公开(公告)号：US06869234B2

公开(公告)日：2005-03-22

申请号：US10637774

申请日：2003-08-07

申请人： Masakazu Sanada ,  Masahiko Harumoto ,  Hiroshi Kobayashi ,  Minobu Matsunaga ,  Akihiko Morita

发明人： Masakazu Sanada ,  Masahiko Harumoto ,  Hiroshi Kobayashi ,  Minobu Matsunaga ,  Akihiko Morita

IPC分类号： G03D5/00

CPC分类号： G03D5/00

摘要： A substrate (SW) is rotatably held in an approximately horizontal position by a wafer holding and rotation mechanism (810). One end of a rinsing liquid supply nozzle (840) is rotatably supported by a rinsing liquid supply nozzle rotation supporting mechanism (850) to pass over the substrate (SW). In response to rotation of the rinsing liquid supply nozzle (840), the rotation axis of the rinsing liquid supply nozzle (840) moves in a direction closer to or away from the rotation axis of the substrate (SW), whereby the amount of projection of a tip portion of the rinsing liquid supply nozzle (840) is reduced.

摘要翻译： 基板（SW）通过晶片保持旋转机构（810）可旋转地保持在大致水平的位置。 冲洗液供给喷嘴（840）的一端由冲洗液供给喷嘴旋转支撑机构（850）可旋转地支撑，从而越过基板（SW）。 响应于冲洗液体供给喷嘴（840）的旋转，冲洗液体供给喷嘴（840）的旋转轴线在更靠近或远离基板（SW）的旋转轴线的方向上移动，由此投影量 的清洗液供给喷嘴（840）的顶端部分减少。

公开(公告)号：US06558053B2

公开(公告)日：2003-05-06

申请号：US10125229

申请日：2002-04-18

申请人： Kazuhito Shigemori ,  Masakazu Sanada ,  Minobu Matsunaga ,  Katsushi Yoshioka ,  Kenji Sugimoto ,  Kaoru Aoki ,  Moritaka Yano ,  Satoshi Yamamoto ,  Tsuyoshi Mitsuhashi ,  Takashi Nagao ,  Mitsumasa Kodama ,  Yukihiko Inagaki ,  Yoshihisa Yamada

发明人： Kazuhito Shigemori ,  Masakazu Sanada ,  Minobu Matsunaga ,  Katsushi Yoshioka ,  Kenji Sugimoto ,  Kaoru Aoki ,  Moritaka Yano ,  Satoshi Yamamoto ,  Tsuyoshi Mitsuhashi ,  Takashi Nagao ,  Mitsumasa Kodama ,  Yukihiko Inagaki ,  Yoshihisa Yamada

IPC分类号： G03D500

CPC分类号： H01L21/67161 ,  H01L21/6715 ,  H01L21/67167 ,  H01L21/67178

摘要： A substrate processing apparatus includes a coating section, a developing section, a heat-treating section and a transport mechanism. The coating section has first processing units each for performing a coverage process to supply a photoresist solution to a substrate and cover a surface of the substrate with the photoresist solution, a second processing unit for spinning the substrate, after the coverage process, at high speed to make the photoresist solution into a film, dry the photoresist film, and clean the substrate. All substrates are processed with the same coating conditions to suppress differences in quality among the substrates. The first and second processing units perform the respective processes concurrently to improve the throughput of substrate processing.

公开(公告)号：US07105074B2

公开(公告)日：2006-09-12

申请号：US10202279

申请日：2002-07-22

申请人： Osamu Tamada ,  Tsuyoshi Mitsuhashi ,  Minobu Matsunaga ,  Katsushi Yoshioka ,  Kenji Sugimoto ,  Kaoru Aoki ,  Moritaka Yano ,  Satoshi Yamamoto ,  Masakazu Sanada ,  Takashi Nagao ,  Mitsumasa Kodama

发明人： Osamu Tamada ,  Tsuyoshi Mitsuhashi ,  Minobu Matsunaga ,  Katsushi Yoshioka ,  Kenji Sugimoto ,  Kaoru Aoki ,  Moritaka Yano ,  Satoshi Yamamoto ,  Masakazu Sanada ,  Takashi Nagao ,  Mitsumasa Kodama

