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公开(公告)号：US4173900A
公开(公告)日：1979-11-13
申请号：US883589
申请日：1978-03-06
申请人： Masanori Tanabe , Satoshi Shimada , Motohisa Nishihara , Kazuji Yamada , Yasumasa Matsuda , Michitaka Shimazoe , Yoshitaka Matsuoka , Yukio Takahashi , Katsuya Katohgi , Mitsuo Ai
发明人： Masanori Tanabe , Satoshi Shimada , Motohisa Nishihara , Kazuji Yamada , Yasumasa Matsuda , Michitaka Shimazoe , Yoshitaka Matsuoka , Yukio Takahashi , Katsuya Katohgi , Mitsuo Ai
CPC分类号： G01L9/0054 , H01L29/84
摘要： A semiconductor pressure transducer comprising a disc-shaped pressure-responsive diaphragm; a pair of radial strain gauge units having a piezoresistance effect, formed by injecting an impurity in the radial direction in the surface of the diaphragm; and a pair of tangential strain gauge units having a piezoresistance effect, formed by injecting an impurity in the tangential direction in the surface of the diaphragm, wherein the distance from the pair of the radial strain gauge units to the center of the circular diaphragm is greater than the distance from the pair of the tangential strain gauge units to the center of the circular diaphragm.
摘要翻译： 一种半导体压力传感器，包括盘形压力响应膜片; 一对具有压阻效应的径向应变计单元，其通过在所述隔膜的表面中沿径向注入杂质而形成; 以及具有压阻效应的一对切向应变计单元，其通过在隔膜的表面中沿切线注入杂质形成，其中从一对径向应变计单元到圆形隔膜的中心的距离更大 比从一对切向应变计单元到圆形隔膜中心的距离。
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公开(公告)号：US4173148A
公开(公告)日：1979-11-06
申请号：US948778
申请日：1978-10-05
申请人： Kazuji Yamada , Hideo Sato , Tsutomu Okayama , Motohisa Nishihara , Yoshitaka Matsuoka , Katsuya Katohgi , Yasumasa Matsuda , Satoshi Shimada
发明人： Kazuji Yamada , Hideo Sato , Tsutomu Okayama , Motohisa Nishihara , Yoshitaka Matsuoka , Katsuya Katohgi , Yasumasa Matsuda , Satoshi Shimada
CPC分类号： G01B7/18 , G01L1/2281 , G01L1/2293
摘要： A bridge circuit with four arms including semiconductor strain gauge elements has input terminals for coupling a DC power supply with a pair of diagonally opposite junctions of the bridge circuit per se and output terminals coupled with a pair of remaining diagonally opposite junctions. Initial zero-point temperature compensators each are connected in series and in parallel to each of semiconductor strain gauge elements on adjacent two arms of the bridge circuit. Temperature compensators for zero-point shift adjustment are each provided between the adjacent arms closer to each output terminal. A temperature compensator for span adjustment is provided between one of the input terminals and the DC power source. A constant current control unit for feeding a constant current to the bridge circuit is provided between the other input terminal and the DC power supply.
