公开(公告)号：US5557215A

公开(公告)日：1996-09-17

申请号：US239982

申请日：1994-05-09

申请人： Hiroaki Saeki ,  Masaki Kondo

发明人： Hiroaki Saeki ,  Masaki Kondo

IPC分类号： G01R29/24 ,  H01J37/32 ,  H01L21/683 ,  G01R31/26

CPC分类号： H01J37/32935 ,  H01L21/6833 ,  G01R29/24

摘要： According to the present invention, there are provided a self-bias measurement method of measuring the self-bias voltage of an object when the object is subjected to a plasma process by using a plasma generated between a pair of electrodes, the object being held, by means of electrostatic chucking means having an electrostatic chucking electrode, on one of the pair of electrodes situated in a processing chamber, the method including the steps of detecting a leak current between the object and the electrostatic chucking electrode while varying the DC voltage applied to the electrostatic chucking electrode, and calculating the self-bias voltage of the object on the basis of the leak current detected, an apparatus for measuring the self-bias, and an electrostatic chucking apparatus having means capable of measuring the self-bias.

摘要翻译： 根据本发明，提供了一种自偏置测量方法，其通过使用在一对电极之间产生的等离子体处理对物体进行等离子体处理时，测量物体的自偏压，被保持物体， 通过具有静电夹持电极的静电吸附装置，位于处理室中的一对电极中的一个电极上，该方法包括以下步骤：检测物体和静电吸持电极之间的漏电流，同时改变施加到 静电吸附电极，并且基于检测到的泄漏电流来计算物体的自偏压，用于测量自偏压的装置，以及具有能够测量自偏压的装置的静电夹持装置。

公开(公告)号：US5460684A

公开(公告)日：1995-10-24

申请号：US160842

申请日：1993-12-03

申请人： Hiroaki Saeki ,  Teruo Asakawa ,  Noboru Masuoka ,  Masaki Kondo

发明人： Hiroaki Saeki ,  Teruo Asakawa ,  Noboru Masuoka ,  Masaki Kondo

IPC分类号： C23C16/458 ,  H01L21/683 ,  C23F1/02 ,  C23C14/50 ,  C23C16/52

CPC分类号： H01L21/6831 ,  C23C16/4586 ,  H01L21/6833

摘要： The plasma etching apparatus for a semiconductor wafer includes a susceptor provided in the vacuum process chamber. An electrostatic chuck for attracting and holding the wafer is provided on the susceptor. The electrostatic chuck comprises a chuck electrode provided on the susceptor via an insulative layer. The chuck electrode is connected to the positive terminal of the DC power supply via a switch. The chuck electrode is coated with a resistive layer, and the wafer is placed directly on the resistive layer. The resistive layer exhibits an electric resistivity of 1.times.10.sup.10 .OMEGA..multidot.cm to 1.times.10.sup.12 .OMEGA..multidot.cm in a temperature range for etching. The resistive layer is formed to have such a surface roughness that a center line average hight falls within a range of 0.1 to 1.5 .mu.m. When the potential of the positive terminal of the DC power supply is applied to the chuck electrode, and the wafer is grounded via plasma, a contact potential difference is created between the surface of the resistive layer and the rear surface of the wafer, generating an electrostatic attractive force, so that the wafer is attracted and held by the resistive layer.

摘要翻译： 用于半导体晶片的等离子体蚀刻装置包括设置在真空处理室中的基座。 用于吸引和保持晶片的静电卡盘设置在基座上。 静电卡盘包括通过绝缘层设置在基座上的卡盘电极。 卡盘电极通过开关连接到直流电源的正极端子。 卡盘电极涂覆有电阻层，晶片直接放置在电阻层上。 在蚀刻的温度范围内，电阻层的电阻率为1×10 10欧米伽xcm至1×10 12欧米伽×厘米。 电阻层形成为具有中心线平均高度在0.1〜1.5μm的范围内的表面粗糙度。 当直流电源的正端子的电位施加到卡盘电极并且晶片通过等离子体接地时，在电阻层的表面和晶片的后表面之间产生接触电位差，从而产生 静电吸引力，使得晶片被电阻层吸引并保持。

公开(公告)号：US06522942B2

公开(公告)日：2003-02-18

申请号：US09860913

申请日：2001-05-21

申请人： Masaki Kondo ,  Hiroaki Saeki

发明人： Masaki Kondo ,  Hiroaki Saeki

IPC分类号： G06F700

CPC分类号： H01L21/67259 ,  H01L21/681 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/139

摘要： A semiconductor processing system includes a transfer apparatus for transferring a wafer. The transfer apparatus has a pick arm member with wings. The reference distances between the wafer located at the normal position and the wings are stored in a memory of a CPU. Detection ranges of line sensors are set in a standby position in front of a process chamber in order to detect the distances between the wafer and the wings. In the CPU, the amount of positional shift of the wafer is detected based on the reference distances and the detected distances.

