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    Carrier band of electronic parts
    1.
    发明授权
    Carrier band of electronic parts 失效
    电子部件的载波带

    公开(公告)号：US6142306A

    公开(公告)日：2000-11-07

    申请号：US202707

    申请日：1998-12-18

    申请人： Kazuhiro Mori ,  Eiji Itemadani ,  Souhei Tanaka ,  Osamu Hikita ,  Uzo Tomii ,  Kanji Sugio ,  Teruo Shoji ,  Yukihiko Asao

    发明人： Kazuhiro Mori ,  Eiji Itemadani ,  Souhei Tanaka ,  Osamu Hikita ,  Uzo Tomii ,  Kanji Sugio ,  Teruo Shoji ,  Yukihiko Asao

    IPC分类号： B65D85/90 ,  B65D73/02 ,  H05K13/00

    CPC分类号： B65D73/02 ,  H05K13/003

    摘要： A carrier band of electronic parts which can carry electronic parts such as IC packages in good protected condition without spoiling the convenience of a carrier tape having convexities and sticking tape. An electronic parts carrier band T which includes a flexible band (10) and keeps and carries longitudinally at intervals a large quantity of electronic parts (40) where each part (40) has a part body (42) and projecting portions (44) with the carrier band comprising: supporting stands (20), which are mounted longitudinally at intervals and project from the band (10); supporting faces (22), which are formed on the supporting stands (20) and support the electronic parts (40) by contacting the part body (42); opening portions (26), which are opened from the supporting faces (22) to a part of both side faces (24) of the supporting stands (20) at positions corresponding to the part bodies (42); and a sticking tape (30), which is longitudinally affixed to a back side of the band (10) including the supporting faces (22) by a one-sided sticking face (32) of the sticking tape (30), wherein a part of the sticking face (32) is exposed by the opening portions (26) and is stuck to a part body (42).

    摘要翻译： PCT No.PCT / JP98 / 01212 Sec。 371 1998年12月18日第 102（e）1998年12月18日日期PCT 1998年3月20日PCT PCT。 第WO98 / 52845号公报 日期：1998年11月26日电子部件的载带，其可以承载具有良好保护条件的IC封装的电子部件，而不破坏具有凸起和粘着带的载带的便利性。 一种电子部件载体带T，其包括柔性带（10），并且间隔地保持并纵向地承载大量电子部件（40），其中每个部分（40）具有部分主体（42）和突出部分（44） 所述载体带包括：支撑架（20），其间隔地纵向安装并且从所述带（10）伸出; 支撑面（22），其形成在所述支撑架（20）上并且通过使所述部件主体（42）接触来支撑所述电子部件（40）。 开口部分（26），其从所述支撑面（22）向所述支撑架（20）的两个侧面（24）的一部分在对应于所述零件体（42）的位置处被打开; 和粘贴带（30），其通过粘着带（30）的单面粘贴面（32）纵向固定在包括支撑面（22）的带（10）的后侧，其中， 所述粘贴面（32）被所述开口部（26）露出，并粘贴在所述部件体（42）上。

    Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device
    2.
    发明授权
    Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device 失效
    探针片粘合保持器，探针卡，半导体测试装置和半导体器件的制造方法

    公开(公告)号：US07423439B2

    公开(公告)日：2008-09-09

    申请号：US11543021

    申请日：2006-10-05

    申请人： Susumu Kasukabe ,  Teruo Shoji ,  Akio Hasebe ,  Yoshinori Deguchi ,  Yasunori Narizuka

    发明人： Susumu Kasukabe ,  Teruo Shoji ,  Akio Hasebe ,  Yoshinori Deguchi ,  Yasunori Narizuka

    IPC分类号： G01R31/02

    CPC分类号： G01R1/0735 ,  G01R3/00

    摘要： In a prove card comprising: a probe sheet having a contact terminal contacting with an electrode provided on a wafer, a wiring led from the contact terminal, and an electrode electrically connected to the wiring; and a multilayered wiring substrate having an electrode electrically connected to the electrode of the probe sheet, wherein a contact between the contact terminal and the electrode of the wafer is established by one or more adhesion holder for pressing, from the backside of a terminal group of the terminal contacts, the terminal group via a press block with a spring to contact with the electrode pad. A device in which the probe sheet is attached to the adhesion holder and a plurality of chips are tested simultaneously by combining the adhesion holder.

