公开(公告)号：US5115089A

公开(公告)日：1992-05-19

申请号：US245157

申请日：1988-09-16

申请人： Masatoshi Yoshida ,  Katsuji Shibata ,  Mitsumasa Kojima ,  Hidetaka Satou ,  Toshihiko Kato ,  Yasuo Miyadera ,  Masami Yusa

发明人： Masatoshi Yoshida ,  Katsuji Shibata ,  Mitsumasa Kojima ,  Hidetaka Satou ,  Toshihiko Kato ,  Yasuo Miyadera ,  Masami Yusa

IPC分类号： C08G73/06 ,  C08G73/10

CPC分类号： C08G73/06 ,  C08G73/0677 ,  C08G73/1007 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/1064 ,  C08G73/1085

摘要： Disclosed herein are processes for the preparation of polyimide-isoindroquinazolinediones and precursor thereof. These polymers are useful as heat-resistant electric insulation materials, surface coating films for electronic instrument parts and especially suitable for manufacturing a photoresist. The above precursor is produced by reacting a an alkylenebistrimellitate dianhydride, a diaminoamide compound and the other amine. The precursor is readily dehydrated and ring-closed to produce polyimide-isoindroquinazolinedione, which is often conveniently conducted by producing a varnish of the precursor, applying it onto adequate substrates such as silicon wafers, glass plates, metal plates, etc. and then subjecting the coated film to dehydration. The resulting films have excellent physical properties such as good adherence, high tensile strength, low elasticity, etc.

公开(公告)号：US4833204A

公开(公告)日：1989-05-23

申请号：US240604

申请日：1988-09-06

申请人： Masami Yusa ,  Katsuji Shibata ,  Yasuo Miyadera

发明人： Masami Yusa ,  Katsuji Shibata ,  Yasuo Miyadera

IPC分类号： C08L63/02 ,  C08G59/68 ,  C08L63/00 ,  H05K1/03

CPC分类号： H05K1/0326 ,  C08G59/686 ,  C08L63/00

摘要： An epoxy resin composition for a copper-clad laminate comprising an epoxy resin having at least two epoxy groups in one molecule, a phenolic compound having at least two functional groups in one molecule as a hardener, an imidazole compound having a masked imino group as a hardening accelerator, and one or more of nitrogen compounds selected from the group consisting of urea derivatives represented by the formula R.sup.1 --NH--CO--NH.sub.2, wherein R.sup.1 is hydrogen or an organic group; acid amide compounds; and guanidine derivatives, which is advantageously used for the material of a copper-clad laminate. Accordingly, the copper-clad laminate is especially used for the production of printed circuit boards, and its drilling property, peeling resistance of the copper foil, adhesive property, and heat resistance are improved remarkably. In addition, this epoxy resin composition has an excellent storing stability.

摘要翻译： 一种用于覆铜层压板的环氧树脂组合物，其包含在一个分子中具有至少两个环氧基的环氧树脂，在一个分子中具有至少两个官能团的酚化合物作为硬化剂，具有掩蔽的亚氨基的咪唑化合物作为 硬化促进剂和选自由式R 1 -NH-CO-NH 2表示的脲衍生物的一种或多种氮化合物，其中R 1是氢或有机基团; 酰胺化合物; 和胍衍生物，其有利地用于覆铜层压板的材料。 因此，覆铜层压板特别用于制造印刷电路板，其显着提高了其铜箔的开孔性，耐剥离性，粘合性和耐热性。 此外，该环氧树脂组合物具有优异的储存稳定性。

公开(公告)号：US5571579A

公开(公告)日：1996-11-05

申请号：US326151

申请日：1994-10-19

申请人： Toshihiko Kato ,  Masami Yusa ,  Nobuo Miyadera ,  Hideyuki Hashimoto ,  Yasuo Miyadera ,  Masahiro Kawakami

发明人： Toshihiko Kato ,  Masami Yusa ,  Nobuo Miyadera ,  Hideyuki Hashimoto ,  Yasuo Miyadera ,  Masahiro Kawakami

IPC分类号： C08G73/10 ,  C09D179/08 ,  C09K19/56 ,  G02F1/1337 ,  C09K19/00 ,  B05D3/12

CPC分类号： C08G73/1053 ,  C09D179/08 ,  G02F1/133723 ,  Y10T428/1018

摘要： An alignment film for liquid crystal is provided which comprises a polyimide comprising a repeating unit of the general formula (I): ##STR1## wherein n is an integer of from 2 to 16 and R.sup.1 represents a divalent organic group. This polyimide is obtained for example, from a reaction between ethylene glycol bis(trimellitate dianhydride) and 4,4'-diaminodiphenyl ether. This polyimide or a varnish of a precursor thereof is coated on a plate, and dried to obtain an alignment film for liquid crystal, which stably exhibits a high pretilt angle, irrespective of curing temperatures. The present invention further provides a liquid crystal-sandwiched panel and a liquid crystal display module prepared using the alignment film as well as a material for the preparation of the alignment film.