公开(公告)号：US08813722B2

公开(公告)日：2014-08-26

申请号：US12852905

申请日：2010-08-09

申请人： William T. Harvey ,  Steven J. Miller ,  Hiroaki Saeki

发明人： William T. Harvey ,  Steven J. Miller ,  Hiroaki Saeki

IPC分类号： F02M61/14

CPC分类号： F02M55/005 ,  F02M69/465 ,  F02M2200/852 ,  F02M2200/853 ,  Y10T29/53

摘要： A fuel injector for an internal combustion engine having an elongated body with a fuel inlet end and a fuel discharge end. The injector body includes an outwardly extending plate attached at a position between its ends and this plate includes at least one radially outwardly extending tab so that the cross-sectional shape of the plate is noncircular. A fuel cup receives the fuel inlet end of the fuel injector and includes a radially inwardly extending ledge at a mid position of the cavity. This ledge includes a through bore complementary in shape to the shape of the plate so that, with the fuel injector and plate aligned at a predetermined angular assembly position, the plate passes through the ledge upon insertion of the fuel injector into the cavity. Thereafter, rotation of the fuel injector and attached plate to a locking position positions the tabs above the ledge thus locking the fuel injector to the fuel cup.

摘要翻译： 一种用于内燃机的燃料喷射器，具有具有燃料入口端和燃料排出端的细长主体。 喷射器主体包括附接在其端部之间的位置处的向外延伸的板，并且该板包括至少一个径向向外延伸的突片，使得板的横截面形状是非圆形的。 燃料杯接收燃料喷射器的燃料入口端，并且在空腔的中间位置包括径向向内延伸的凸缘。 该凸缘包括与板的形状互补的通孔，使得当燃料喷射器和板在预定的角度组装位置对准时，板将燃料喷射器插入空腔中时通过凸缘。 此后，燃料喷射器和附接板旋转到锁定位置将突出部定位在突出部上方，从而将燃料喷射器锁定到燃料杯。

公开(公告)号：US20100244440A1

公开(公告)日：2010-09-30

申请号：US12414795

申请日：2009-03-31

申请人： Harsha Badarinarayan ,  Akira Inoue ,  Takashi Yoshizawa ,  Atsushi Hohkita ,  Hiroaki Saeki ,  Hiroshi Ono ,  Masahiro Soma ,  William Harvey ,  Steve Miller ,  Su-Wei Sung

发明人： Harsha Badarinarayan ,  Akira Inoue ,  Takashi Yoshizawa ,  Atsushi Hohkita ,  Hiroaki Saeki ,  Hiroshi Ono ,  Masahiro Soma ,  William Harvey ,  Steve Miller ,  Su-Wei Sung

IPC分类号： F16L27/04 ,  F16L9/00

CPC分类号： F16L27/047 ,  F02M37/0017 ,  F02M55/005 ,  F02M55/02 ,  F02M55/04 ,  F02M2200/306 ,  F02M2200/8084 ,  F02M2200/9015

摘要： A high pressure fuel pipe construction for an internal combustion engine, such as a direct injection engine. A conduit for the fuel is open at each end and a ball having a throughbore is slidably positioned over one end of the conduit. A reinforcing sleeve is positioned inside the end of the conduit so that the sleeve extends entirely through the ball. The sleeve, ball and the end of the conduit are then brazed together to attach the ball and conduit together. A double chamfer is provided at one end of the ball throughbore to facilitate inspection of the brazing quality. Additionally, a loop is formed in the conduit and a dampener is attached to the loop.

摘要翻译： 用于内燃机的高压燃料管构造，例如直喷式发动机。 用于燃料的导管在每个端部是开放的，并且具有通孔的球可滑动地定位在导管的一端上。 加强套管定位在导管的端部内部，使得套筒完全延伸穿过球。 然后将套筒，球和导管的端部钎焊在一起，将球和导管连接在一起。 在球透孔的一端设有双倒角，以便检查钎焊质量。 另外，在导管中形成环，并且阻尼器附接到环路。

公开(公告)号：US07427860B2

公开(公告)日：2008-09-23

申请号：US11743206

申请日：2007-05-02

申请人： Masashi Saito ,  Youichi Nakano ,  Hayato Sugawara ,  Hiroaki Saeki

发明人： Masashi Saito ,  Youichi Nakano ,  Hayato Sugawara ,  Hiroaki Saeki

IPC分类号： G01B7/30 ,  G01R33/06 ,  H01L43/08

CPC分类号： G01D3/0365 ,  F16H59/70 ,  F16H61/0003 ,  F16H61/32 ,  F16H63/304 ,  F16H2063/005 ,  G01D5/145 ,  G01D11/245 ,  G01D18/00 ,  H02K7/1166 ,  H02K11/21 ,  H02K11/38 ,  Y10T74/19251

