摘要:
Disclosed herein are processes for the preparation of polyimide-isoindroquinazolinediones and precursor thereof. These polymers are useful as heat-resistant electric insulation materials, surface coating films for electronic instrument parts and especially suitable for manufacturing a photoresist. The above precursor is produced by reacting a an alkylenebistrimellitate dianhydride, a diaminoamide compound and the other amine. The precursor is readily dehydrated and ring-closed to produce polyimide-isoindroquinazolinedione, which is often conveniently conducted by producing a varnish of the precursor, applying it onto adequate substrates such as silicon wafers, glass plates, metal plates, etc. and then subjecting the coated film to dehydration. The resulting films have excellent physical properties such as good adherence, high tensile strength, low elasticity, etc.
摘要:
An N-aryl-.alpha.-amino acid (I), which is a novel compound, is effective as a photoinitiator. The photoinitiator composition including this photoinitiator is effective for improving photosensitive properties of photosensitive materials containing poly(amic acid) and an addition polymerizable compound used for pattern formation. Further, a photoinitiator composition (A) comprising an N-aryl-.alpha.-amino acid (I) or (I'), a 3-substituted coumarin (II) and/or an azabenzalcyclohexanone (III), or a photoinitiator composition (B) comprising an N-aryl-.alpha.-amino acid (I) or (I'), a 3-substituted coumarin (II) and a titanocene (IV), or a photoinitiator composition (C) comprising a 3-substituted coumarin (II), a titanocene (IV) and an oxime ester (V), is effective for improving photosensitive properties of photosensitive materials containing poly(amic acid) and an addition polymerizable compound used for pattern formation.
摘要:
There are disclosed a process for producing a polyamide acid having at least one siloxane bond, which comprises carrying out the reaction of:(a) a tetracarboxylic dianhydride having at least one siloxane bond of the formula: ##STR1## wherein R represents a monovalent hydrocarbon group and m is an integer of 1 or more;(b) a diamine; and(c) a diaminoamide compound of the formula (II): ##STR2## wherein Ar represents an aromatic residue, Y represents SO.sub.2 or CO, and one amino group and Y--YNH.sub.2 are positioned in ortho-position to each other,and optinal presence of(d) an aromatic tetracarboxylic dianhydride;with the total amount of the diamine and the diaminoamide compound and the total amount of the tetracarboxylic dianhydride of the formula (I) and the aromatic tetracarboxylic dianhydride optionally contained being substantially equal moles;and a process for producing a polyimide having at least one siloxane bond and at least one isoindoloquinazolinedione ring, which comprises further heating the resulting polyamide acid to dehydration ring closure.
摘要:
An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubustituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.
摘要:
The present invention provides a polyimide having all of small dielectric constant, small thermal expansion coefficient, high heat resistance, high glass transition temperature and high mechanical properties, a precursor of the polyimide, and processes for producing them. A polyimide precursor whose molecular chain comprises repeating units represented by the following general formula (1) and repeating units represented by the following general formula (2): ##STR1## wherein R.sup.1 is at least one kind of tetravalent organic group selected from the group consisting of ##STR2## R.sup.2 is at least one kind of divalent organic group having a linear structure which is selected from the group consisting of ##STR3## m is an integer of 1 to 4, and R.sup.3 is a divalent organic group having a non-linear structure which contains at least two aromatic rings.
摘要:
An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.
摘要:
A liquid crystal display device containing a liquid crystal orientation controlling film made from a fluorine-containing polyimide-isoindoloquinazolinedione is high in a tilt angle and excellent in viewing properties.