摘要:
A production efficiency improving apparatus includes a first communicating means for communicating information with a plurality of processing apparatuses that process objects, and a second communicating means for communicating conveyance control information, with a conveyance system comprising conveyance apparatuses for conveying the objects between the plurality of processing apparatuses. A means for predicting, on the basis of information communicated by the first communicating means, the conveying timing at which the processing apparatus needs to send out processed objects, and the conveying timing at which the processing apparatus needs to bring in unprocessed objects. A generating means generates the control information such that the conveyance apparatus will arrive at the processing apparatus that is the destination of the communication of information at the predicted timing predicted by the means for predicting.
摘要:
There is provided a transfer apparatus capable of increasing the length of a transfer arm when it is extended, without increasing the size of the transfer arm when it is contracted. The transfer apparatus 4 comprising a transfer arm 17 which comprises: two rotating shafts 5 and 6 arranged coaxially or in parallel; a pair of first arms 7 and 8, one end portions of which are fixed to the rotating shafts 5 and 6, respectively; a pair of second arms 10 and 11, one end portions of which are connected to the other end portions of the pair of first arms 7 and 8 by means of pins, respectively; and a holding portion 14 for holding an object w to be processed, the holding portion 14 being connected to each of the other end portions of the pair of second arms 10 and 11 by means of pins, wherein the second arms 10 and 11 cross each other.
摘要:
The present invention provides a semiconductor device manufacturing line for applying a series of processes on a semiconductor substrate, and forming an integrated circuit on the semiconductor substrate by employing a semiconductor wafer having a diameter of 6 inches (150±3 mm: SEAJ specification) or less for the semiconductor substrate. This manufacturing line comprises two sub-lines conforming to the same specifications, each of these sub-lines is composed of a series of processing units including a film forming unit, a pattern exposure unit, an etching unit, and a test unit. In at least one pattern exposure unit and one etching unit, fine processing of 0.3 μm or less can be performed.
摘要:
A transfer arm apparatus has first, second, and third arms. The second arm has a proximal link pivotally mounted on the distal end of the first arm, and first and second links connecting the proximal link and the third arm to constitute a link mechanism. The first and second links form a first pair of parallel links, and the proximal link and the third link form a second pair of parallel links connecting the first pair of parallel links. A transmission is contained in the first arm, and has an axial shaft and a hollow axial shaft coaxially arranged at the distal end of the first arm. The axial shaft transmits a rotational driving force to the first pair of parallel links, and the hollow axial shaft transmits a rotational driving force to the second pair of parallel links through the proximal link.
摘要:
A plurality of projections 21 is disposed on a inner surface of a lid 20 which is detachably attached to a carrier body 10. Each projection 21 has a tapered end part 22 with inclined surfaces 23, 24. The surfaces 23, 24 are in the form of semitransparent mirror. A Light emitting device 47 projects light beam which travels horizontally to the projection 21 from outside of the lid 20. When a wafer is not present in slots 15 of the carrier body, the light beam travels to upper and lower adjacent photoelectric devices 48, 48 via the upper and lower adjacent projections 21. The semitransparent mirror 23, 24 changes the light beam traveling direction. When the wafer is present in the slots 15, the light beam is intercepted by the wafer, and the photoelectric devices 48 does not receive the light beam. In aforementioned manner, whether a wafer is present or not in the slots 15 can be detected.
摘要:
Vacuum process chambers are increased or decreased in number when the kind or order of processes is changed, and the shape and size of the transfer chamber are changed with the increase or decrease of the number of the vacuum process chambers, without entailing any change in a load-lock chamber and a transfer arm. The transfer arm has a minimum radius of rotation such that the arm can rotate in a transfer chamber of a minimum size corresponding to a minimum number of vacuum process chambers and a maximum arm reach such that the arm can deliver an object to-be-treated between each vacuum process chamber and a transfer chamber of a maximum size corresponding to a maximum number of vacuum process chambers. Thus, even though the number of the vacuum process chambers are increased or decreased with the change of the processes, it is necessary only that the shape and size of the transfer chamber be changed, and the other components, such as the load-lock chamber, transfer arm, etc., can be used in common, so that the manufacture and assembling of the system are very easy, ensuring a reduction in cost. Also, reduced-pressure treatment apparatus and a normal-pressure treatment apparatus are connected to each other by means of the load-lock chamber for replacement between the atmosphere and vacuum.
摘要:
A device for positioning a semiconductor substrate is provided comprising magnetic field group formed from a plurality of magnetic fields disposed on a plane in a two-dimensional array. The magnetic fields are provided with a perpendicular orientation relative to the plane and adjacent magnetic fields are directed in alternate directions. Coil sets are formed of a plurality of coils, the coils having a specific dimensional relationship with the magnetic field array. Coil groups are formed by fixedly securing a plurality of these coil sets to each other the coil groups being disposed within the magnetic field group so as to be freely movable along the plane. Electric current is applied to the coils which generates a force in each coil set so as to move the coil set in either one of the longitudinal and lateral directions of the array of magnetic fields, whereby a current-motion converter and a driving device making use of the converter can be formed.
摘要:
Positioning of a movable body can be achieved at a high resolution by making use of two position signals generated by a position detector, whose magnitudes are sinusoidal functions having different phases of the position of the movable body. On the basis of the two sinusoidal position signals, two bi-level digital position signals having different phase from each other are derived, and digital control for movement of the movable body is effected by making use of these two bi-level digital position signals until the movable body is brought into the proximity of a desired position. Thereafter, control is switched from the digital control to analog control for movement of the movable body, in which a position signal whose manitude is a sinusoidal function of the position of the movable body and has a zero-cross point at the desired position is used as a reference position signal. This reference position signal can be synthesized from the two position signals generated by the position detector by means of a simple signal synthesizer circuit according to the present invention. The signal synthesizer circuit comprises two multiplier type digital-analog converters, each of which is applied with a digital input signal and an analog input signal such as, for example, the above-mentioned sinusoidal position signal generated by the position detector and generates an analog output signal that is product including an algebraic sign of the digital input signal and the analog input signal, and an adder having the respective analog output signals of the two multiplier type digital-analog converters applied to its input. By appropriately selecting the digital values of the digital input signals, a desired reference position signal can be derived at the output of the adder.
摘要:
A processing indicating device to improve the efficiency of processing on an object. The device includes a first communication unit which communicates information with a plurality of processing devices for processing the object and a second communication unit which communicates information with a conveyance controlling device controlling conveying of the object to the plurality of processing devices. An arrival time predicting unit predicts on the basis of information received by the second communication unit, the time when the conveying device arrives at one of the processing devices. In addition, a finish time predicting unit receives information and predicts the time when the processing on the object in the one processing device finishes. A processing indicating unit causes processing control information that orders the execution of device state improvement treatment to be transmitted to the one processing device on the basis of the predicted respective times.
摘要:
A processing indicating device to improve the efficiency of processing on an object. The device includes a first communication unit which communicates information with a plurality of processing devices for processing the object and a second communication unit which communicates information with a conveyance controlling device controlling conveying of the object to the plurality of processing devices. An arrival time predicting unit predicts on the basis of information received by the second communication unit, the time when the conveying device arrives at one of the processing devices. In addition, a finish time predicting unit receives information and predicts the time when the processing on the object in the one processing device finishes. A processing indicating unit causes processing control information that orders the execution of device state improvement treatment to be transmitted to the one processing device on the basis of the predicted respective times.