摘要翻译： 具有包括半导体应变计元件的四个臂的桥接电路具有用于将直流电源与桥接电路本身的一对斜对置接头连接的输入端子以及与一对剩余的对角线相对的接合部连接的输出端子。 初始零点温度补偿器各自与桥式电路的相邻两个臂上的每个半导体应变计元件串联并联。 用于零点移位调整的温度补偿器分别设置在靠近每个输出端子的相邻臂之间。 在一个输入端子和直流电源之间提供用于量程调节的温度补偿器。 在另一个输入端子和直流电源之间设置用于向桥式电路馈送恒定电流的恒定电流控制单元。
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公开(公告)号：US4166384A
公开(公告)日：1979-09-04
申请号：US940077
申请日：1978-09-06
申请人： Yasumasa Matsuda , Kazuji Yamada , Satoshi Shimada , Motohisa Nishihara , Tomio Yasuda , Masatoshi Tsuchiya , Ko Soeno , Mitsuo Ai , Takeo Nagata , Yoshitaka Matsuoka
发明人： Yasumasa Matsuda , Kazuji Yamada , Satoshi Shimada , Motohisa Nishihara , Tomio Yasuda , Masatoshi Tsuchiya , Ko Soeno , Mitsuo Ai , Takeo Nagata , Yoshitaka Matsuoka
IPC分类号： G01L1/26 , C21D8/00 , C22C38/00 , C22C38/10 , G01D5/16 , G01L1/22 , G01L9/00 , G01L1/04 , G01L1/18
CPC分类号： G01L1/2293 , G01L9/0055
摘要： A semiconductor transducer comprising an improved strain-yielding body yielding a strain in response to the impartation of a force or displacement, and a semiconductor strain gauge bonded to the strain-yielding body. The improved strain-yielding body is made of an iron-nickel-cobalt alloy containing 28.2 to 31.0% by weight of nickel and 15.0 to 19.5% by weight of cobalt. This iron-nickel-cobalt alloy is initially heated up to a temperature above 600.degree. C. for the purpose of standard heat treatment for removing its internal strain. After the standard heat treatment, the iron-nickel-cobalt alloy is subjected to cold working at a working rate of more than and including 60%, and is then subjected to heat treatment at a temperature between 350.degree. C. and 600.degree. C. The heat-treated iron-nickel-cobalt alloy is shaped into the predetermined form of the strain-yielding body.
摘要翻译： 一种半导体换能器，其包括响应于施加力或位移而产生应变的改进的应变屈服体以及结合到应变屈服体的半导体应变仪。 改进的应变产生体由含有28.2至31.0重量％的镍和15.0至19.5重量％的钴的铁镍钴合金制成。 为了去除其内部应变，这种铁镍钴合金最初被加热到高于600℃的温度以进行标准热处理。 经过标准热处理后，铁镍钴合金以大于60％的加工速度进行冷加工，然后在350℃〜600℃的温度下进行热处理。 热处理的铁镍钴合金被成形为应变产生体的预定形式。
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公开(公告)号：US4303903A
公开(公告)日：1981-12-01
申请号：US77838
申请日：1979-09-21
申请人： Yoshitaka Matsuoka , Michitaka Shimazoe , Yoshimi Yamamoto , Mitsuo Ai , Keiji Miyauchi , Hideyuki Nemoto , Masatoshi Tsuchiya , Masanori Tanabe
发明人： Yoshitaka Matsuoka , Michitaka Shimazoe , Yoshimi Yamamoto , Mitsuo Ai , Keiji Miyauchi , Hideyuki Nemoto , Masatoshi Tsuchiya , Masanori Tanabe
CPC分类号： G01L19/0645 , G01L19/147
摘要： A pressure transducer comprising a silicon diaphragm on which a semiconductor strain gauge is formed and which has a diaphragm portion deformable in response to a pressure, an insulating support which is made of borosilicate glass having the silicon diaphragm rigidly mounted thereon and which is provided with a pressure introducing hole in its central part, a metallic support which is cylindrical, which is made of an iron-nickel alloy similar in the thermal expansion coefficient to the borosilicate glass and on which the glass insulating support is rigidly mounted, and a metallic housing within which the integrated structure consisting of the silicon diaphragm, the glass insulating support and the metallic support is arranged; the silicon diaphragm, the insulating support and the metallic support being joined by the anodic bonding, the metallic support being rigidly welded to the metallic housing at its lower end part.
