摘要:
A semiconductor device comprising a package formed of a thermoplastic resin, first and second lead frames arranged parallel to each other with a predetermined space interposed therebetween, and each having a distal end portion of a predetermined length located in the package, solder films formed on the first and second lead frames from outside the package to inside the package, a semiconductor element mounted on the distal end portion of the first lead frame and having an electrode, and a bonding wire having an end connected to the electrode of the semiconductor element, and another end connected to the distal end portion of the second lead frame.
摘要:
Watermark embedding embeds a digital watermark in positional information measured by positioner for measuring a current position of the mobile object. The positional information embedded with the digital watermark is outputted by a track information output as track information to a carrying medium. The track information is obtained by track information obtaining from the carrying medium, and detected by watermark detection whether water mark is embedded or not. The track information from which the digital watermark is detected and the track information from which no digital watermark is detected are displayed by track display in different modes.
摘要:
Map data is divided into meshes of a prescribed size. Treating four meshes as one group, mesh numbers are assigned to the meshes following an N pattern. After numbers are assigned to the four meshes, these four meshes are collected as one, and numbers are assigned to respective meshes following an N pattern. The map data storage medium stores the map data according to mesh number. As a result, data portions for areas located in close proximity are positioned in close proximity in the map database (storage medium), to thereby improve access efficiency.
摘要:
An optical semiconductor device of the present invention is equipped with a photo detect element 10 comprising a photo detect part 7 provided with two photodiodes having two photodiodes having peak wavelength sensitivity in a visible light region and an infrared region, respectively and an amplifying operation processing circuit 8 for amplifying and processing outputs of the photodiodes, and characterized in that substrate resistivity R is as follows: 1≦R≦3(&OHgr;cm)
摘要:
In order to ensure that a braising material applied onto the surface of a header pipe does not enter communicating passages for coolant intake/outlet at a connecting block during the furnace braising process implemented to weld the connecting block utilized to connect a liquid tank to the header pipe, pipe-like projections are formed at the pair of communicating passages for coolant intake/outlet formed at the connecting block for liquid tank connection on the side where the header pipe is connected and the pipe-like projections inserted at holes of the header pipe clad with a braising material are welded to a condenser to constitute an integrated part thereof.
摘要:
An apparatus for illuminating instrument pointers comprises a dial board having a shaft hole, pointer shafts provided perpendicularly to a pointer shaft drive unit and projecting through the shaft hole to the front of the dial board, a light conductive member having a light receiving section and a light transmission section made of a transparent material and disposed behind the dial board, a plurality of instrument pointers each having a collar section and a pointer section made of a transparent material and mounted on the pointer shaft such that a light beam emitted from the light transmission section is introduced through the collar section, and a light emitting member provided oppositely to the light receiving section. A light beam from the light emitting member is propagated through the light conductive member to the collar section and then to the pointer section, so that each instrument pointer is illuminated.
摘要:
An optical semiconductor device for emitting a light beam includes an outer envelope that forms an indentation in which a light emitting element is positioned. The indentation is divided into a first indentation part corresponding to a lower part of the indentation, and a second indentation part corresponding to an upper part of the indentation. A projection strip between the first and second indentation parts, projects from the inner surface of the outer envelope. A conductive lead supplies an electrical power to the light emitting element.
摘要:
A photo-interrupter is disclosed, which comprises a molded light emitting element unit including a first lead frame and a light emitting element mounted on and connected to the first lead frame, the first lead frame having a reflector portion, a molded light receiving element unit including a second lead frame and a light receiving element mounted on and connected to the second lead frame, the second lead frame having a different shape from the first lead frame, and an envelope molding formed in one piece with the light emitting element unit and the light receiving element unit, in which the light emitting element unit and the light receiving element unit are arranged with a predetermined gap therebetween, the envelope molding having a light guiding hole for guiding a light beam emitted from the light emitting element unit to the light receiving element.
摘要:
A multi-display system according to the present invention includes: first display means for displaying a plurality of first windows; second display means; and control means for controlling the first display means and the second display means. In response to a first predetermined input, the control means moves at least two of the plurality of first windows displayed on the first display means from the first display means onto the second display means.
摘要:
An optical semiconductor device for emitting a light beam includes an outer envelope that forms an indentation in which a light emitting element is positioned. The indentation is divided into a first indentation part corresponding to a lower part of the indentation, and a second indentation part corresponding to an upper part of the indentation. A projection strip between the first and second indentation parts, projects from the inner surface of the outer envelope. A conductive lead supplies an electrical power to the light emitting element.