公开(公告)号：US07061454B2

公开(公告)日：2006-06-13

申请号：US10619507

申请日：2003-07-16

申请人： Masatoshi Sasuga ,  Yoshihisa Hirayama ,  Ryo Tamura ,  Takashi Akiyama

发明人： Masatoshi Sasuga ,  Yoshihisa Hirayama ,  Ryo Tamura ,  Takashi Akiyama

IPC分类号： G09G3/32 ,  G09G3/14

CPC分类号： H01L25/0753 ,  G02F1/133603 ,  H01L33/50 ,  H01L2924/0002 ,  H01L2924/00

摘要： An LED device comprises a white LED device and a red LED device. The white LED device has a substrate, a blue LED mounted on the substrate for emitting blue light, a transparent resin covering the blue LED and including phosphor particles. The phosphor particle has a quality to convert blue light to white light, if the particle contacts with the blue light. The red LED device has a substrate, a red LED mounted on the substrate for emitting red light, and a transparent resin covering the red LED device is disposed so that emitted red light mixes with the white light emitted from the white LED device.

摘要翻译： LED装置包括白色LED装置和红色LED装置。 白色LED装置具有基板，蓝色LED安装在基板上用于发射蓝色光，透明树脂覆盖蓝色LED并包括荧光体颗粒。 如果粒子与蓝光接触，则荧光体颗粒具有将蓝光转换成白光的质量。 红色LED装置具有基板，安装在基板上的红色LED，用于发出红色光，并且设置覆盖红色LED装置的透明树脂，使得发射的红光与从白色LED装置发出的白色光混合。

公开(公告)号：US20050051792A1

公开(公告)日：2005-03-10

申请号：US10934453

申请日：2004-09-07

申请人： Masatoshi Sasuga

发明人： Masatoshi Sasuga

IPC分类号： H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/12 ,  H01L23/13 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

CPC分类号： H01L23/13 ,  H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L33/486 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81208 ,  H01L2224/81211 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15157 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/189 ,  H05K3/0064 ,  H05K2201/10106 ,  H01L2924/00 ,  H01L2924/3512

摘要： A semiconductor package comprising a base material, an FPC substrate bonded through the intervention of an adhesive or an adhesive sheet on the base material and a semiconductor chip mounted on the FPC substrate, the semiconductor chip being mounted on the FPC substrate by FC bonding, the base material being formed by a resin, the base material having a concave portion or hole, and the semiconductor chip being mounted on the FPC substrate inside the concave portion or hole of the base material.

摘要翻译： 一种半导体封装，包括基材，通过粘合剂或粘合片介于基材上的FPC基板和安装在FPC基板上的半导体芯片，半导体芯片通过FC结合安装在FPC基板上， 基材由树脂形成，基材具有凹部或孔，半导体芯片安装在基板的凹部或孔内的FPC基板上。

公开(公告)号：US07538830B2

公开(公告)日：2009-05-26

申请号：US11111830

申请日：2005-04-22

申请人： Masatoshi Sasuga

发明人： Masatoshi Sasuga

IPC分类号： G02F1/1335

CPC分类号： G02F1/29 ,  F21S41/00 ,  F21S41/645 ,  F21V14/003 ,  F21Y2115/10 ,  G02F1/134309 ,  G02F2001/294 ,  G02F2203/28

摘要： A light-emitting apparatus, comprising at least one LED element, and at least one liquid crystal lens disposed to face the LED element and positioned at a distance from the LED element, a focal length of light, broadening and narrowing directions of light, and changing the illuminating area of light being adjustable by applying a voltage to the at least one liquid crystal lens and a light-emitting apparatus, further comprising at least one lens placed on the liquid crystal lens.

摘要翻译： 一种发光装置，包括至少一个LED元件，以及至少一个液晶透镜，其设置成面对所述LED元件并且定位在距离所述LED元件一定距离处，所述光的焦距，光的变宽和变窄的方向以及 通过向至少一个液晶透镜和发光装置施加电压来改变可调节的光的照明面积，还包括放置在液晶透镜上的至少一个透镜。

公开(公告)号：US20050243237A1

公开(公告)日：2005-11-03

申请号：US11111830

申请日：2005-04-22

申请人： Masatoshi Sasuga

发明人： Masatoshi Sasuga

IPC分类号： G02F1/13 ,  F21S8/10 ,  F21V5/04 ,  F21V14/00 ,  F21V17/00 ,  F21V17/02 ,  F21Y101/02 ,  G02F1/1335 ,  G02F1/1343 ,  G02F1/29 ,  H01L33/48 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62

CPC分类号： G02F1/29 ,  F21S41/00 ,  F21S41/645 ,  F21V14/003 ,  F21Y2115/10 ,  G02F1/134309 ,  G02F2001/294 ,  G02F2203/28

摘要： A light-emitting apparatus, comprising at least one LED element, and at least one liquid crystal lens disposed to face the LED element and positioned at a distance from the LED element, a focal length of light, broadening and narrowing directions of light, and changing the illuminating area of light being adjustable by applying a voltage to the at least one liquid crystal lens and a light-emitting apparatus, further comprising at least one lens placed on the liquid crystal lens.

摘要翻译： 一种发光装置，包括至少一个LED元件，以及至少一个液晶透镜，其设置成面对所述LED元件并且定位在距离所述LED元件一定距离处，所述光的焦距，光的变宽和变窄的方向以及 通过向至少一个液晶透镜和发光装置施加电压来改变可调节的光的照明面积，还包括放置在液晶透镜上的至少一个透镜。

公开(公告)号：US07199400B2

公开(公告)日：2007-04-03

申请号：US10934453

申请日：2004-09-07

申请人： Masatoshi Sasuga

发明人： Masatoshi Sasuga

IPC分类号： H01L27/15

CPC分类号： H01L23/13 ,  H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L33/486 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81208 ,  H01L2224/81211 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15157 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/189 ,  H05K3/0064 ,  H05K2201/10106 ,  H01L2924/00 ,  H01L2924/3512

摘要： A semiconductor package comprising a base material, an FPC substrate bonded through the intervention of an adhesive or an adhesive sheet on the base material and a semiconductor chip mounted on the FPC substrate, the semiconductor chip being mounted on the FPC substrate by FC bonding, the base material being formed by a resin, the base material having a concave portion or hole, and the semiconductor chip being mounted on the FPC substrate inside the concave portion or hole of the base material.

摘要翻译： 一种半导体封装，其包括基材，通过粘合剂或粘合片介于基材上的FPC基板和安装在FPC基板上的半导体芯片，所述半导体芯片通过FC结合安装在FPC基板上， 基材由树脂形成，基材具有凹部或孔，半导体芯片安装在基板的凹部或孔内的FPC基板上。