公开(公告)号：US08754510B2

公开(公告)日：2014-06-17

申请号：US13577362

申请日：2011-11-30

申请人： Masanori Minamio ,  Zyunya Tanaka ,  Ryoutarou Imura

发明人： Masanori Minamio ,  Zyunya Tanaka ,  Ryoutarou Imura

IPC分类号： H01L23/495

CPC分类号： B21D39/032 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A conduction path includes a first conduction path forming plate (11) made of a first metal and having a through hole (13), and a second conduction path forming plate (15) made of a second metal and having a press-fit portion (17) press-fitted into the through hole. A wall surface of the through hole and a side surface of the press-fit portion forms an inclined bonding surface (18) inclined relative to a normal line of an overlap surface of the first conduction path forming plate and the second conduction path forming plate, and a bonding portion (25) formed by metal flow is formed in a region located in a periphery of the inclined bonding surface.

摘要翻译： 导电路径包括由第一金属制成并具有通孔（13）的第一导电路径形成板（11）和由第二金属制成并具有压配部分的第二导电路径形成板（15） 17）压入通孔。 通孔的壁面和压入部的侧面形成相对于第一导电路形成板和第二导电路径形成板的重叠面的法线倾斜的倾斜接合面（18） 并且在位于倾斜接合表面的周边的区域中形成由金属流形成的接合部分（25）。

公开(公告)号：US20120299166A1

公开(公告)日：2012-11-29

申请号：US13577362

申请日：2011-11-30

申请人： Masanori Minamio ,  Zyunya Tanaka ,  Ryoutarou Imura

发明人： Masanori Minamio ,  Zyunya Tanaka ,  Ryoutarou Imura

IPC分类号： H01L23/495 ,  B23K20/00 ,  H01L21/58

CPC分类号： B21D39/032 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A conduction path includes a first conduction path forming plate (11) made of a first metal and having a through hole (13), and a second conduction path forming plate (15) made of a second metal and having a press-fit portion (17) press-fitted into the through hole. A wall surface of the through hole and a side surface of the press-fit portion forms an inclined bonding surface (18) inclined relative to a normal line of an overlap surface of the first conduction path forming plate and the second conduction path forming plate, and a bonding portion (25) formed by metal flow is formed in a region located in a periphery of the inclined bonding surface.

摘要翻译： 导电路径包括由第一金属制成并具有通孔（13）的第一导电路径形成板（11）和由第二金属制成并具有压配部分的第二导电路径形成板（15） 17）压入通孔。 通孔的壁面和压入部的侧面形成相对于第一导电路形成板和第二导电路径形成板的重叠面的法线倾斜的倾斜接合面（18） 并且在位于倾斜接合表面的周边的区域中形成由金属流形成的接合部分（25）。

公开(公告)号：US20070212478A1

公开(公告)日：2007-09-13

申请号：US11713099

申请日：2007-03-02

申请人： Takahiro Fukunaga ,  Ryoutarou Imura

发明人： Takahiro Fukunaga ,  Ryoutarou Imura

IPC分类号： H05K3/00

CPC分类号： H05K3/389 ,  B29C39/10 ,  B29L2011/00 ,  B29L2011/0083 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49503 ,  H01L23/49586 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01003 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H05K3/28 ,  Y10T428/29 ,  Y10T428/31522 ,  Y10T428/31678 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： There is provided a semiconductor device that suppresses the occurrence of resin burrs and has favorable electrical connectivity and bond strength, and a manufacturing method for such semiconductor device. A resin-coated metal part is manufactured by forming an organic coating by depositing a material including functional organic molecules on a wiring lead composed of a metallic material. Each of the functional organic molecules includes a main chain, a first functional group having a metal bonding property, and a second functional group. The first functional group and the second functional group are provided at different ends of the main chain. Thereafter the functional organic molecules self-assemble by bonding of the first functional groups to metal atoms of the wiring lead. After performing the organic coating formation step, resin is adhered to a predetermined surface area of the wiring lead having the organic coating formed thereon.

摘要翻译： 提供了抑制树脂毛刺的发生并具有良好的电连接性和接合强度的半导体装置，以及这种半导体装置的制造方法。 通过在由金属材料构成的布线上沉积包括功能性有机分子的材料来形成有机涂层来制造树脂涂覆的金属部件。 每个功能性有机分子包括主链，具有金属键合性的第一官能团和第二官能团。 第一官能团和第二官能团提供在主链的不同端。 此后，功能性有机分子通过将第一官能团与引线引线的金属原子结合而自组装。 在进行有机涂层形成步骤之后，将树脂粘附到其上形成有机涂层的配线的预定表面区域。

公开(公告)号：US09017822B2

公开(公告)日：2015-04-28

申请号：US11713099

申请日：2007-03-02

申请人： Takahiro Fukunaga ,  Ryoutarou Imura

发明人： Takahiro Fukunaga ,  Ryoutarou Imura

IPC分类号： H05K3/00 ,  H01L23/28 ,  H05K3/38 ,  B29C39/10 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00 ,  B29L11/00 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H05K3/28

CPC分类号： H05K3/389 ,  B29C39/10 ,  B29L2011/00 ,  B29L2011/0083 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49503 ,  H01L23/49586 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01003 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H05K3/28 ,  Y10T428/29 ,  Y10T428/31522 ,  Y10T428/31678 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： There is provided a semiconductor device that suppresses the occurrence of resin burrs and has favorable electrical connectivity and bond strength, and a manufacturing method for such semiconductor device. A resin-coated metal part is manufactured by forming an organic coating by depositing a material including functional organic molecules on a wiring lead composed of a metallic material. Each of the functional organic molecules includes a main chain, a first functional group having a metal bonding property, and a second functional group. The first functional group and the second functional group are provided at different ends of the main chain. Thereafter the functional organic molecules self-assemble by bonding of the first functional groups to metal atoms of the wiring lead. After performing the organic coating formation step, resin is adhered to a predetermined surface area of the wiring lead having the organic coating formed thereon.

摘要翻译： 提供了抑制树脂毛刺的发生并具有良好的电连接性和接合强度的半导体装置，以及这种半导体装置的制造方法。 通过在由金属材料构成的布线上沉积包括功能性有机分子的材料来形成有机涂层来制造树脂涂覆的金属部件。 每个功能性有机分子包括主链，具有金属键合性的第一官能团和第二官能团。 第一官能团和第二官能团提供在主链的不同端。 此后，功能性有机分子通过将第一官能团与引线引线的金属原子结合而自组装。 在进行有机涂层形成步骤之后，将树脂粘附到其上形成有机涂层的配线的预定表面区域。

公开(公告)号：US20120133034A1

公开(公告)日：2012-05-31

申请号：US13213882

申请日：2011-08-19

申请人： Ryoutarou Imura ,  Akira Asada

发明人： Ryoutarou Imura ,  Akira Asada

IPC分类号： H01L23/495 ,  H01R43/00

CPC分类号： H01L23/49537 ,  H01L21/4842 ,  H01L2924/0002 ,  Y10T29/49121 ,  H01L2924/00

摘要： In a lead frame for an electronic component according to the present invention, a metal plate 3 is extended by a punch 5 into a hole 4 formed on a metal plate 2 and the two metal plates are connected on the inner surface of the hole 4, thereby improving a bonding strength while keeping the small size and thickness of the lead frame with a simple method.

摘要翻译： 在根据本发明的电子部件的引线框架中，金属板3通过冲头5延伸到形成在金属板2上的孔4中，并且两个金属板连接在孔4的内表面上， 从而提高接合强度，同时以简单的方法保持引线框架的小尺寸和厚度。