摘要:
This invention provides a modified liquid epoxy resin having a low viscosity and a high performance, which is obtained by reacting a mixture of a bisphenol and a phenol aralkyl resin with an epiholohydrin. The bisphenol is preferable to be bisphenol F and is further preferable to have a bifunctional form purity as detected by gel permeation chromatography at UV 254 nm of not less than 95% by area in view of the fluidity. Moreover, the mixture of bisphenol and the phenol aralkyl resin is preferable to have a ratio of the phenol aralkyl resin of 10-70% by mass.
摘要:
An object of the present invention is to provide an epoxy resin exhibiting superior heat resistance, dielectric properties, water resistance, and workability, a resin composition containing the epoxy resin, and a prepreg and a laminated plate. The epoxy resin of the invention is expressed by the following formula. (In the formula, R represents a hydrocarbon group having a carbon number of 1 to 4. m Represents an integer of 1 to 4 and when m is 2 to 4, R's may be the same or different. n Represents a positive number of 1 to 6 on average.) The epoxy resin composition of the invention contains the epoxy resin of the invention and a curing agent.
摘要:
This invention provides a modified liquid epoxy resin having a low viscosity and a high performance, which is obtained by reacting a mixture of a bisphenol and a phenol aralkyl resin with an epiholohydrin. The bisphenol is preferable to be bisphenol F and is further preferable to have a bifunctional form purity as detected by gel permeation chromatography at UV 254 nm of not less than 95% by area in view of the fluidity. Moreover, the mixture of bisphenol and the phenol aralkyl resin is preferable to have a ratio of the phenol aralkyl resin of 10-70% by mass.
摘要:
A phenol aralkyl type phenolic resin represented by the general formula (1), wherein the total content of the compounds represented by formulae (2) to (4) is 58 to 92% as determined by GPC and the contents of the compounds represented by formulae (2) to (4) as determined by HPLC satisfy the following relationship: 0.60≦(2a+b)/(2a+2b+2c)≦0.90 wherein a is the content of the compound of formula (2); b is the content of the compound of formula (3); and c is the content of the compound of formula (4).
摘要:
A phenol aralkyl type phenolic resin represented by the general formula (1), wherein the total content of the compounds represented by formulae (2) to (4) is 58 to 92% as determined by GPC and the contents of the compounds represented by formulae (2) to (4) as determined by HPLC satisfy the following relationship: 0.60≦(2a+b)/(2a+2b+2c)≦0.90 wherein a is the content of the compound of formula (2); b is the content of the compound of formula (3); and c is the content of the compound of formula (4).
摘要:
It is an object of the present invention, with respect to a phenol aralkyl type epoxy resin, to suppress any crystal precipitation, improve the quality manageability and operation efficiency at composition production and enhance the properties, including heat resistance, thereof. It is also intended to provide a resin composition that even when stored in the form of a varnish for a prolonged period of time, is resistant to crystal precipitation, excelling in storage stability and operation efficiency, and that gives a hardening product of low dielectric constant and low dielectric tangent excelling in heat resistance, water resistance and flame retardance.There is provided an epoxy resin characterized by comprising a phenol aralkyl type epoxy resin in which a content (an area % measured by gel permeation chromatography) of a bifunctional compound is 20% or less, and provided a resin composition obtained therefrom.
摘要:
A phenolic compound which can be obtained by reacting the compound of the formula (1): wherein R1 groups are each independently present and represent a hydrogen atom etc. with the formula (6): wherein R4 groups are each independently present and represent a hydrogen atom etc.; and k represents the number of R4 groups and is an integer of 0 to 4 and an epoxy resin which can be obtained by reacting the phenolic compound with an epihalohydrin are excellent in solvent solubility and also of which cured product has an excellent thermal conductance.
摘要:
An epoxy resin represented by formula (1) below: wherein the ratio of the component having two nuclei accounting for 25% or less in terms of the area corresponding to the component in a gel permeation chromatogram.
摘要:
Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1) below, while satisfying the condition 1 below. This epoxy resin is excellent in workability during production of a composition and is easy to control quality. Condition 1: The following relation (α) is satisfied with A being the hydroxyl equivalent (as measured in accordance with JIS K 0070) of a phenol-modified epoxy resin obtained by adding an equivalent molar amount of phenol relative to the epoxy equivalent of the epoxy resin, and B being the epoxy equivalent of the epoxy resin. 50≦1000×(A−B)/B≦250 (α).
摘要翻译:公开了一种苯酚芳烷基环氧树脂,其具有以下结构,其中在满足下述条件1的同时,通过使用芳烷基作为连接基团和式(1)表示的结构,至少使苯酚或萘酚结合。 该环氧树脂在组合物的制造中的加工性优异,容易控制质量。 条件1:通过将等当量的苯酚相对于环氧当量添加而得到的酚改性环氧树脂的羟基当量(根据JIS K 0070测定)满足以下关系式(α) 环氧树脂,B为环氧树脂的环氧当量。 50≦̸ 1000×(A-B)/ B≦̸ 250(α)。
摘要:
The present invention relates to a sealant for liquid crystals having extremely low contamination nature to a liquid crystal, excellent coatability and bondability to a substrate, long service life and pot life and high adhesive strength. A sealant for liquid crystals of the present invention is characterized by comprising (a) an epoxy resin represented by general formula (1): (wherein a represents an integer of 2 to 4; n represents 0 to 3 (average value); R represents a divalent hydrocarbon group of 2 to 6 carbon atoms; A represents a polyvalent aromatic group; and G represents a glycidyl group, provided that when n is 0, (a) an epoxy resin represented by general formula (1) is a bisphenol S-type.), (b) a thermo-curing agent, (c) and a filler having average particle diameter of not larger than 3 μm.