ALUMINUM COPPER CLAD MATERIAL
    8.
    发明申请
    ALUMINUM COPPER CLAD MATERIAL 有权
    铝铜箔材料

    公开(公告)号:US20130071686A1

    公开(公告)日:2013-03-21

    申请号:US13701677

    申请日:2011-06-02

    IPC分类号: B23K20/02 B32B15/01

    摘要: An aluminum copper clad material has excellent bonding strength and includes an aluminum layer and a copper layer that are bonded without a nickel layer interposed therebetween.The aluminum layer and the copper layer that are diffusion-bonded via an Al—Cu intermetallic compound layer. The copper layer satisfies Dcs≦0.5×Dcc, where Dcc represents the average crystal grain size of crystal grains in a central portion in the thickness direction of the copper layer, and Dcs represents the average crystal grain size of an interface adjacent portion C2 in the copper layer that is about 0.5 μm apart from the interface between the copper layer and the intermetallic compound layer. The intermetallic compound layer has an average thickness of about 0.5 μm to about 10 μm.

    摘要翻译: 铝铜合金材料具有优异的接合强度,并且包括铝层和铜层,其间没有镍层接合。 通过Al-Cu金属间化合物层扩散接合的铝层和铜层。 铜层满足Dcs≦̸ 0.5×Dcc,其中Dcc表示铜层的厚度方向的中心部分的晶粒的平均晶粒尺寸,Dcs表示铜层的相邻部分C2的界面的平均晶粒尺寸 铜层与铜层和金属间化合物层之间的界面分开约0.5μm。 金属间化合物层的平均厚度为约0.5μm〜约10μm。

    METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD AND A PRINTED CIRCUIT BOARD OBTAINED BY THE MANUFACTURING METHOD
    9.
    发明申请
    METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD AND A PRINTED CIRCUIT BOARD OBTAINED BY THE MANUFACTURING METHOD 有权
    制造印刷电路板的方法和制造方法获得的印刷电路板

    公开(公告)号:US20100139959A1

    公开(公告)日:2010-06-10

    申请号:US12733105

    申请日:2008-06-23

    IPC分类号: H05K1/09 C23F1/00

    摘要: A method for manufacturing a printed circuit board enables a metal residue between wirings to be removed inexpensively without side etching of a copper layer while having sufficient insulation reliability for micro wiring working. The method includes forming a base metal layer directly at least on one face of an insulator film without an adhesive, and a copper coat layer formed on the base metal layer to form adhesiveless copper clad laminates, then forming a pattern on the adhesiveless copper clad laminates by an etching method. The etching method includes a process of etching treatment for the adhesiveless copper clad laminates with an iron (III) chloride solution or a copper (II) chloride solution containing hydrochloric acid and then, a process of treatment with an acid oxidant containing permanganate and acetic acid.

    摘要翻译: 印刷电路板的制造方法能够廉价地除去布线之间的金属残留物,而不会对铜层进行侧蚀刻,同时具有足够的微布线工作的绝缘可靠性。 该方法包括直接在绝缘膜的至少一个表面上形成基底金属层,而无需粘合剂,以及形成在基底金属层上的铜涂层,以形成无粘合剂的铜包覆层压板,然后在无粘合剂覆铜层压板上形成图案 通过蚀刻方法。 蚀刻方法包括用氯化铁(III)溶液或含有盐酸的氯化铜(II)溶液对无粘合剂铜包覆层压板进行蚀刻处理的方法,然后使用含有高锰酸盐和乙酸的酸式氧化剂进行处理 。