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公开(公告)号：US4807356A
公开(公告)日：1989-02-28
申请号：US4758
申请日：1987-01-07
CPC分类号： H05K13/0408 , Y10T29/4913 , Y10T29/49139 , Y10T29/53174 , Y10T29/53178
摘要： The present invention is a part mounting device for mounting chip parts on a substrate, comprising a linear motor having a columnar yoke with upper and lower ends thereof pivotably supported on the device, permanent magnets disposed in the vicinity of the columnar yoke and forming with the columnar yoke a magnetic circuit, and a bobbin disposed in the vicinity of the columnar yoke and slidable in the columnar direction of the yoke;a chip part holder fixedly secured to the bobbin and having a vacuum nozzle for picking up and holding chip parts;a mechanism connected to said linear motor for controlling the driving of the linear motor for driving the part holder rapidly for moving chip parts quickly from a first position remote from the position of the substrate on which the chip parts are to be mounted to a third position just before the chip parts are on the substrate and then driving the part holder slowly to move the chip parts from the third position to a second position where the chip parts are on the substrate; anda mechanism connected to the yoke for rotating the yoke in a plane transverse to the columnar direction of the yoke.
摘要翻译： 本发明是一种用于将芯片部件安装在基板上的部件安装装置，包括：线性电动机，其具有柱状磁轭，其上下端可枢转地支撑在该装置上，永磁体设置在柱状磁轭附近并与 柱状磁轭，磁路，以及设置在所述柱状磁轭附近并且能够沿所述磁轭的柱状方向滑动的绕线管; 芯片部分保持器固定地固定到线轴上并具有用于拾取和保持芯片部分的真空喷嘴; 连接到所述线性电动机的机构，用于控制用于快速驱动部件保持器的线性电动机的驱动，用于将芯片部件从远离其上将要安装芯片部件的基板的位置的第一位置快速移动到第三位置 在芯片部件在基板之前，然后缓慢地驱动部件支架以将芯片部件从第三位置移动到芯片部件在基板上的第二位置; 以及与磁轭连接的机构，用于在与磁轭的柱状方向横切的平面内旋转磁轭。
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公开(公告)号：US4790069A
公开(公告)日：1988-12-13
申请号：US862226
申请日：1986-04-28
IPC分类号： H01L21/67 , H01L21/677 , H01L21/68 , H05K13/04 , H05K13/08
CPC分类号： H05K13/08 , Y10T29/4913 , Y10T29/53039 , Y10T29/53061
摘要： The present invention relates to a method and apparatus for mounting an electronic part (11) on a circuit board (28). When the part is mounted, a distance between the under surface of a part maintaining section (12) and the circuit board (38) is measured. Determination that the electronic part (11) is normally mounted on the circuit board (28) is made by comparing the measured distance with the thickness of the electronic part (11) measured in advance.
摘要翻译： PCT No.PCT / JP85 / 00480 Sec。 一九八六年四月二十八日 102（e）日期1986年4月28日PCT提交1985年8月30日PCT公布。 出版物WO86 / 01676 日期：1986年3月13日。本发明涉及一种将电子部件（11）安装在电路板（28）上的方法和装置。 当安装部件时，测量零件保持部分（12）的下表面与电路板（38）之间的距离。 电子部件（11）通常安装在电路板（28）上的确定是通过将测量的距离与预先测量的电子部件（11）的厚度进行比较而制成的。
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3.发明授权Packing band, packing method and packing apparatus, of little parts, and mounting method of electronic parts 失效包装带，包装方法和包装设备，小零件和电子零件的安装方法公开(公告)号：US06250051B1
公开(公告)日：2001-06-26
申请号：US09566589
申请日：2000-05-08
申请人： Kazuhiro Mori , Eiji Itemadani , Souhei Tanaka , Uzo Tomii , Yukihiko Asao , Yozo Uotsu
发明人： Kazuhiro Mori , Eiji Itemadani , Souhei Tanaka , Uzo Tomii , Yukihiko Asao , Yozo Uotsu
IPC分类号： B65B1504
摘要： The band 10 which stores little parts 20 in many storing dents 14 arranged along a longitudinal direction and packs the little parts 20 by covering surfaces of the storing dents 14 with a cover tape 30, and is made of a flexible material having a compress-forming nature, and comprises storing dents 14 which are compress-formed from a surface to a fixed depth in a thickness direction.
