-
1.发明授权Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board 失效热固性树脂组合物，使用树脂组合物的印刷电路板和印刷电路板的制造方法
公开(公告)号：US5045381A
公开(公告)日：1991-09-03
申请号：US413070
申请日：1989-09-27
申请人： Masao Suzuki , Junichi Katagiri , Akira Nagai , Masahiro Suzuki , Akio Takahashi
发明人： Masao Suzuki , Junichi Katagiri , Akira Nagai , Masahiro Suzuki , Akio Takahashi
CPC分类号： C08G18/092 , C08G18/6275 , C08G18/6705 , C08G18/678 , C08G73/1035 , H01B3/302 , H01B3/303 , H05K1/0346 , Y10S428/901 , Y10T156/10 , Y10T428/24917 , Y10T428/31547 , Y10T428/31678
摘要： A thermosetting resin composition which comprises a cyanate compound or an isocyanate compound represented by the following general formula (I):A--R.sub.1 --A (I)wherein R.sub.1 is an aromatic group, an alicyclic group or a mixed group thereof and A is a cyanate group or an isocyanate group, and a poly-(p-hydroxystyrene) derivative represented by the following general formula (II): ##STR1## wherein X is a fluorine atom, a bromine atom and a chlorine atom, R.sub.2 is an alkenyl group and an unsaturated carboxyl group, each having 2 to 4 carbon atoms, B is any one of a polymerization initiator residue, a polymerization-terminating agent residue, H and ##STR2## m is an integer of 1 to 4 and n is an integer of 5 to 100, and further containing a compound having at least one N-substituted unsaturated imido group, if required, can produce a printed circuit board of high flame retardness, low dielectric constant, low moisture absorption and a high mechanical strength at an elevated temperature.
-
公开(公告)号：US5352762A
公开(公告)日：1994-10-04
申请号：US676383
申请日：1991-03-28
申请人： Akira Nagai , Shin Nishimura , Masahiro Suzuki , Masao Suzuki , Junichi Katagiri , Akio Takahashi , Akio Mukoh
发明人： Akira Nagai , Shin Nishimura , Masahiro Suzuki , Masao Suzuki , Junichi Katagiri , Akio Takahashi , Akio Mukoh
IPC分类号： C08G12/32 , C08G18/30 , C08G18/38 , C08G59/40 , C08G73/06 , H01B3/30 , H01B3/44 , H01L23/12 , H05K1/03 , H05K3/46 , C08G83/00 , C08G73/12
CPC分类号： H05K3/4626 , H05K1/0346 , H05K1/034 , H05K2201/015 , Y10S428/901 , Y10T428/31504 , Y10T428/31551 , Y10T442/2213 , Y10T442/2713 , Y10T442/2738
摘要： A multilayer printed circuit board comprising a plurality of alternately laminated layers of insulating layers and circuit conductor layers having a signal transmission delay time of 6.0 ns/m or less, excellent in heat resistance, adhesive, fire retardance, etc. can be produced by forming insulating layers using a fluorine-containing thermosetting resin composition.