    摘要翻译： 一种证明卡，包括：探针片，其具有与设置在晶片上的电极接触的接触端子，从接触端子引出的布线和电连接到布线的电极; 以及多层布线基板，其具有与所述探针片的电极电连接的电极，其中，所述接触端子和所述晶片的电极之间的接触由一个或多个粘合保持器建立，所述粘合保持器从所述端子组的端子组的背面 端子触点，端子组通过具有弹簧的压块与电极焊盘接触。 通过组合粘合保持器，将探针片附接到粘合保持器和多个芯片的装置同时测试。

    Manufacturing method of semiconductor integrated circuit device
    7.
    发明授权
    Manufacturing method of semiconductor integrated circuit device 失效
    半导体集成电路器件的制造方法

    公开(公告)号：US07534629B2

    公开(公告)日：2009-05-19

    申请号：US11448071

    申请日：2006-06-07

    申请人： Teruo Shoji ,  Akio Hasebe ,  Yoshinori Deguchi ,  Motoji Murakami ,  Masayoshi Okamoto ,  Yasunori Narizuka ,  Susumu Kasukabe

    发明人： Teruo Shoji ,  Akio Hasebe ,  Yoshinori Deguchi ,  Motoji Murakami ,  Masayoshi Okamoto ,  Yasunori Narizuka ,  Susumu Kasukabe

    IPC分类号： H01L21/66

    CPC分类号： G01R1/0735

    摘要： By using a membrane probe formed by using a manufacturing technique for semiconductor integrated circuit devices, the yield of probing collectively performed on a plurality of chips is to be enhanced. A probe card is formed by using a plurality of pushers, each pusher being formed of a POGO pin insulator, POGO pins, an FPC connector, a membrane probe HMS, an impact easing sheet, an impact easing plate, a chip condenser YRS and so on, wherein one or two POGO pins press a plurality of metal films arranged like islands. One or more cuts are made into what matches the chip to be tested in the area of the membrane probe in a direction substantially parallel to the extending direction of wiring electrically connected to probes formed in the membrane probe.

    摘要翻译： 通过使用通过使用半导体集成电路器件的制造技术形成的膜探针，将提高在多个芯片上共同执行的探测的产量。 通过使用多个推动器形成探针卡，每个推动器由POGO针绝缘体，POGO针，FPC连接器，膜探针HMS，冲击缓冲片，冲击缓冲板，芯片冷凝器YRS等形成 其中一个或两个POGO销按压布置成岛状的多个金属膜。 将一个或多个切口制成与膜探针区域中基本上平行于电连接到形成在膜探针中的探针的布线的延伸方向的方向匹配的待测芯片。

    Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device
    10.
    发明申请
    Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device 失效
    探针片粘合保持器，探针卡，半导体测试装置和半导体器件的制造方法

    公开(公告)号：US20070103178A1

    公开(公告)日：2007-05-10

    申请号：US11543021

    申请日：2006-10-05

    申请人： Susumu Kasukabe ,  Teruo Shoji ,  Akio Hasebe ,  Yoshinori Deguchi ,  Yasunori Narizuka

    发明人： Susumu Kasukabe ,  Teruo Shoji ,  Akio Hasebe ,  Yoshinori Deguchi ,  Yasunori Narizuka

    IPC分类号： G01R31/02

    CPC分类号： G01R1/0735 ,  G01R3/00

    摘要： In a prove card comprising: a probe sheet having a contact terminal contacting with an electrode provided on a wafer, a wiring led from the contact terminal, and an electrode electrically connected to the wiring; and a multilayered wiring substrate having an electrode electrically connected to the electrode of the probe sheet, wherein a contact between the contact terminal and the electrode of the wafer is established by one or more adhesion holder for pressing, from the backside of a terminal group of the terminal contacts, the terminal group via a press block with a spring to contact with the electrode pad. A device in which the probe sheet is attached to the adhesion holder and a plurality of chips are tested simultaneously by combining the adhesion holder.

    摘要翻译： 一种证明卡，包括：探针片，其具有与设置在晶片上的电极接触的接触端子，从接触端子引出的布线和电连接到布线的电极; 以及多层布线基板，其具有与所述探针片的电极电连接的电极，其中，所述接触端子和所述晶片的电极之间的接触由一个或多个粘合保持器建立，所述粘合保持器从所述端子组的端子组的背面 端子触点，端子组通过具有弹簧的压块与电极焊盘接触。 通过组合粘合保持器，将探针片附接到粘合保持器和多个芯片的装置同时测试。