CHARGED PARTICLE SEPARATION APPARATUS AND CHARGED PARTICLE BOMBARDMENT APPARATUS
    1.
    发明申请
    CHARGED PARTICLE SEPARATION APPARATUS AND CHARGED PARTICLE BOMBARDMENT APPARATUS 审中-公开
    充电颗粒分离装置和充电颗粒物料装置

    公开(公告)号:US20100319545A1

    公开(公告)日:2010-12-23

    申请号:US12818758

    申请日:2010-06-18

    IPC分类号: B03C3/68 B03C3/38

    摘要: A charged particle separation apparatus that separates ionized gas clusters is disclosed. The charged particle separation apparatus includes three or more electric field applying parts arranged in an incident direction of an ionized gas cluster, wherein each of the electric field applying parts includes a pair of electrodes; an electric power source configured to supply alternating-current electric voltages to the three or more electric field applying parts in such a manner that an alternating-current electric voltage applied across one pair of the electrodes of one of the three or more electric field applying parts is different in phase from an alternating-current voltage applied across another pair of the electrodes of an adjacent one of the three or more electric field applying parts; and a plate including an opening in an extension of the incident direction.

    摘要翻译: 公开了一种分离离子化气体簇的带电粒子分离装置。 带电粒子分离装置包括沿电离气体簇的入射方向配置的三个以上的电场施加部,其中,各电场施加部包括一对电极; 电源,被配置为向三个或更多个电场施加部提供交流电压,使得施加在三个或更多个电场施加部中的一个的一对电极上的交流电压 与施加在三个或更多个电场施加部件中相邻一个的另一对电极上的交流电压的相位不同; 以及包括在入射方向的延伸部中的开口的板。

    Charged particle separation apparatus and charged particle bombardment apparatus
    2.
    发明授权
    Charged particle separation apparatus and charged particle bombardment apparatus 有权
    带电粒子分离装置和带电粒子轰击装置

    公开(公告)号:US08168946B2

    公开(公告)日:2012-05-01

    申请号:US12816512

    申请日:2010-06-16

    IPC分类号: H01J49/28 H01J3/26

    CPC分类号: H01J49/282

    摘要: A charged particle separation apparatus that separates ionized gas clusters is disclosed. The charged particle separation apparatus includes an electric field applying part including two electrodes across which electric voltage is applied in order to generate electric field between the two electrodes thereby deflecting a trajectory of the ionized gas cluster, the electrodes including one of an opening and a void; and a plate opening that allows the ionized gas cluster whose trajectory is deflected by the electric field applying part to go therethrough.

    摘要翻译: 公开了一种分离离子化气体簇的带电粒子分离装置。 带电粒子分离装置包括电场施加部分,其包括施加电压的两个电极,以便在两个电极之间产生电场,从而偏转电离气体簇的轨迹,电极包括开口和空隙之一 ; 以及允许由电场施加部件偏转轨迹的离子化气体团簇通过的板状开口。

    CHARGED PARTICLE SEPARATION APPARATUS AND CHARGED PARTICLE BOMBARDMENT APPARATUS
    3.
    发明申请
    CHARGED PARTICLE SEPARATION APPARATUS AND CHARGED PARTICLE BOMBARDMENT APPARATUS 有权
    充电颗粒分离装置和充电颗粒物料装置

    公开(公告)号:US20100320380A1

    公开(公告)日:2010-12-23

    申请号:US12816512

    申请日:2010-06-16

    IPC分类号: B01D59/44

    CPC分类号: H01J49/282

    摘要: A charged particle separation apparatus that separates ionized gas clusters is disclosed. The charged particle separation apparatus includes an electric field applying part including two electrodes across which electric voltage is applied in order to generate electric field between the two electrodes thereby deflecting a trajectory of the ionized gas cluster, the electrodes including one of an opening and a void; and a plate opening that allows the ionized gas cluster whose trajectory is deflected by the electric field applying part to go therethrough.

    摘要翻译: 公开了一种分离离子化气体簇的带电粒子分离装置。 带电粒子分离装置包括电场施加部分,其包括施加电压的两个电极,以便在两个电极之间产生电场,从而偏转电离气体簇的轨迹,电极包括开口和空隙之一 ; 以及允许由电场施加部件偏转轨迹的离子化气体团簇通过的板状开口。

    Ultra precise polishing method and ultra precise polishing apparatus
    4.
    发明授权
    Ultra precise polishing method and ultra precise polishing apparatus 有权
    超精密抛光方法和超精密抛光装置

    公开(公告)号:US07420189B2

    公开(公告)日:2008-09-02

    申请号:US11397140

    申请日:2006-04-04

    IPC分类号: G21K5/10

    摘要: An ultra precise polishing method includes controlling an irradiation time of a surface position of an object to be processed irradiated by a gas cluster ion beam. A profile is created and polished on the surface of the object to be processed by controlling irradiation of the gas cluster ion beam. An ultra precise polishing apparatus includes an irradiating device for irradiating a surface of an object to be processed by a gas cluster ion beam. A positioning device is provided for changing a surface position of the object to be processed, which is irradiated by the gas cluster ion beam by moving the irradiating device and the object to be processed relative to each other. A control device is provided for controlling the irradiation time of a surface position of the object to be processed irradiated by the gas cluster ion beam.

    摘要翻译: 超精密抛光方法包括控制由气体簇离子束照射的待处理物体的表面位置的照射时间。 通过控制气体簇离子束的照射,在要处理的物体的表面上产生并抛光轮廓。 超精密抛光装置包括用于通过气体簇离子束照射被处理物体的表面的照射装置。 提供了一种定位装置,用于通过相对于彼此移动照射装置和待处理对象来改变由气体簇离子束照射的被处理物体的表面位置。 提供控制装置,用于控制由气体簇离子束照射的待处理物体的表面位置的照射时间。

    Production method of SiC monitor wafer
    6.
    发明授权
    Production method of SiC monitor wafer 有权
    SiC监测晶圆的生产方法

    公开(公告)号:US07022545B2

    公开(公告)日:2006-04-04

    申请号:US10502537

    申请日:2003-01-10

    摘要: The present invention has its object to obtain an SiC monitor wafer which can flatten the surface until particle detection is possible. SiC of a crystal system 3C is deposited on a substrate by a CVD (Chemical Vapor Deposition) method, and the SiC is detached from a substrate. After the SiC surface is flattened by using mechanical polishing alone or in combination with CMP (Chemo Mechanical Polishing), GCIB (Gas Cluster Ion Beam) is irradiated to the surface until the surface roughness becomes Ra=0.5 nm or less and the impurity density of the wafer surface becomes 1*1011 atoms/cm2 or less to produce the SiC monitor wafer.

    摘要翻译: 本发明的目的是获得可以使表面变平的SiC监测晶片,直到可以进行粒子检测。 通过CVD(化学气相沉积)法将晶体系统3C的SiC沉积在衬底上,并且将SiC从衬底上分离。 在通过单独使用机械抛光或与CMP(Chemo Mechanical Polishing)组合使SiC表面平坦化之后,将GCIB(气体簇离子束)照射到表面,直到表面粗糙度变为Ra = 0.5nm以下,杂质浓度 晶片表面变为1×10 11原子/ cm 2或更小,以产生SiC监测晶片。