摘要翻译： 包括绝缘层的多个交替层叠层和具有6.0ns / m以下的信号传输延迟时间的电路导体层的多层印刷电路板，耐热性，粘合剂，阻燃性等优异，可以通过形成 使用含氟热固性树脂组合物的绝缘层。
-
公开(公告)号：US5223594A
公开(公告)日：1993-06-29
申请号：US618982
申请日：1990-11-28
申请人： Akira Nagai , Junichi Katagiri , Masahiro Ono , Masao Suzuki , Akio Takahashi , Toshikazu Narahara
发明人： Akira Nagai , Junichi Katagiri , Masahiro Ono , Masao Suzuki , Akio Takahashi , Toshikazu Narahara
CPC分类号： C08J5/24 , C08F290/124 , C08F8/00 , C08F8/14 , C08L25/18 , C08L9/00 , H05K1/034 , C08F2810/30 , C08J2325/18 , Y10S260/24
摘要： A flame-retardant resin composition contains a prepolymer represented by the general formula: ##STR1## wherein R.sub.1 stands for a hydrogen atom or an unreactive saturated group; R.sub.2 stands for a reactive unsaturated group; m and n each stand for a positive number of 1 to 4 and X and Y are each a copolymerization ratio and are in the range of 0.3 to 0.7 with the proviso that the sum total of X and Y is 1,as an essential component. The flame retardant resin composition is curable with uniform crosslinking density and without substantial stress concentration and is suitable for producing a laminate for a multilayer printed wiring board having a high thermal impact resistance as well as excellent heat resistance and
摘要翻译： 阻燃性树脂组合物含有下列通式表示的预聚物：其中R1代表氢原子或未反应饱和基团; R2代表反应性不饱和基团; m和n各自表示1至4的正数，X和Y各自是共聚比，并且在0.3至0.7的范围内，条件是X和Y的总和为1作为必要组分。 该阻燃树脂组合物可以均匀的交联密度固化并且没有显着的应力集中，并且适用于生产具有高耐热冲击性和优异的耐热性的多层印刷线路板的层叠体
-
4.发明授权
公开(公告)号：US5065285A
公开(公告)日：1991-11-12
申请号：US489549
申请日：1990-03-07
CPC分类号： H05K3/4626 , H05K2201/015 , H05K2201/0195 , H05K3/0023 , H05K3/184 , H05K3/386
摘要： The dislocation between each layer in a multi-layer circuit board and a process for producing the same and an application of the same is minimized by employing a specific adhesive layer between layers of the circuit board. The adhesive layer is composed of a film of a resin having a melting point higher than a temperature for forming the multi-layer (or laminated layer) circuit board and adhesive having a melting point lower than the temperature for forming the multi-layer circuit board.
摘要翻译： 通过在电路板的层之间采用特定的粘合剂层，使多层电路板中的各层之间的位错及其制造方法及其应用最小化。 粘合剂层由熔点高于用于形成多层（或叠层）电路板的温度的树脂的薄膜和熔点低于用于形成多层电路板的温度的粘合剂构成 。
-
公开(公告)号：US4933228A
公开(公告)日：1990-06-12
申请号：US367675
申请日：1989-06-19
申请人： Junichi Katagiri , Akira Nagai , Keiko Tawara , Akio Takahashi , Motoyo Wajima , Toshikazu Narahara , Ryo Hiraga
发明人： Junichi Katagiri , Akira Nagai , Keiko Tawara , Akio Takahashi , Motoyo Wajima , Toshikazu Narahara , Ryo Hiraga
IPC分类号： C08L25/04 , C08F8/00 , C08F12/22 , C08F290/12 , C08F299/00 , C08G59/34 , C08L63/08 , H05K1/03
CPC分类号： C08G59/027 , C08F290/124 , C08F299/00 , C08F8/00 , C08L63/08 , H05K1/034 , Y10S428/901 , Y10T428/24917 , Y10T428/31511 , Y10T428/31529 , Y10T428/31678 , Y10T428/31696 , Y10T442/674
摘要： A thermosetting resin composition comprising a special poly(p-hydroxystyrene) derivative resin and a radical polymerization initiator, and if necessary an epoxy modified polybutadiene, can provide prepregs and laminates having a low dielectric constant, a shorter signalling delay time, good heat resistance and flame retardancy and thus being suitable for producing multilayer printed circuit boards.