摘要翻译： 一种压力传感器，包括其上形成有半导体应变仪的硅膜片，并且具有响应于压力可变形的隔膜部分，由硼硅玻璃制成的绝缘支撑件，所述绝缘支撑件具有刚性地安装在其上的硅膜片，并且设置有 在其中心部分具有压力导入孔，金属支撑体是圆柱形的，其由热膨胀系数类似于铁硅镍合金的硼硅酸盐玻璃制成，玻璃绝缘支架刚性地安装在其上，金属壳体 设置由硅隔膜，玻璃绝缘支架和金属支架构成的集成结构; 硅隔膜，绝缘支撑件和金属支撑件通过阳极接合而接合，金属支撑件在其下端部处刚性地焊接到金属外壳。
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公开(公告)号：US4364276A
公开(公告)日：1982-12-21
申请号：US217023
申请日：1980-12-16
申请人： Michitaka Shimazoe , Yoshitaka Matsuoka , Ryozo Akahane , Yasushi Shimizu , Hideyuki Nemoto , Masanori Tanabe
发明人： Michitaka Shimazoe , Yoshitaka Matsuoka , Ryozo Akahane , Yasushi Shimizu , Hideyuki Nemoto , Masanori Tanabe
CPC分类号： G01L19/147 , G01L13/025 , G01L19/0038 , G01L19/0084 , G01L19/0645 , G01L9/0054
摘要： A differential pressure measuring transducer assembly including a measuring diaphragm formed of semiconductor material having gauge resistance elements on one surface thereof and a central boss area of large thickness and a peripheral support flange on the other surface thereof defining therebetween an annular portion of small thickness. The measuring diaphragm is attached at the peripheral support flange to a glass support member and a metallic support member formed with pressure conducting bores respectively communicating with each other. The metallic support member is formed of material having a Young's modulus substantially equal to that of the measuring diaphragm.
摘要翻译： 一种差压测量传感器组件，包括由在其一个表面上具有表阻力元件的半导体材料形成的测量膜片和在其另一表面上的周边支撑凸缘，所述测量膜片在其间形成有小厚度的环形部分。 测量膜片在外围支撑凸缘处附接到玻璃支撑构件和形成有彼此分别连通的压力传导孔的金属支撑构件。 金属支撑构件由具有与测量隔膜的杨氏模量基本相等的杨氏模量的材料形成。
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公开(公告)号：US4618844A
公开(公告)日：1986-10-21
申请号：US494075
申请日：1983-05-12
CPC分类号： G01L9/0054
摘要： In a semiconductor pressure transducer in accordance with the present invention, an oxide film is formed on a semiconductor base having a strain gauge resistor element for the purpose of protecting the strain gauge resistor element. Over the oxide film, a conductive metal film is formed which does not overlap with the strain gauge resistor element through said oxide film.
摘要翻译： 在根据本发明的半导体压力传感器中，为了保护应变计电阻元件，在具有应变计电阻元件的半导体基底上形成氧化膜。 在氧化物膜上形成导电金属膜，其不通过所述氧化膜与应变计电阻元件重叠。
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公开(公告)号：US4306460A
公开(公告)日：1981-12-22
申请号：US103407
申请日：1979-12-13
申请人： Yutaka Sakurai , Takeo Nagata , Yoshitaka Matsuoka , Satoshi Shimada , Mitsuo Ai
发明人： Yutaka Sakurai , Takeo Nagata , Yoshitaka Matsuoka , Satoshi Shimada , Mitsuo Ai
CPC分类号： G01L13/025 , G01L9/0052
摘要： A differential pressure transducer having a cantilever and a semiconductor strain gauge attached to each side of the cantilever at an intermediate portion of the latter. The cantilever has one end fixed by electron beam welding to a fixing member and the other end left for free displacement in response to a differential pressure. The displacement of the other end of the cantilever is detected as changes in the electric resistances of the semiconductor strain gauges.
摘要翻译： 一种差压传感器，其具有在后者的中间部分处连接到悬臂的每一侧的悬臂和半导体应变计。 悬臂具有通过电子束焊接固定到固定构件的一端，另一端响应于压差而离开自由位移。 悬臂的另一端的位移被检测为半导体应变计的电阻的变化。
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公开(公告)号：US4342231A
公开(公告)日：1982-08-03
申请号：US217025
申请日：1980-12-16
申请人： Yoshimi Yamamoto , Yoshitaka Matsuoka , Syozo Kasai , Yukio Takahashi , Takeo Nagata , Akira Nagasu , Tomomasa Yoshida , Satoshi Shimada
发明人： Yoshimi Yamamoto , Yoshitaka Matsuoka , Syozo Kasai , Yukio Takahashi , Takeo Nagata , Akira Nagasu , Tomomasa Yoshida , Satoshi Shimada
CPC分类号： G01L19/147 , G01L13/025 , G01L19/0038 , G01L19/0645 , G01L19/142
摘要： A differential pressure transmitter has a pressure receiving portion and a sensor portion which are constituted from separate parts separably jointed with each other. The sensor portion includes a semiconductor sensor having one side formed with a resistance pattern and the other side which has a thick-walled peripheral portion and a thick-walled central portion. The semiconductor sensor is incorporated in the sensor portion as being supported at the thick-walled peripheral portion thereof. The pressure receiving portion includes seal diaphragms disposed on both sides of the pressure receiving portion and a central diaphragm disposed therein. The semiconductor sensor is arranged such that the side thereof carrying the resistance pattern faces the pressure receiving portion.