摘要： A sensor and a control circuit are provided externally of a gear cover. A shift controller is operated by an electric actuator and a motor driven control module similar thereto. A rotating position detection sensor is thereby provided for a switching device without combination of a circuit and a sensor by oil or metal powder of a gear mechanism portion. The circuit includes a signal processing circuit that approximates an MR element output signal relative to the rotational angle of a body in which a magnet is mounted with a multi-function expressed as a three-dimensional formula.

摘要翻译： 传感器和控制电路设置在齿轮罩的外部。 变速控制器由电致动器和类似于其的电动机驱动控制模块操作。 由此，通过齿轮机构部分的油或金属粉末，不需要电路和传感器的组合来为开关装置提供旋转位置检测传感器。 该电路包括信号处理电路，该信号处理电路相对于以具有表示为三维公式的多重函数安装磁体的主体的旋转角度近似MR元件输出信号。

公开(公告)号：US20060015279A1

公开(公告)日：2006-01-19

申请号：US10534709

申请日：2003-11-13

申请人： Hiroaki Saeki ,  Toshio Kamigaki

发明人： Hiroaki Saeki ,  Toshio Kamigaki

IPC分类号： G01P21/00

CPC分类号： B62D57/032 ,  B25J9/1692 ,  B25J19/021 ,  H01L21/67766 ,  H01L21/681

摘要： A conveying mechanism (22) is disposed in a conveying vessel (10). The conveying mechanism includes: a moving member (38) which can move in a horizontal moving direction; a rotary table (48) attached to the moving member such that the rotary table can turn in a horizontal turning direction and move in the vertical direction; and two arm mechanisms which can bend and stretch in a horizontal operating direction relative to the rotary table. A reference position correcting device for the conveying mechanism includes: a light emitter (66) for emitting a sensing light beam (L); a light detector (68) for receiving the sensing light beam; and correcting means (62). The light emitter and the light detector are fixedly positioned on the conveying vessel. The correcting means corrects reference positions of the rotary table in the moving, vertical, and turning directions, and corrects a reference position of each of the arm mechanisms in the operating direction, based on a detection by the light detector about a light-transmitting state and a light-shielding state of the sensing light beam switched in compliance with the movement and the turn of the rotary table. A light-shielding member is attached on the rotary table, for switching the sensing light beam between the light-transmitting state and the light-shielding state, in compliance with the movement and the turn of the rotary table.

摘要翻译： 输送机构（22）设置在输送容器（10）中。 输送机构包括：能够沿水平移动方向移动的移动部件（38） 旋转台（48），其附接到所述移动构件，使得所述旋转台可以在水平转动方向上转动并沿垂直方向移动; 以及能够相对于旋转台在水平操作方向上弯曲和拉伸的两个臂机构。 用于输送机构的基准位置校正装置包括：用于发射感测光束（L）的光发射器（66）; 用于接收感测光束的光检测器（68）; 和校正装置（62）。 光发射器和光检测器固定地定位在输送容器上。 校正装置基于光检测器关于透光状态的检测，校正旋转台在移动，垂直和转动方向上的参考位置，并且校正每个臂机构在操作方向上的基准位置 并且所述感测光束的光屏蔽状态根据所述旋转台的移动和转动而切换。 遮光构件安装在旋转工作台上，用于根据旋转台的运动和转动将传感光束在透光状态和遮光状态之间切换。

公开(公告)号：US20050220582A1

公开(公告)日：2005-10-06

申请号：US11075707

申请日：2005-03-10

申请人： Motohiro Kumagai ,  Shigeru Ishizawa ,  Hiroaki Saeki

发明人： Motohiro Kumagai ,  Shigeru Ishizawa ,  Hiroaki Saeki

IPC分类号： B65B21/02 ,  H01L21/00 ,  H01L21/677 ,  H01L21/68

CPC分类号： H01L21/68 ,  H01L21/67167 ,  H01L21/67259 ,  H01L21/67778

摘要： A teaching method for storing in a controller a target moving position of a transfer mechanism in a processing system includes the steps of temporarily stopping the transfer mechanism in the middle of a moving route to a temporary moving destination position so as to make sure that the transfer mechanism does not interfere with another members at a potential interference location where there is a possibility that the transfer mechanism interferes with said another member, resuming to move the temporarily stopped transfer mechanism by inputting a moving instruction, repeating the temporarily stopping step and the resuming step, and when the pick reaches the temporary moving destination position, storing, as the target moving position, in the controller a position of the pick after adjusting and moving or without adjusting and moving the position of the pick.