-
6.发明授权Prepreg from poly(p-hydroxystyrene), epoxy-modified polybutadiene and maleimide 失效聚（对羟基苯乙烯），环氧改性聚丁二烯和马来酰亚胺
公开(公告)号：US5080965A
公开(公告)日：1992-01-14
申请号：US487406
申请日：1990-03-26
申请人： Katuo Sugawara , Akio Takahashi , Junichi Katagiri , Akira Nagai , Masahiro Ono , Toshikazu Narahara
发明人： Katuo Sugawara , Akio Takahashi , Junichi Katagiri , Akira Nagai , Masahiro Ono , Toshikazu Narahara
IPC分类号： C08G59/34 , B32B27/04 , B32B27/38 , C08F279/02 , C08G59/00 , C08G59/32 , C08G59/40 , C08J5/24 , C08L25/00 , C08L25/18 , C08L63/00 , C08L63/08 , H05K1/03
CPC分类号： C08J5/24 , C08F279/02 , H05K1/0353 , C08J2351/00 , Y10T428/24917 , Y10T442/2475 , Y10T442/2721 , Y10T442/2902 , Y10T442/2951 , Y10T442/3528
摘要： The present invention provides a thermosetting resin composition comprising(a) a prepolymer of a poly-p-hydroxystyrene derivative represented by the general formula ##STR1## wherein A is a halogen group, R.sub.1 is an alkenyl or alkenoyl group of 2 to 4 carbon atoms, 4 carbon atoms, m denotes a number of 1 to 4 and n denotes a number of 1 to 100,(b) an epoxy-modified polybutadiene, and(c) an aromatic maleimide compound, and a prepreg and a laminated sheet which use said resin composition.
-
7.发明授权Composition comprising poly(p-hydroxystrene) derivative, epoxy-modified polybutadiene and aromatic maleimide 失效组合物，其包含聚（对 - 羟基硬
体）衍生物，环氧改性聚丁二烯和芳族马来酰亚胺公开(公告)号：US4931507A
公开(公告)日：1990-06-05
申请号：US266406
申请日：1988-11-02
申请人： Katuo Sugawara , Akio Takahashi , Junichi Katagiri , Akira Nagai , Masahiro Ono , Toshikazu Narahara
发明人： Katuo Sugawara , Akio Takahashi , Junichi Katagiri , Akira Nagai , Masahiro Ono , Toshikazu Narahara
IPC分类号： C08G59/34 , B32B27/04 , B32B27/38 , C08F279/02 , C08G59/00 , C08G59/32 , C08G59/40 , C08J5/24 , C08L25/00 , C08L25/18 , C08L63/00 , C08L63/08 , H05K1/03
CPC分类号： C08J5/24 , C08F279/02 , H05K1/0353 , C08J2351/00 , Y10T428/24917 , Y10T442/2475 , Y10T442/2721 , Y10T442/2902 , Y10T442/2951 , Y10T442/3528
摘要： The present invention provides a thermosetting resin composition comprising(a) a prepolymer of a poly(p-hydroxystyrene) derivative represented by the general formula ##STR1## wherein A is a halogen group, R.sub.1 is an alkenyl or alkenoyl group of 2 to 4 carbon atoms, m denotes a number of 1 to 4 and n denotes a number of 1 to 100,(b) an epoxy-modified polybutadiene, and(c) an aromatic maleimide compound, and a prepreg and a laminated sheet which use said resin composition.
-
公开(公告)号：US4886858A
公开(公告)日：1989-12-12
申请号：US15325
申请日：1987-02-17
申请人： Junichi Katagiri , Akira Nagai , Keiko Tawara , Akio Takahashi , Motoyo Wajima , Toshikazu Narahara , Ryo Hiraga
发明人： Junichi Katagiri , Akira Nagai , Keiko Tawara , Akio Takahashi , Motoyo Wajima , Toshikazu Narahara , Ryo Hiraga
IPC分类号： C08L25/04 , C08F8/00 , C08F12/22 , C08F290/12 , C08F299/00 , C08G59/34 , C08L63/08 , H05K1/03
CPC分类号： C08G59/027 , C08F290/124 , C08F299/00 , C08F8/00 , C08L63/08 , H05K1/034 , Y10S428/901 , Y10T428/24917 , Y10T428/31511 , Y10T428/31529 , Y10T428/31678 , Y10T428/31696 , Y10T442/674
摘要： A thermosetting resin composition comprising a special poly(p-hydroxystyrene) derivative resin and a radical polymerization initiator, and if necessary an epoxy modified polybutadiene, can provide prepregs and laminates having a low dielectric constant, a shorter signalling delay time, good heat resistance and flame retardancy and thus being suitable for producing multilayer printed circuit boards.