IPC分类号： B05B3/00 ,  B08B3/00

CPC分类号： H01L21/6715 ,  H01L21/31133

摘要： A substrate treating apparatus is provided for eliminating wasteful consumption of a treating solution in a treating mode in which the treating solution is delivered in a strip form to a substrate from a treating solution delivery nozzle sweeping over the substrate. In a first aspect of the invention, collecting vessels are arranged around a developing cup surrounding a wafer supported by a wafer holder. The collecting vessels collect part of a developer delivered from a discharge opening of a developer delivery nozzle outwardly of a surface of the wafer. In a second aspect of the invention, collecting vessels are arranged below a developer delivery nozzle, with collecting openings of the collecting vessels opposed to a discharge opening or openings of the delivery nozzle. The collecting vessels are moved longitudinally of the discharge openings according to a position of the developer delivery nozzle relative to the wafer.

公开(公告)号：US06656277B2

公开(公告)日：2003-12-02

申请号：US10270885

申请日：2002-10-11

申请人： Masakazu Sanada ,  Masahiko Harumoto ,  Hiroshi Kobayashi ,  Minobu Matsunaga

发明人： Masakazu Sanada ,  Masahiko Harumoto ,  Hiroshi Kobayashi ,  Minobu Matsunaga

IPC分类号： B05C500

CPC分类号： H01L21/6715 ,  H01L21/67028

摘要： A developer supply nozzle moves from the side of a first edge of a substrate to the side of a second edge thereof opposite from the first edge to apply a developer across a major surface of the substrate. After a lapse of required development process time, a rinsing solution supply nozzle moves from the side of the first edge of the substrate to the side of the second edge thereof to apply a rinsing solution across the major surface of the substrate. Making the moving speed of the rinsing solution supply nozzle higher than the moving speed of the developer supply nozzle shortens actual developing time at a site (downstream relative to a scanning direction) where a development reaction is apt to accelerate under the influence of fluctuations of the developer caused by dropping of the rinsing solution.

摘要翻译： 显影剂供应喷嘴从基板的第一边缘的侧面移动到与第一边缘相对的第二边缘的侧面，以在显影剂的主表面上施加显影剂。 在经过所需的显影处理时间之后，冲洗溶液供应喷嘴从基板的第一边缘侧向其第二边缘侧移动，以在基板的主表面上施加冲洗溶液。 使冲洗溶液供给喷嘴的移动速度高于显影剂供给喷嘴的移动速度，缩短在显影反应容易加速的位置（扫描方向的下游）的实际显影时间， 显影剂由漂洗溶液的滴落引起。

公开(公告)号：US06832863B2

公开(公告)日：2004-12-21

申请号：US10458719

申请日：2003-06-09

申请人： Kenji Sugimoto ,  Minobu Matsunaga ,  Masakazu Sanada ,  Katsushi Yoshioka ,  Kaoru Aoki ,  Moritaka Yano ,  Satoshi Yamamoto ,  Tsuyoshi Mitsuhashi ,  Takashi Nagao ,  Mitsumasa Kodama

发明人： Kenji Sugimoto ,  Minobu Matsunaga ,  Masakazu Sanada ,  Katsushi Yoshioka ,  Kaoru Aoki ,  Moritaka Yano ,  Satoshi Yamamoto ,  Tsuyoshi Mitsuhashi ,  Takashi Nagao ,  Mitsumasa Kodama

IPC分类号： G03D500

CPC分类号： H01L21/67173 ,  G03F7/70691 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67276 ,  Y10S414/135 ,  Y10S414/14

摘要： A series of substrate transport paths for transporting substrates is arranged on upper and lower stories. Substrates are transferable between the substrate transport path on the first story and the substrate transport path on the second story. The paths include a going-only path for transporting the substrates forward, and a return-only path for transporting the substrates in the opposite direction, these paths being arranged on the upper and lower stories. An indexer connects one end of the substrate transport path on one story to one end of the substrate transport path on the other story. An interface connects the other end of the substrate transport path on one story to the other end of the substrate transport path on the other story. This construction efficiently reduces a waiting time due to interference between the substrates transported along the going-only path and the substrates transported along the return-only path.

