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14 条记录 (耗时 0.024 秒)

    Method for manufacturing surface acoustic wave apparatus
    3.
    发明授权
    Method for manufacturing surface acoustic wave apparatus 有权
    声表面波装置的制造方法

    公开(公告)号：US06725513B2

    公开(公告)日：2004-04-27

    申请号：US09875216

    申请日：2001-06-06

    申请人： Masatoshi Nakagawa ,  Makoto Tose ,  Yoshihiro Koshido ,  Koji Fujimoto ,  Takeshi Nakao

    发明人： Masatoshi Nakagawa ,  Makoto Tose ,  Yoshihiro Koshido ,  Koji Fujimoto ,  Takeshi Nakao

    IPC分类号： H04R1700

    CPC分类号： H03H3/08 ,  Y10T29/42 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156

    摘要： A method for manufacturing a surface acoustic wave apparatus decreases a specific resistance of an electrode film by removing hydrogen occluded in the electrode film that is primarily composed of tantalum, so that the device properties are stabilized. An electrode film primarily composed of tantalum is formed on a piezoelectric substrate. Subsequently, this electrode film is heat-treated in a vacuum at a temperature of about 200° C. to about 700° C. for several hours. Thereafter, the electrode film is patterned so as to produce an interdigital electrode transducer.

    摘要翻译： 制造声表面波装置的方法通过去除主要由钽构成的电极膜中吸收的氢而使电极膜的比电阻降低，使得器件特性稳定。 在压电基板上形成主要由钽构成的电极膜。 随后，将该电极膜在约200℃至约700℃的温度下在真空中热处理数小时。 此后，对电极膜进行图案化以产生叉指式电极换能器。

    Insulating paste
    8.
    发明授权
    Insulating paste 有权
    绝缘胶

    公开(公告)号：US06191186B1

    公开(公告)日：2001-02-20

    申请号：US09165476

    申请日：1998-10-02

    申请人： Makoto Tose ,  Shizuharu Watanabe

    发明人： Makoto Tose ,  Shizuharu Watanabe

    IPC分类号： C08K246

    CPC分类号： H01B3/006 ,  C03C8/02 ,  C03C8/16 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/31696

    摘要： The invention provides an insulating paste, comprising: an organic vehicle containing an organic binder, a photo-polymerization initiator and a photosetting monomer; and a silicate glass powder having a softening point in a range of about 700° C. to 1,050° C. and having an average particle size in a range of about 0.1 to 5.0 &mgr;m, said silicate glass powder being dispersed into said organic vehicle. Preferably, the silicate glass powder of the above insulating paste comprises a composition represented by xSiO2—yB203—zK2O where x+y+z is 100 parts by weight and the values z, y and z are on lines or within a region enclosed by lines passing through four points A(65, 35, 0), B(65, 20, 15), C(85, 0, 15) and D(85, 15, 0) on a ternary diagram thereof.

    摘要翻译： 本发明提供了一种绝缘膏，其包括：含有有机粘合剂，光聚合引发剂和光固化性单体的有机载体; 和软化点在约700℃至1050℃的平均粒径在约0.1至5.0μm的范围内的硅酸盐玻璃粉末，所述硅酸盐玻璃粉末分散在所述有机载体中。 优选地，上述绝缘膏的硅酸盐玻璃粉末包含由xSiO 2 -yB 2 O 3 -zK 2 O表示的组合物，其中x + y + z为100重量份，并且z，y和z的值在线上或由线包围的区域内 在其三元图上通过四个点A（65,35,0），B（65,20,15），C（85,0,15）和D（85,15,0）。

    Method of manufacturing a circuit board
    9.
    发明授权
    Method of manufacturing a circuit board 失效
    制造电路板的方法

    公开(公告)号：US06655024B2

    公开(公告)日：2003-12-02

    申请号：US10127477

    申请日：2002-04-23

    申请人： Masayuki Suzuki ,  Makoto Tose ,  Koji Yoshida ,  Tadayuki Okawa

    发明人： Masayuki Suzuki ,  Makoto Tose ,  Koji Yoshida ,  Tadayuki Okawa

    IPC分类号： H01K310

    CPC分类号： H05K3/0023 ,  H05K3/0082 ,  H05K3/4644 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2203/056 ,  Y10T29/49165

    摘要： A method for manufacturing a circuit board having a through-hole for defining via hole, which has a sloped inner wall tilted at a desired tilt angle &thgr;, is provided. The through-hole has an inverted-trapezoidal cross-section and is made using a photomask having a via hole pattern including a light-shielding pattern corresponding to the bottom of the through-hole, and pluralities of light-shielding strips and translucent strips which are arranged alternately and substantially parallel to one another, the pluralities of light-shielding strips and translucent strips corresponding to the sloped inner wall of the through-hole. The tilt angle &thgr; is determined using a polynomial approximation of degree n: f ⁡ ( s ) = θ = φ ⁢ ∑ k = 0 n ⁢ C k ⁢ s k wherein s is the width of the light-shielding strips and &phgr; is a constant relating to the exposure conditions, and is in the range of about 0.17 rad

    摘要翻译： 提供一种具有用于限定通孔的电路板的电路板的制造方法，所述通孔具有以期望的倾斜角θ倾斜的倾斜的内壁。 通孔具有倒梯形截面，并且使用具有通孔图案的光掩模制造，该通孔图案包括对应于通孔底部的遮光图案，以及多个遮光条和半透明条， 交替地且基本上彼此平行地布置，多个遮光条和对应于通孔的倾斜内壁的半透明条。 使用n度的多项式近似来确定倾斜角θ：其中s是遮光条的宽度，phi是与曝光条件有关的常数，并且在约0.17弧度<约1.40的范围内 RAD。