摘要翻译： 包含特殊聚（对 - 羟基苯乙烯）衍生物树脂和自由基聚合引发剂的热固性树脂组合物，并且如果需要，可以提供环氧改性聚丁二烯，可以提供具有低介电常数，较短的信号延迟时间，良好的耐热性和较短的信号延迟时间的预浸料和层压材料 阻燃性，因此适用于生产多层印刷电路板。
-
9.发明授权Thermosetting resin composition, and prepreg and laminated sheet which use the same 失效热固性树脂组合物，以及使用其的预浸料和层压片材
公开(公告)号：US5212244A
公开(公告)日：1993-05-18
申请号：US772846
申请日：1991-10-08
申请人： Katuo Sugawara , Akio Takahashi , Junichi Katagiri , Akira Nagai , Masahiro Ono , Toshikazu Narahara
发明人： Katuo Sugawara , Akio Takahashi , Junichi Katagiri , Akira Nagai , Masahiro Ono , Toshikazu Narahara
IPC分类号： C08F279/02 , C08J5/24 , H05K1/03
CPC分类号： C08J5/24 , C08F279/02 , H05K1/0353 , C08J2351/00
摘要： The present invention provide a thermosetting resin composition comprising(a) a poly-p-hydroxstyrene derivative represented by the general formula ##STR1## wherein A is a halogen group, R.sub.1 is an alkenyl or alkenoyl group of 2 to 4 carbon atoms, m denotes a number of 1 to 4 and from more than denotes a number of 1 to 100,(b) an epoxy-modified polybutadiene, and(c) an aromatic maleimide compound, and a prepreg and a laminated sheet which use said resin composition.
摘要翻译： 本发明提供一种热固性树脂组合物，其包含（a）由通式（I）表示的聚对羟基苯乙烯衍生物，其中A为卤素基团，R 1为2至4个碳原子的链烯基或链烯酰基 m表示1〜4的数，大于1〜100的数，（b）环氧改性的聚丁二烯和（c）芳香族马来酰亚胺化合物，以及使用该树脂的预浸料坯和层压片 组成。
-
公开(公告)号：US5707749A
公开(公告)日：1998-01-13
申请号：US494974
申请日：1995-06-26
申请人： Junichi Katagiri , Akio Takahashi , Akira Nagai , Haruo Akahoshi , Kouji Fujisaki , Akio Mukoh , Fumiyuki Kobayashi
发明人： Junichi Katagiri , Akio Takahashi , Akira Nagai , Haruo Akahoshi , Kouji Fujisaki , Akio Mukoh , Fumiyuki Kobayashi
CPC分类号： H05K3/4655 , B32B15/08 , H05K2201/0154 , H05K2201/0195 , H05K2203/107 , H05K3/0017 , H05K3/386 , H05K3/4652 , Y10T29/49165 , Y10T428/2848 , Y10T428/31721
摘要： A thin film multilayer wiring material excellent in reliability, yield, productivity, and higher positioning accuracy includes an insulation organic film having a wiring pattern on one surface and an adhesive layer on another principal surface. The insulation organic film is a polyimide film having a heat resistance at a pyrolysis beginning temperature of 350.degree. to 550.degree. C., a dielectric constant of 3.5-2.2 and a flame retardance of V-0 or V-1 according to the UL-94 standard. The adhesive layer contains an ether bismaleimide compound.
摘要翻译： 可靠性，产率，生产率和更高的定位精度优异的薄膜多层布线材料包括在一个表面上具有布线图案的绝缘有机膜和在另一个主表面上的粘合剂层。 绝缘性有机膜是在热解开始温度为350〜550℃，介电常数为3.5〜2.2的耐热性，V-0或V-1的阻燃性根据UL- 94标准。 粘合层含有醚双马来酰亚胺化合物。
-
-
-
-
-
-
-
-
-
搜索结果
19 条记录 (耗时 0.035 秒)