摘要翻译： 差压变送器具有压力接收部分和传感器部分，该压力接收部分和传感器部分由可分离地彼此连接的分开的部分构成。 传感器部分包括半导体传感器，其一侧形成有电阻图案，另一侧具有厚壁周边部分和厚壁中心部分。 半导体传感器被并入传感器部分中，被支撑在其厚壁周边部分。 受压部分包括设置在压力接收部分两侧的密封膜片和设置在其中的中心膜片。 半导体传感器被布置成使得其携带电阻图案的一侧面向压力接收部分。
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公开(公告)号：US4454771A
公开(公告)日：1984-06-19
申请号：US318361
申请日：1981-11-05
IPC分类号： G01L1/18
CPC分类号： G01L1/18
摘要： A load cell comprises a semiconductor diaphragm which includes an outer flange portion, a central rigid portion having a smaller thickness than the outer flange portion and a thin resilient portion provided between the outer flange portion and the central rigid portion. At least two piezo-resistors constituting at least part of a bridge circuit are formed in the resilient portion. The load cell further comprises a first glass block secured to the central rigid portion, and a second glass block for securing the outer flange portion. A load is applied to the semiconductor diaphragm through the first glass block, wherein measurement of the applied load is effected by detecting variation in resistance of the resistor bridge circuit.
摘要翻译： 测力传感器包括半导体膜片，其包括外凸缘部分，具有比外凸缘部分更小的厚度的中心刚性部分和设置在外凸缘部分和中心刚性部分之间的薄弹性部分。 构成桥接电路的至少一部分的至少两个压电电阻形成在弹性部分中。 测力传感器还包括固定到中心刚性部分的第一玻璃块和用于固定外凸缘部分的第二玻璃块。 通过第一玻璃块将负载施加到半导体膜片，其中通过检测电阻器桥接电路的电阻的变化来实现所施加的负载的测量。
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公开(公告)号：US4264889A
公开(公告)日：1981-04-28
申请号：US113208
申请日：1980-01-18
申请人： Yoshimi Yamamoto , Mitsuo Ai , Yoshitaka Matsuoka , Takeo Nagata , Tsutomu Okayama , Akira Ikegami
发明人： Yoshimi Yamamoto , Mitsuo Ai , Yoshitaka Matsuoka , Takeo Nagata , Tsutomu Okayama , Akira Ikegami
CPC分类号： G01L19/148 , G01L13/025 , G01L19/0038 , G01L19/04 , G01L19/0645
摘要： A pressure transducer has at least one pressure transmitting space filled with liquid, a space for a pressure to be sensed connected to the pressure transmitting space through a diaphragm, and a pressure sensitive element in the pressure transmitting space for transducing a pressure transmitted from the space for the pressure to be sensed to the pressure transmitting space through the diaphragm to an electrical signal. A printed circuit board wired to electrically connect terminals of the pressure sensitive element is arranged closely to the element and thin temperature sensitive elements for temperature-compensating the pressure sensitive element are arranged on the printed circuit board.
摘要翻译： 压力传感器具有填充有液体的至少一个压力传递空间，用于通过隔膜连接到压力传递空间的待感测压力的空间，以及压力传递空间中的用于传导从空间传递的压力的压力敏感元件 用于通过隔膜将压力传感到压力传递空间到电信号。 布线用于电连接压敏元件的端子的印刷电路板布置在元件上，并且用于温度补偿压敏元件的薄温敏元件布置在印刷电路板上。
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