和平带电压稳定性。 本发明的方法包括提供具有nFET区和pFET区的半导体衬底的步骤; 在所述半导体衬底上形成包括在高k电介质顶上的绝缘夹层的电介质叠层; 从nFET区域去除绝缘中间层而不从pFET区域去除绝缘中间层; 以及在pFET区域中提供至少一个栅极堆叠以及在nFET区域中提供至少一个栅极堆叠。 绝缘中间层可以是AlN或AlO x N y Y。 高k电介质可以是HfO 2，硅酸铪或铪硅氮氧化物。 可以通过包含HCl / H 2 O 2 O 2过氧化物溶液的湿蚀刻从nFET区域去除绝缘中间层。

公开(公告)号：US20060289903A1

公开(公告)日：2006-12-28

申请号：US11513101

申请日：2006-08-30

申请人： Wanda Andreoni ,  Alessandro Callegari ,  Eduard Cartier ,  Alessandro Curioni ,  Christopher D'Emic ,  Evgeni Gousev ,  Michael Gribelyuk ,  Paul Jamison ,  Rajarao Jammy ,  Dianne Lacey ,  Fenton McFeely ,  Vijay Narayanan ,  Carlo Pignedoli ,  Joseph Shepard ,  Sufi Zafar

发明人： Wanda Andreoni ,  Alessandro Callegari ,  Eduard Cartier ,  Alessandro Curioni ,  Christopher D'Emic ,  Evgeni Gousev ,  Michael Gribelyuk ,  Paul Jamison ,  Rajarao Jammy ,  Dianne Lacey ,  Fenton McFeely ,  Vijay Narayanan ,  Carlo Pignedoli ,  Joseph Shepard ,  Sufi Zafar

IPC分类号： H01L31/112 ,  H01L29/80

CPC分类号： H01L21/28176 ,  H01L29/4908 ,  H01L29/4966 ,  H01L29/513 ,  H01L29/517 ,  H01L29/6656 ,  H01L29/66575 ,  H01L29/66772 ,  H01L29/7833 ,  H01L29/78684

摘要： The present invention provides a gate stack structure that has high mobilites and low interfacial charges as well as semiconductor devices, i.e., metal oxide semiconductor field effect transistors (MOSFETs) that include the same. In the semiconductor devices, the gate stack structure of the present invention is located between the substrate and an overlaying gate conductor. The present invention also provides a method of fabricating the inventive gate stack structure in which a high temperature annealing process (on the order of about 800° C.) is employed. The high temperature anneal used in the present invention provides a gate stack structure that has an interface state density, as measured by charge pumping, of about 8×1010 charges/cm2 or less, a peak mobility of about 250 cm2/V-s or greater and substantially no mobility degradation at about 6.0×1012 inversion charges/cm2 or greater.

摘要翻译： 本发明提供具有高移动性和低界面电荷的栅堆叠结构，以及包括其的半导体器件，即金属氧化物半导体场效应晶体管（MOSFET）。 在半导体器件中，本发明的栅极堆叠结构位于衬底和覆盖栅极导体之间​​。 本发明还提供一种制造本发明的栅叠层结构的方法，其中采用了高温退火工艺（大约800℃）。 在本发明中使用的高温退火提供了一种栅堆叠结构，其具有通过电荷泵浦测量的约8×10 10电荷/ cm 2的界面态密度或 更少，约250cm 2 / Vs或更高的峰迁移率，并且在约6.0×10 12反转电荷/ cm 2处基本上没有迁移率降解， 或更大。

公开(公告)号：US08551313B2

公开(公告)日：2013-10-08

申请号：US11940720

申请日：2007-11-15

申请人： Veeraraghavan S. Basker ,  Eduard Cartier ,  Hariklia Deligianni ,  Rajarao Jammy ,  Vamsi K. Paruchuri

发明人： Veeraraghavan S. Basker ,  Eduard Cartier ,  Hariklia Deligianni ,  Rajarao Jammy ,  Vamsi K. Paruchuri

IPC分类号： C25D5/02

CPC分类号： C25D5/18 ,  C25D5/024 ,  C25D17/001 ,  C25D17/002 ,  C25D17/005 ,  H01L21/2885 ,  H01L21/7624

摘要： An electroplating apparatus and method for depositing a metallic layer on the surface of a wafer is provided wherein said apparatus and method do not require physical attachment of an electrode to the wafer. The surface of the wafer to be plated is positioned to face the anode and a plating fluid is provided between the wafer and the electrodes to create localized metallic plating. The wafer may be positioned to physically separate and lie between the anode and cathode so that one side of the wafer facing the anode contains a catholyte solution and the other side of the wafer facing the cathode contains an anolyte solution. Alternatively, the anode and cathode may exist on the same side of the wafer in the same plating fluid. In one example, the anode and cathode are separated by a semi permeable membrane.

摘要翻译： 提供了一种用于在晶片的表面上沉积金属层的电镀设备和方法，其中所述设备和方法不需要将电极物理附接到晶片。 要镀覆的晶片的表面被定位成面对阳极，并且在晶片和电极之间设置电镀液以产生局部金属电镀。 晶片可以被定位成物理分离并且位于阳极和阴极之间，使得面向阳极的晶片的一侧包含阴极电解液，并且晶片的面向阴极的另一侧包含阳极电解液。 或者，阳极和阴极可以存在于同一电镀液中晶片的同一侧。 在一个实例中，阳极和阴极被半透膜隔开。

公开(公告)号：US20060237796A1

公开(公告)日：2006-10-26

申请号：US11111592

申请日：2005-04-21

申请人： Eduard Cartier ,  Matthew Copel ,  Bruce Doris ,  Rajarao Jammy ,  Young-Hee Kim ,  Barry Linder ,  Vijay Narayanan ,  Vamsi Paruchuri ,  Keith Wong

发明人： Eduard Cartier ,  Matthew Copel ,  Bruce Doris ,  Rajarao Jammy ,  Young-Hee Kim ,  Barry Linder ,  Vijay Narayanan ,  Vamsi Paruchuri ,  Keith Wong

IPC分类号： H01L29/76

CPC分类号： H01L21/823842

摘要： The present invention is directed to CMOS structures that include at least one nMOS device located on one region of a semiconductor substrate; and at least one pMOS device located on another region of the semiconductor substrate. In accordance with the present invention, the at least one nMOS device includes a gate stack comprising a gate dielectric, a low workfunction elemental metal having a worfunction of less than 4.2 eV, an in-situ metallic capping layer, and a polysilicon encapsulation layer and the at least one pMOS includes a gate stack comprising a gate dielectric, a high workfunction elemental metal having a workfunction of greater than 4.9 eV, a metallic capping layer, and a polysilicon encapsulation layer. The present invention also provides methods of fabricating such a CMOS structure.

摘要翻译： 本发明涉及包括位于半导体衬底的一个区域上的至少一个nMOS器件的CMOS结构; 以及位于半导体衬底的另一区域上的至少一个pMOS器件。 根据本发明，至少一个nMOS器件包括栅堆叠，其包括栅极电介质，功能小于4.2eV的低功函数元素金属，原位金属覆盖层和多晶硅封装层，以及 所述至少一个pMOS包括包括栅极电介质的栅极堆叠，具有大于4.9eV的功函数的高功函数元素金属，金属覆盖层和多晶硅封装层。 本发明还提供了制造这种CMOS结构的方法。