摘要翻译： 沿着纵向方向存放许多储存凹痕14中的小零件20的带10，并且用覆盖带30覆盖存储凹部14的表面，并且由具有压缩成形的柔性材料制成， 并且包括将从表面压缩形成的凹陷14存储在厚度方向上的固定深度。
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公开(公告)号：US6142306A
公开(公告)日：2000-11-07
申请号：US202707
申请日：1998-12-18
申请人： Kazuhiro Mori , Eiji Itemadani , Souhei Tanaka , Osamu Hikita , Uzo Tomii , Kanji Sugio , Teruo Shoji , Yukihiko Asao
发明人： Kazuhiro Mori , Eiji Itemadani , Souhei Tanaka , Osamu Hikita , Uzo Tomii , Kanji Sugio , Teruo Shoji , Yukihiko Asao
CPC分类号： B65D73/02 , H05K13/003
摘要： A carrier band of electronic parts which can carry electronic parts such as IC packages in good protected condition without spoiling the convenience of a carrier tape having convexities and sticking tape. An electronic parts carrier band T which includes a flexible band (10) and keeps and carries longitudinally at intervals a large quantity of electronic parts (40) where each part (40) has a part body (42) and projecting portions (44) with the carrier band comprising: supporting stands (20), which are mounted longitudinally at intervals and project from the band (10); supporting faces (22), which are formed on the supporting stands (20) and support the electronic parts (40) by contacting the part body (42); opening portions (26), which are opened from the supporting faces (22) to a part of both side faces (24) of the supporting stands (20) at positions corresponding to the part bodies (42); and a sticking tape (30), which is longitudinally affixed to a back side of the band (10) including the supporting faces (22) by a one-sided sticking face (32) of the sticking tape (30), wherein a part of the sticking face (32) is exposed by the opening portions (26) and is stuck to a part body (42).
摘要翻译： PCT No.PCT / JP98 / 01212 Sec。 371 1998年12月18日第 102（e）1998年12月18日日期PCT 1998年3月20日PCT PCT。 第WO98 / 52845号公报 日期：1998年11月26日电子部件的载带，其可以承载具有良好保护条件的IC封装的电子部件，而不破坏具有凸起和粘着带的载带的便利性。 一种电子部件载体带T，其包括柔性带（10），并且间隔地保持并纵向地承载大量电子部件（40），其中每个部分（40）具有部分主体（42）和突出部分（44） 所述载体带包括：支撑架（20），其间隔地纵向安装并且从所述带（10）伸出; 支撑面（22），其形成在所述支撑架（20）上并且通过使所述部件主体（42）接触来支撑所述电子部件（40）。 开口部分（26），其从所述支撑面（22）向所述支撑架（20）的两个侧面（24）的一部分在对应于所述零件体（42）的位置处被打开; 和粘贴带（30），其通过粘着带（30）的单面粘贴面（32）纵向固定在包括支撑面（22）的带（10）的后侧，其中， 所述粘贴面（32）被所述开口部（26）露出，并粘贴在所述部件体（42）上。
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公开(公告)号：US4592137A
公开(公告)日：1986-06-03
申请号：US638448
申请日：1984-07-26
申请人： Souhei Tanaka , Kazuhiro Mori , Eiji Itemadani
发明人： Souhei Tanaka , Kazuhiro Mori , Eiji Itemadani
CPC分类号： H01R12/526 , H05K3/3447 , H05K3/4046 , H05K2201/10363 , H05K2201/10984 , H05K2203/041 , H05K3/3468 , Y10T29/49149
摘要： According to this invention, an electrically conducting wire provided with a solder ball is inserted through throughholes provided around the perimeters thereof with electrically conductive members such as copper foils which form printed wiring on both surfaces of an insulating substrate. One of the conductive members and the conducting wire are soldered by dipping or flow-soldering, thereby making a circuit connection across both surfaces of the substrate by causing melting of the solder ball on the conducting wire on the substrate surface not soldered.
摘要翻译： PCT No.PCT / JP83 / 00417 Sec。 371日期1984年7月26日 102（e）日期1984年7月26日PCT提交1983年11月22日PCT公布。 公开号WO84 / 02248 日本1984年6月7日。根据本发明，设置有焊球的导电线通过在其周围设置的通孔插入绝缘基板的两个表面上形成印刷布线的铜箔等导电构件。 导电构件和导线中的一个通过浸渍或流焊来焊接，从而通过使未焊接的基板表面上的导线上的焊球熔化而在基板的两个表面上形成电路连接。
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6.发明授权Packing band, packing method and packing apparatus, of little parts, and mounting method of electronic parts 失效包装带，包装方法和包装设备，小零件和电子零件的安装方法
公开(公告)号：US6101790A
公开(公告)日：2000-08-15
申请号：US113887
申请日：1998-07-10
申请人： Kazuhiro Mori , Eiji Itemadani , Souhei Tanaka , Uzo Tomii , Yukihiko Asao , Yozo Uotsu
发明人： Kazuhiro Mori , Eiji Itemadani , Souhei Tanaka , Uzo Tomii , Yukihiko Asao , Yozo Uotsu
摘要： The band 10 which stores little parts 20 in many storing dents 14 arranged along a longitudinal direction and packs the little parts 20 by covering surfaces of the storing dents 14 with a cover tape 30, and is made of a flexible material having a compress-forming nature, and comprises storing dents 14 which are compress-formed from a surface to a fixed depth in a thickness direction.