摘要翻译： 用于传送基板的一系列基板传送路径被布置在上层和下层。 基底可以在第一层的基底输送路径和第二层的基底输送路径之间转移。 这些路径包括用于向前传送基板的唯一路径，以及用于沿相反方向传送基板的返回路径，这些路径布置在上部和下部故事物上。 分度器将另一个故事的基底传送路径的一端连接到基底传送路径的一端。 一个界面将一个故事的基板传送路径的另一端连接到另一个故事的基板传送路径的另一端。 这种构造有效地减少了由沿着仅路径传送的基板与沿着返回路径传送的基板之间的干涉导致的等待时间。

公开(公告)号：US06440218B1

公开(公告)日：2002-08-27

申请号：US09450946

申请日：1999-11-29

申请人： Masakazu Sanada ,  Kayoko Nakano ,  Shigehiro Goto ,  Minobu Matsunaga

发明人： Masakazu Sanada ,  Kayoko Nakano ,  Shigehiro Goto ,  Minobu Matsunaga

IPC分类号： B05C1100

CPC分类号： H01L21/6715 ,  B05C11/08

摘要： An apparatus for applying a coating solution to a surface of a substrate to form a coating film of desired thickness thereon. The apparatus includes a rotary supporting device for supporting and spinning the substrate in horizontal posture, a solvent spraying device for spraying a solvent to the substrate, a coating solution supplying device for supplying the coating solution to the substrate, a storage device for storing a processing program stipulating varied points and periods of time, a timer acting as a reference for each point or period of time stored in the storage, and a controller operable to perform controls based on the points and periods of time and with reference to the timer.

摘要翻译： 一种用于将涂布溶液施加到基材表面以在其上形成所需厚度的涂膜的设备。 该装置包括用于水平姿态地支撑和旋转基板的旋转支撑装置，用于向基板喷射溶剂的溶剂喷射装置，用于将涂布溶液供给到基板的涂布液供给装置，用于存储处理的存储装置 规定不同点和时间段的程序，作为存储在存储器中的每个点或时间段的参考的定时器，以及可操作以基于时间点和时间参考定时器执行控制的控制器。

公开(公告)号：US06752544B2

公开(公告)日：2004-06-22

申请号：US10305911

申请日：2002-11-26

申请人： Masakazu Sanada ,  Masahiko Harumoto ,  Hiroshi Kobayashi ,  Minobu Matsunaga

发明人： Masakazu Sanada ,  Masahiko Harumoto ,  Hiroshi Kobayashi ,  Minobu Matsunaga

IPC分类号： G03D500

CPC分类号： G03D5/00 ,  Y10S134/902

摘要： A substrate (W) is held in an approximately horizontal position by a substrate holder (10) and is rotated by a spinning motor (13). A rinsing liquid supply nozzle (140) is rotatably supported at its one end by a second nozzle movement mechanism (150) and is rotated to pass over the substrate (W). The rinsing liquid supply nozzle (140) is rotated to pass over the substrate (W) and at the same time to discharge a rinsing liquid from its discharge unit. At this time, the rinsing liquid supply nozzle (140) and the substrate (W) are rotated so that a virtual scanning direction (La) of the substrate (W) is substantially perpendicular to a direction of extension of the rinsing liquid supply nozzle (140). That is, since the rinsing liquid supply nozzle (140) is shifted in the virtual scanning direction (La), a non-supplying area of the substrate (W) where a rinsing liquid is not supplied can successively be made up and eliminated as the scanning by the nozzle (140) proceeds.

摘要翻译： 衬底（W）通过衬底保持器（10）保持在大致水平的位置，并由旋转电机（13）旋转。 冲洗液供给喷嘴（140）的一端由第二喷嘴移动机构（150）可旋转地支撑，并旋转而越过基板（W）。 冲洗液供给喷嘴（140）旋转以越过基板（W），同时从其排出单元排出冲洗液体。 此时，冲洗液供给喷嘴（140）和基板（W）旋转，使得基板（W）的虚拟扫描方向（La）大致垂直于冲洗液体供给喷嘴的延伸方向 140）。 也就是说，由于冲洗液体供给喷嘴（140）沿虚拟扫描方向（La）移动，所以不能供应冲洗液体的基板（W）的非供应区域可以作为 由喷嘴（140）进行扫描。

公开(公告)号：US5976620A

公开(公告)日：1999-11-02

申请号：US969273

申请日：1997-11-13

申请人： Masakazu Sanada ,  Minobu Matsunaga

发明人： Masakazu Sanada ,  Minobu Matsunaga

IPC分类号： B05D1/40 ,  B05C11/08 ,  B05D1/00 ,  G03F7/16 ,  H01L21/027 ,  H01L21/31 ,  B05D3/12

CPC分类号： G03F7/162 ,  B05C11/08 ,  B05D1/005

摘要： A method of applying a coating solution for forming a coating film of desired thickness. The coating solution begins to be supplied to a region centrally of a substrate. The spinning substrate is accelerated from a supplying rotational frequency to a higher, target rotational frequency before the coating solution is spread by the supplying rotational frequency to cover an entire surface of the substrate. Then, the supply of the coating solution is stopped. Subsequently, the substrate is spun with a film-forming rotational frequency lower than the target rotational frequency to form the coating film. The substrate is spun at high speed with the target rotational frequency for a variable period of time to adjust thickness of the coating film.

