摘要:
A light receiving device and a circuit device which includes an amplifier directly connected to the light receiving device are provided on a frame which is connected to a power source potential. The light receiving device and circuit device are integrally covered with resin. On electrodes through which the light receiving device and circuit device are connected to the frame, semiconductor substrates of the same conductivity type are provided, respectively.
摘要:
On a leadframe on which to fix a photodetector element, an element mount frame and a fitting frame are laid with a gap left in between. A shielding frame for electromagnetically shielding the photodetector element is tied, via a tying portion, not to the element mount frame but to the fitting frame. Bending the tying portion brings it into a state in which it covers the photodetector element, but the stress resulting from this bending of the tying portion is shut off by the gap so as not to spread to the element mount frame. On the element mount frame, a circuit element for processing the signal from the photodetector element also is fixed.
摘要:
An LED indicator casing (1R) has: a casing (1a) including a bottom face (S1), a front face (S2) having an aperture (2a) for light emission, and paired side faces (S3 and S4) adjoining the front face (S2); and paired lead terminals (11 and 12), one of which has a light-emitting element (LED)(21) fitted thereto. The paired lead terminals (11 and 12) are led out to the bottom face (S1) via the paired side faces (S3 and S4) of the casing (1a) respectively.
摘要:
An LED indicator casing (1R) has: a casing (1a) including a bottom face (S1), a front face (S2) having an aperture (2a) for light emission, and paired side faces (S3 and S4) adjoining the front face (S2); and paired lead terminals (11 and 12), one of which has a light-emitting element (LED) (21) fitted thereto. The paired lead terminals (11 and 12) are led out to the bottom face (S1) via the paired side faces (S3 and S4) of the casing (1a) respectively.