Semiconductor strain gauge with temperature compensator
    3.
    发明授权
    Semiconductor strain gauge with temperature compensator 失效
    带温度补偿器的半导体应变片

    公开(公告)号:US4173148A

    公开(公告)日:1979-11-06

    申请号:US948778

    申请日:1978-10-05

    摘要: A bridge circuit with four arms including semiconductor strain gauge elements has input terminals for coupling a DC power supply with a pair of diagonally opposite junctions of the bridge circuit per se and output terminals coupled with a pair of remaining diagonally opposite junctions. Initial zero-point temperature compensators each are connected in series and in parallel to each of semiconductor strain gauge elements on adjacent two arms of the bridge circuit. Temperature compensators for zero-point shift adjustment are each provided between the adjacent arms closer to each output terminal. A temperature compensator for span adjustment is provided between one of the input terminals and the DC power source. A constant current control unit for feeding a constant current to the bridge circuit is provided between the other input terminal and the DC power supply.

    摘要翻译: 具有包括半导体应变计元件的四个臂的桥接电路具有用于将直流电源与桥接电路本身的一对斜对置接头连接的输入端子以及与一对剩余的对角线相对的接合部连接的输出端子。 初始零点温度补偿器各自与桥式电路的相邻两个臂上的每个半导体应变计元件串联并联。 用于零点移位调整的温度补偿器分别设置在靠近每个输出端子的相邻臂之间。 在一个输入端子和直流电源之间提供用于量程调节的温度补偿器。 在另一个输入端子和直流电源之间设置用于向桥式电路馈送恒定电流的恒定电流控制单元。

    Differential pressure transducer
    5.
    发明授权
    Differential pressure transducer 失效
    差压传感器

    公开(公告)号:US4306460A

    公开(公告)日:1981-12-22

    申请号:US103407

    申请日:1979-12-13

    CPC分类号: G01L13/025 G01L9/0052

    摘要: A differential pressure transducer having a cantilever and a semiconductor strain gauge attached to each side of the cantilever at an intermediate portion of the latter. The cantilever has one end fixed by electron beam welding to a fixing member and the other end left for free displacement in response to a differential pressure. The displacement of the other end of the cantilever is detected as changes in the electric resistances of the semiconductor strain gauges.

    摘要翻译: 一种差压传感器,其具有在后者的中间部分处连接到悬臂的每一侧的悬臂和半导体应变计。 悬臂具有通过电子束焊接固定到固定构件的一端,另一端响应于压差而离开自由位移。 悬臂的另一端的位移被检测为半导体应变计的电阻的变化。

    Capacitive pressure sensor
    7.
    发明授权
    Capacitive pressure sensor 失效
    电容式压力传感器

    公开(公告)号:US4495820A

    公开(公告)日:1985-01-29

    申请号:US426084

    申请日:1982-09-28

    CPC分类号: H01L27/20 G01L9/0073 H01G5/16

    摘要: A capacitive pressure sensor and its manufacturing method are disclosed. An amplifier is formed on the main surface of a first semiconductor substrate by a diffusion process, and its surface is covered with an insulating film. An electrode is vapor-deposited on the surface of the amplifier and electrically connected to the amplifier through a through hole formed in the insulating film. For forming a diaphragm, the surface of a second semiconductor substrate disposed facing the electrode to form a capacitor, which is opposite to the surface of the second semiconductor substrate facing the electrode, is partially etched away to form a depression. The first and second semiconductor substrates are anodically bonded to each other using a glass layer.

    摘要翻译: 公开了一种电容式压力传感器及其制造方法。 通过扩散处理在第一半导体衬底的主表面上形成放大器,并且其表面被绝缘膜覆盖。 电极沉积在放大器的表面上,并通过形成在绝缘膜上的通孔与放大器电连接。 为了形成光阑,第二半导体衬底的与电极相对配置以形成与面向电极的第二半导体衬底的表面相反的电容器的表面被部分蚀刻掉以形成凹陷。 使用玻璃层将第一和第二半导体衬底彼此阳极接合。

    Semiconductor strain gauge with elastic load plate
    10.
    发明授权
    Semiconductor strain gauge with elastic load plate 失效
    带弹性负载板的半导体应变片

    公开(公告)号:US4292618A

    公开(公告)日:1981-09-29

    申请号:US129195

    申请日:1980-03-11

    CPC分类号: H01L29/84 G01L1/18

    摘要: A semiconductor substrate has a major surface, another major surface on the opposite side of the first major surface, a strain gauge stripe formed in the central portion of the second major surface by diffusing an impurity therein, and electrodes connected to the strain gauge stripes. These strain gauge stripes are spaced from the peripheral edge of the second major surface by a distance greater than 1/3 of the length of the same major surface. The first major surface of the semiconductor substrate is bonded to an elastic metal load plate.

    摘要翻译: 半导体衬底具有主表面,在第一主表面的相对侧上的另一个主表面,通过在其中扩散杂质而形成在第二主表面的中心部分中的应变计条,以及连接到应变计条纹的电极。 这些应变计条纹与第二主表面的周缘间隔大于同一主表面长度的1/3。 半导体基板的第一主表面与弹性金属负载板接合。