Process for producing polyamide acid having siloxane bonds and polyimide
having siloxane bonds and isoindoloquinazolinedione rings
    3.
    发明授权
    Process for producing polyamide acid having siloxane bonds and polyimide having siloxane bonds and isoindoloquinazolinedione rings 失效
    具有硅氧烷键的聚酰胺酸的制造方法和具有硅氧烷键和异吲哚喹啉二酮环的聚酰亚胺的制造方法

    公开(公告)号:US4847358A

    公开(公告)日:1989-07-11

    申请号:US86892

    申请日:1987-08-18

    IPC分类号: C08G73/10

    CPC分类号: C08G73/106

    摘要: There are disclosed a process for producing a polyamide acid having at least one siloxane bond, which comprises carrying out the reaction of:(a) a tetracarboxylic dianhydride having at least one siloxane bond of the formula: ##STR1## wherein R represents a monovalent hydrocarbon group and m is an integer of 1 or more;(b) a diamine; and(c) a diaminoamide compound of the formula (II): ##STR2## wherein Ar represents an aromatic residue, Y represents SO.sub.2 or CO, and one amino group and Y--YNH.sub.2 are positioned in ortho-position to each other,and optinal presence of(d) an aromatic tetracarboxylic dianhydride;with the total amount of the diamine and the diaminoamide compound and the total amount of the tetracarboxylic dianhydride of the formula (I) and the aromatic tetracarboxylic dianhydride optionally contained being substantially equal moles;and a process for producing a polyimide having at least one siloxane bond and at least one isoindoloquinazolinedione ring, which comprises further heating the resulting polyamide acid to dehydration ring closure.

    摘要翻译: 公开了一种制备具有至少一个硅氧烷键的聚酰胺酸的方法,该方法包括进行以下反应:(a)具有至少一个具有下式的硅氧烷键的四羧酸二酐:其中R表示 一价烃基,m为1以上的整数, (b)二胺; 和(c)式(II)的二氨基酰胺化合物:其中Ar表示芳族残基,Y表示SO 2或CO,一个氨基和Y-YNH 2彼此相邻位置 ,和(d)芳族四羧酸二酐的选择性存在; 二胺和二氨基酰胺化合物的总量和式(I)的四羧酸二酐和任选地含有的芳族四羧酸二酐的总量基本相等; 以及生产具有至少一个硅氧烷键和至少一个异吲哚喹啉二酮环的聚酰亚胺的方法,其包括进一步将所得聚酰胺酸加热至脱水闭环。

    Polyimide precursor, cured product thereof, and processes for producing
them
    5.
    发明授权
    Polyimide precursor, cured product thereof, and processes for producing them 失效
    聚酰亚胺前体,其固化物及其制造方法

    公开(公告)号:US5272247A

    公开(公告)日:1993-12-21

    申请号:US779986

    申请日:1991-10-21

    摘要: The present invention provides a polyimide having all of small dielectric constant, small thermal expansion coefficient, high heat resistance, high glass transition temperature and high mechanical properties, a precursor of the polyimide, and processes for producing them. A polyimide precursor whose molecular chain comprises repeating units represented by the following general formula (1) and repeating units represented by the following general formula (2): ##STR1## wherein R.sup.1 is at least one kind of tetravalent organic group selected from the group consisting of ##STR2## R.sup.2 is at least one kind of divalent organic group having a linear structure which is selected from the group consisting of ##STR3## m is an integer of 1 to 4, and R.sup.3 is a divalent organic group having a non-linear structure which contains at least two aromatic rings.

    摘要翻译: 本发明提供了具有小介电常数,小热膨胀系数,高耐热性,高玻璃化转变温度和高机械性能的聚酰亚胺,聚酰亚胺的前体及其制备方法。 其分子链包含由以下通式(1)表示的重复单元和由以下通式(2)表示的重复单元的聚酰亚胺前体:其中R 1为至少一种 选自 R2的四价有机基团中的至少一种是具有线性结构的至少一种二价有机基团,其选自由以下组成的组: >和< IMAGE> m为1〜4的整数,R 3为含有至少2个芳香环的非线性结构的二价有机基团。