摘要:
By forming a metallic coating on a sufficiently cleaned semiconductor substrate through ion plating, a low power loss and high switching speed semiconductor device is obtained which differs from an ordinary semiconductor device with a diffused junction. In an interface between the metallic coating and the semiconductor substrate, a considerably thin metal-injected layer is formed toward the semiconductor substrate. Schottky barrier devices may be formed by the method of the invention.
摘要:
A method of forming thin films wherein a film is formed through glow discharge such as ion plating or sputtering by using a mask whose surface in contact with the surface of the substrate on which the film is formed is provided with a thermostable elastic member, whereby the film, for use in multi-layer metallization, can be formed with high dimensional precision and intimacy.
摘要:
A narrow track width magnetic head can be formed using an integrated circuit formation techniques such as evaporation plating, chemical etching, etc. But, there has been such a problem that it is difficult to provide a center tap in a conventional thin film magnetic head structure including coils of four or more turns. A magnetic head according to the present invention comprising a coil divided into two sections by the center tap, the electrostatic capacitance of each section being substantially the same. The coil may be formed into a precise pattern with ease by photoetching technique. A plurality of sets of conductive films insulated from one another are provided crossing a magnetic core, each set consisting of two conductive films of the same pattern. The alternating layers of the conductive films are connected on the backward of a magnetic gap to provide the two sections of the coil. A center tap is derived from a connection portion of the two sections of the coil and a coil terminal is provided at each of the opposite free ends of the coil. Thus, the thin film magnetic head having a multi-turn coil with a center tap is provided.
摘要:
A thin film integrated circuit consists of a first conductor of aluminum extended in any desired direction on an insulating substrate, an anodized film formed by anodization in a chromic acid solution at positions other than cross-connectional parts on the first conductor, a second conductor cross-connected on the first conductor, and an anodized film formed by anodization in a chromic acid solution on the surface of the second conductor. The thin film integrated circuit is prepared by partially forming an anodized film in a sulfuric acid or oxalic acid solution at cross-connectional parts of a first conductor of aluminum so as not to form any anodized film in a chromic acid solution at the cross-sectional parts of the first conductor of the circuit, masking the partially formed anodized film with a photoresist film, then forming an anodized film by a chromic acid solution, and then removing the photoresist film and the anodized film. After the cross-sectional parts of the first conductor are exposed thereby, a second conductor is formed. For an etching solution for anodized film, which is anodized using the sulfuric acid or oxalic acid solution, a mixed solution consisting of 60 to 40 g/l of chromic acid and 40 to 300 g/l of oxidative acid is used.
摘要:
A protective film (10) is eccentrically adhered to a concave-side transfer surface (3b) of a first mold (3) which is used in a plastic lens forming mold, and part (10a) of the peripheral portion of the protective film is projected laterally from the mold (3). The protective film (10) comprises a film layer with an outer diameter smaller than that of the first mold (3), and an adhesive layer with a relatively low adhesive strength which is formed on one surface of the film layer.
摘要:
A boiler tube and a method for manufacturing the same are disclosed in which an inner surface of the boiler tube used in the center of a high-temperature, high-pressure boiler is formed with a spinel layer consisting of an oxide of iron, chromium and nickel, which is exposed. The specific method of the manufacture is that after the boiler tube is brought into contact with high temperature steam, a magnetic iron (Fe.sub.3 O.sub.4) layer produced on the inner surface is removed.
摘要翻译:公开了一种锅炉管及其制造方法,其中在高温高压锅炉的中心使用的锅炉管的内表面形成有尖晶石层,该尖晶石层由铁,铬的氧化物和 镍,暴露。 制造的具体方法是在锅炉管与高温蒸汽接触后,在内表面上产生的磁铁(Fe 3 O 4)层被去除。
摘要:
A clip capable of connecting to the panel member may include a clip body and a sealing body. The clip body includes an anchor that is capable of being engaged with an attaching hole formed in the panel member, and a support portion that is arranged and constructed to be pressed to a surface of the panel member when the anchor is engaged with the attaching hole of the panel member. The sealing body includes a lip portion that is positioned in an inner side of an outer circumference of the support portion.
摘要:
The present invention relates to a method of manufacturing a polarizing lens comprising: polishing in a constant direction one of surfaces of a first mold for forming one of surfaces of a lens; disposing a second mold, for forming the other surface of the lens, opposite the first mold with a prescribed gap therebetween, and forming a cavity by occluding the gap, wherein the two molds are disposed so that the surface that has been polished is positioned within the cavity; casting a lens starting material liquid containing a curable component into the cavity and conducting a reaction to cure the curable component within the cavity to obtain a lens substrate having a surface to which a surface shape of the polished surface has been transferred; and forming a polarizing film on the surface of the lens substrate by coating a coating liquid containing a dichroic dye.
摘要:
A protective film (10) is eccentrically adhered to a concave-side transfer surface (3b) of a first mold (3) which is used in a plastic lens forming mold, and part (10a) of the peripheral portion of the protective film is projected laterally from the mold (3). The protective film (10) comprises a film layer with an outer diameter smaller than that of the first mold (3), and an adhesive layer with a relatively low adhesive strength which is formed on one surface of the film layer.