摘要翻译： 沿着纵向方向存放许多储存凹痕14中的小零件20的带10，并且用覆盖带30覆盖存储凹部14的表面，并且由具有压缩成形的柔性材料制成， 并且包括将从表面压缩形成的凹陷14存储在厚度方向上的固定深度。
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公开(公告)号：US4440355A
公开(公告)日：1984-04-03
申请号：US351466
申请日：1982-02-23
CPC分类号： H05K13/0417 , Y10S156/922 , Y10S242/918 , Y10T156/11 , Y10T156/19
摘要： The disclosure is directed to an electronic component supply apparatus for use in an electronic component mounting arrangement, which employs an electronic component carrier tape. The apparatus is arranged to separate a covering tape from a tape base of the carrier tape only at a position directly below a vacuum chuck for picking up the component, while the covering tape is separated from the tape base so as to be wound up at a winding speed lower than an intermittent feeding speed of the carrier tape by a predetermined pitch.
摘要翻译： 本公开涉及一种用于电子部件安装装置的电子部件供应装置，其使用电子部件载带。 该设备被布置成仅将覆盖带与载带的带基分开，仅在真空卡盘的正下方的位置处，用于拾取部件，同时覆盖带与带基部分离，以便在一个 卷绕速度低于载带的间歇进给速度预定间距。
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公开(公告)号：US4825536A
公开(公告)日：1989-05-02
申请号：US103868
申请日：1987-10-02
申请人： Eiji Itemadani , Shuichi Murakami , Kazuhiro Mori
发明人： Eiji Itemadani , Shuichi Murakami , Kazuhiro Mori
IPC分类号： H01C17/06 , B23P21/00 , H01C17/00 , H01C17/065 , H01C17/242 , H05K3/00 , H05K3/30 , H05K13/00 , H05K13/04 , H05K13/08
CPC分类号： H05K13/08 , H01C17/006 , H01C17/065 , H01C17/242 , Y10T29/49004 , Y10T29/49099 , Y10T29/49137 , Y10T29/53178
摘要： Fabrication of an electronic circuit board is carried out by forming a predetermined number of resistors having various resistances based on a circuit design stored in a memory on a nonconductive substrate and dividing the nonconductive substrate into discrete resistors, then mounting the discrete resistors on a circuit board and testing operation characteristic thereof; and when some resistors having resistances which are not suitable to obtain a predetermined operation characteristic exist in the above-formed resistors, the resistances are corrected, and electronic circuit board having corrected accurate electric constants is obtained; and thereby a complete electronic circuit boards are fabricated by repetition of above-mentioned respective steps.
摘要翻译： 电子电路板的制造通过基于存储在非导电衬底上的存储器中的电路设计形成具有各种电阻的预定数量的电阻器，并将非导电衬底分成分立电阻器，然后将分立电阻器安装在电路板上 及其测试操作特性; 并且当在上述形成的电阻器中存在一些不适合获得预定操作特性的电阻器的电阻器时，电阻被校正，并且获得校正的精确电常数的电子电路板; 从而通过重复上述各个步骤制造完整的电子电路板。
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公开(公告)号：US4473247A
公开(公告)日：1984-09-25
申请号：US348404
申请日：1982-02-12
申请人： Eiji Itemadani , Kazuhiro Mori , Sohei Tanaka , Akira Kabeshita
发明人： Eiji Itemadani , Kazuhiro Mori , Sohei Tanaka , Akira Kabeshita
IPC分类号： B25J15/00 , B25J15/06 , B65G47/91 , H01L21/68 , H01L21/683
CPC分类号： B65G47/91 , H01L21/68 , H01L21/6838 , Y10T29/53178
摘要： A component mounting apparatus comprises a hollow rod communicated to a source of vacuum and having a suction head for picking up generally rectangular articles one at a time by the effect of a suction force. At least one pair of finger members for clamping and releasing the articles which has been sucked onto the suction head are provided for effecting a correction in position of the article relative to the suction head. Each of the finger members has an inclined end face which is adapted to support the article sucked onto the suction head from below in engagement with the opposite lower edges of the article.
摘要翻译： 部件安装装置包括连接到真空源的中空杆，并且具有用于通过抽吸力一次拾取大致矩形物品的吸头。 提供用于夹紧和释放被吸入到吸头上的物品的至少一对指状构件用于在物品相对于抽吸头的位置进行校正。 每个指状构件具有倾斜的端面，该倾斜端面适于从下方支撑吸附到吸头上的物品，以与物品的相对的下边缘接合。
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公开(公告)号：US4411362A
公开(公告)日：1983-10-25
申请号：US405105
申请日：1982-08-04
申请人： Eiji Itemadani , Kazuhiro Mori , Sohei Tanaka , Akira Kabeshita
发明人： Eiji Itemadani , Kazuhiro Mori , Sohei Tanaka , Akira Kabeshita
CPC分类号： B65D73/02
摘要： Assembly devices for electrical circuit components which is suitable for feeding electronic chip components, especially for semiconductor IC chips with comb-like leads, to e.g. chip mounting apparatuses, comprises two belt-like long objects made of tape-like and belt-shaped long materials, and is capable of feeding the electronic chip components mounted thereon in a stable and continuous feeding operation.
摘要翻译： 用于电路部件的装配装置，其适于馈送电子芯片部件，特别是用于将具有梳状引线的半导体IC芯片馈送到例如电子部件。 芯片安装装置包括由带状和带状长材料制成的两个带状长的物体，并且能够以稳定且连续的供给操作来供给安装在其上的电子元件部件。
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