摘要翻译： 一种用于在控制器中存储处理系统中的传送机构的目标移动位置的教学方法包括以下步骤：将移动路径中的传送机构临时停止到临时移动目的地位置，以确保传送 机构不影响潜在干扰位置处的另一构件，其中存在转印机构与所述另一构件干涉的可能性，通过输入移动指令恢复移动临时停止的转移机构，重复暂时停止步骤和恢复步骤 并且当拾取器到达临时移动目的地位置时，在调节和移动之后将控制器中的位置存储在控制器中，或者不调整和移动拾取器的位置。

公开(公告)号：US20050155823A1

公开(公告)日：2005-07-21

申请号：US10503947

申请日：2003-01-29

申请人： Tsutomu Hiroki ,  Hiroaki Saeki

发明人： Tsutomu Hiroki ,  Hiroaki Saeki

IPC分类号： B65G49/00 ,  H01L21/677 ,  H01L21/687 ,  B66B11/02

CPC分类号： H01L21/68742 ,  H01L21/68 ,  H01L21/68714 ,  H01L21/6875 ,  Y10S414/139

摘要： A supporting mechanism (12A) is used for transferring a target substrate (W) in cooperation with a transfer arm (32), in a semiconductor processing system. The supporting mechanism includes first and second holding portions (38A to 38C, 40A to 40C) each configured to be moved up and down and transfer a substrate to and from the transfer arm. The first and second holding portions are configured to be moved relative to each other in a vertical direction without spatially interfering with each other, and support substrates at substantially the same horizontal coordinate position. The supporting mechanism further includes first and second drives (46, 48) configured to move the first and second holding portions up and down, and a controller (68) configured to control the first and second drives. The controller is arranged to control the first and second drives to alternatively support a substrate by the first and second holding portions.

摘要翻译： 在半导体处理系统中，支撑机构（12A）用于与传送臂（32）协作传送目标衬底（W）。 支撑机构包括构造成上下移动的第一和第二保持部分（38A至38C，40A至40C），并将基板传送到传送臂和从传送臂传送。 第一保持部和第二保持部被配置为在垂直方向上相对于彼此移动而没有彼此空间干涉，并且将基板支撑在基本上相同的水平坐标位置。 支撑机构还包括构造成使第一和第二保持部分上下移动的第一和第二驱动器（46,48）以及被配置为控制第一和第二驱动器的控制器（68）。 控制器被布置成控制第一和第二驱动器以由第一和第二保持部分交替地支撑衬底。

公开(公告)号：US20050006230A1

公开(公告)日：2005-01-13

申请号：US10487241

申请日：2002-08-29

申请人： Masaki Narushima ,  Hiroaki Saeki

发明人： Masaki Narushima ,  Hiroaki Saeki

IPC分类号： B65G49/00 ,  C23C14/56 ,  H01L21/00 ,  H01L21/02 ,  H01L21/677 ,  C25B9/00 ,  H01L21/68

CPC分类号： H01L21/67167 ,  H01L21/67017 ,  H01L21/67184

摘要： A semiconductor processing system includes a common transfer chamber (34) having first and second compartments (46, 48) partitioned by a partition wall (44). First and second vacuum processing apparatuses (32E, 32A) are respectively connected to the first and second compartments (46, 48). A pressure control section (PCS) controls the pressures inside the first and second compartments (46, 48). The pressure control section (PCS) includes first and second vacuum pumps (68, 70) respectively connected to the first and second compartments (46, 48), and a line (76) connecting the delivery side of the second vacuum pump (70) to the suction side of the first vacuum pump (68). The pressure control section (PCS) performs a setting such that a second ultimate pressure or lowest operational pressure of the second compartment (48) is lower than a first ultimate pressure or lowest operational pressure of the first compartment (46).

摘要翻译： 半导体处理系统包括具有由分隔壁（44）分隔开的第一和第二隔室（46,48）的公共传送室（34）。 第一和第二真空处理装置（32E，32A）分别连接到第一和第二隔室（46,48）。 压力控制部分（PCS）控制第一和第二隔室（46,48）内部的压力。 压力控制部（PCS）包括分别连接到第一和第二隔室（46,48）的第一和第二真空泵（68,70）和连接第二真空泵（70）的输出侧的管线（76） 到第一真空泵68的吸入侧。 压力控制部（PCS）执行使得第二隔室（48）的第二极限压力或最低操作压力低于第一隔室（46）的第一极限压力或最低操作压力的设定。