摘要翻译： 一种施加用于形成所需厚度的涂膜的涂布溶液的方法。 涂层溶液开始被提供到基底中央的区域。 在涂布溶液通过供给旋转频率扩展以覆盖基板的整个表面之前，将纺丝基材从供给旋转频率加速到较高的目标旋转频率。 然后，停止供给涂布溶液。 随后，以低于目标旋转频率的成膜旋转频率旋转基板以形成涂膜。 以目标旋转频率高速旋转基板一段可变的时间以调节涂膜的厚度。

公开(公告)号：US06827782B2

公开(公告)日：2004-12-07

申请号：US10353151

申请日：2003-01-28

申请人： Shigehiro Goto ,  Katsushi Yoshioka ,  Minobu Matsunaga

发明人： Shigehiro Goto ,  Katsushi Yoshioka ,  Minobu Matsunaga

IPC分类号： B05B716

CPC分类号： H01L21/6715 ,  B05B7/1666 ,  B05B12/1472 ,  B05C5/001 ,  H01L21/67051

摘要： A chemical treating apparatus for performing a predetermined treatment of a principal surface of a substrate by delivering a treating solution thereto. The apparatus includes a treating solution delivery nozzle for delivering the treating solution to the principal surface of a substrate. The nozzle has a treating solution reservoir adjacent a tip end thereof for storing the treating solution. A temperature control device holds the treating solution reservoir to control the temperature of the treating solution in the treating solution reservoir through heat exchange with the treating solution.

摘要翻译： 一种化学处理装置，用于通过将处理溶液输送到基板的主表面进行预定处理。 该设备包括用于将处理溶液输送到基底的主表面的处理溶液输送喷嘴。 喷嘴具有邻近其顶端的处理溶液储存器，用于存储处理溶液。 温度控制装置保持处理液储存器，以通过与处理溶液的热交换来控制处理溶液储存器中处理溶液的温度。

公开(公告)号：US6099643A

公开(公告)日：2000-08-08

申请号：US993284

申请日：1997-12-18

申请人： Masami Ohtani ,  Minobu Matsunaga ,  Tutomu Ueyama ,  Ryuji Kitakado ,  Kaoru Aoki

发明人： Masami Ohtani ,  Minobu Matsunaga ,  Tutomu Ueyama ,  Ryuji Kitakado ,  Kaoru Aoki

IPC分类号： H01L21/00 ,  B05C13/00

CPC分类号： H01L21/67173 ,  H01L21/67017 ,  H01L21/67178 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/141

摘要： An atmospheric conditioning unit for supplying temperature- and humidity-controlled air to a chemical processing part (spin coater) is arranged immediately above a chemical processing part, between this chemical processing part and a heat treatment part (including a hot plate and a cool plate). Namely, the chemical processing part, the atmospheric conditioning unit and the heat treatment part are vertically arranged in a stacked manner. The atmospheric conditioning unit receives external air from an opening. A closed partition is provided to block air flow between the atmospheric conditioning unit and a transport area. The temperature- and humidity-controlled air supplied from the atmospheric conditioning unit to the spin coater forms a downflow in the spin coater, and thereafter rises through an opening and joins with the air flowing from the opening, to be introduced into the atmospheric conditioning unit again and reused.

摘要翻译： 用于向化学处理部件（旋转涂布机）供给温度和湿度控制的空气的大气调节单元布置在化学处理部件的正上方，该化学处理部件和热处理部件（包括热板和冷却板 ）。 也就是说，化学处理部分，大气调节单元和热处理部分以堆叠的方式垂直布置。 大气调节装置从开口接收外部空气。 提供一个封闭的隔板以阻挡大气调节单元和运输区域之间的空气流动。 从大气调节单元向旋转涂布机供应的温度和湿度控制的空气在旋转涂布机中形成向下流动，然后通过开口上升并与从开口流出的空气接合，以引入大气调节单元 再次重复使用。