摘要翻译： 提供了一种用于液晶的取向膜，其包括含有通式（I）的重复单元的聚酰亚胺：其中n为2至16的整数，R 1表示二价有机基团。 该聚酰亚胺例如由乙二醇双（偏苯三酸二酐）与4,4'-二氨基二苯醚的反应得到。 将该聚酰亚胺或其前体清漆涂布在板上，干燥，得到与固化温度无关的稳定地表现出高预倾角的液晶取向膜。 本发明还提供一种液晶夹板和使用取向膜制备的液晶显示模块以及用于制备取向膜的材料。

公开(公告)号：US07258918B2

公开(公告)日：2007-08-21

申请号：US10345166

申请日：2003-01-16

申请人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

发明人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

IPC分类号： B32B7/12

CPC分类号： H05K3/323 ,  B32B7/12 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/305 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0329 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1189 ,  Y10T428/12569 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

摘要： An adhesive film including a reactive adhesive capable of curing by heating or light irradiation and a polyphthalide represented by the formula I: wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a Fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or CO and n represents a number of repeating units in the polymer. The adhesive film can be used to connect, e.g., electrodes of a semiconductor chip to electrodes of a wiring board. The polyphthalide can be used to surface-treat, e.g., electrodes of a wiring board.

摘要翻译： 一种粘合膜，其包括能够通过加热或光照射固化的反应性粘合剂和由式I表示的多苯酞：其中R表示二价芳族烃基或含二价杂环的芳族基团，R 1， 表示R 1的数为0〜4的烷基，氟化烷基，烷氧基或卤素原子，X表示O或NR 3， 条件是R 3表示以下基团之一，Y表示SO 2或CO，n表示聚合物中的重复单元数。 粘合膜可用于将例如半导体芯片的电极连接到布线板的电极。 多苯酞可用于表面处理例如布线板的电极。

公开(公告)号：US20060180903A1

公开(公告)日：2006-08-17

申请号：US11379921

申请日：2006-04-24

申请人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

发明人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC分类号： H01L23/495

CPC分类号： H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

摘要翻译： 将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置 这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

公开(公告)号：US06825249B1

公开(公告)日：2004-11-30

申请号：US09616943

申请日：2000-07-14

申请人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Yasuo Miyadera ,  Mituo Yamasaki ,  Iwao Maekawa ,  Akio Kotato ,  Yuusuke Miyamae ,  Tadaji Satou ,  Makoto Saitou ,  Tooru Kikuchi ,  Akira Kageyama ,  Aizou Kaneda

发明人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Yasuo Miyadera ,  Mituo Yamasaki ,  Iwao Maekawa ,  Akio Kotato ,  Yuusuke Miyamae ,  Tadaji Satou ,  Makoto Saitou ,  Tooru Kikuchi ,  Akira Kageyama ,  Aizou Kaneda

IPC分类号： C08K300

CPC分类号： H01L24/27 ,  H01L21/4821 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/7565 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： Provided are a laminating method and machine for successively heating and compression-bonding a film-shaped organic die-bonding material on a leadframe. leadframe 7 is placed on a travelling table 8 and is heated there. A film-shaped organic die-bonding material 2 is punched out and the resulting film is tack-bonded to a die pad on the leadframe. The leadframe with the film tack-bonded thereon is then moved to a position B by the travelling table. After the film is pressed by a compression-bonding element at the position B, a chip is mounted on the film-shaped organic die-bonding material 2. It is therefore possible to bond a film-shaped organic die-bonding material under compression on a leadframe with good productivity but without voids and further to avoid package cracking upon mounting a chip.

摘要翻译： 提供了一种用于在引线框上依次加热和压接薄膜状有机芯片接合材料的层压方法和机器。将框架7放置在行进台8上并在那里被加热。 将膜状有机芯片接合材料2冲压出来，将所得的薄膜粘合到引线框架上的芯片焊盘上。 然后将其上粘贴有胶片的引线框架通过移动台移动到位置B. 在位置B的压接元件压制薄膜后，将薄片状的有机芯片接合材料2安装在芯片上。因此，可以将薄膜状的有机模片接合材料压缩 引导框架，生产效率高，但没有空隙，并进一步避免了在安装芯片时的封装破裂。

公开(公告)号：US06717242B2

公开(公告)日：2004-04-06

申请号：US09785194

申请日：2001-02-20

申请人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

发明人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC分类号： H01L23495

CPC分类号： H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 Mpa or less at a temperature of 259° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

摘要翻译： 将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在259℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10Mpa以下。半导体装置 这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

公开(公告)号：US6099678A

公开(公告)日：2000-08-08

申请号：US875330

申请日：1997-06-25

申请人： Akio Kotato ,  Yuusuke Miyamae ,  Tadaji Satou ,  Makoto Saitou ,  Tooru Kikuchi ,  Akira Kageyama ,  Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Yasuo Miyadera ,  Mituo Yamasaki ,  Iwao Maekawa ,  Aizou Kaneda

发明人： Akio Kotato ,  Yuusuke Miyamae ,  Tadaji Satou ,  Makoto Saitou ,  Tooru Kikuchi ,  Akira Kageyama ,  Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Yasuo Miyadera ,  Mituo Yamasaki ,  Iwao Maekawa ,  Aizou Kaneda

IPC分类号： H01L21/58 ,  H01L21/60 ,  B32B31/00 ,  B23P19/00 ,  B32B35/00 ,  H05K3/30

CPC分类号： H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/7565 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/181 ,  Y10T156/1062 ,  Y10T156/107 ,  Y10T156/12 ,  Y10T156/1322 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/53178

摘要： A laminating method and a machine are provided for successively heating and compression-bonding a film-shaped organic die-bonding material on a leadframe with good productivity but without voids and further to avoid package cracking upon mounting a chip. A leadframe 7 is placed on a travelling table 8 and is heated there. A film-shaped organic die-bonding material 2 is punched out and the resulting film is tack-bonded to a die pad on the leadframe. The leadframe with the film tack-bonded thereon is then moved to a position b by the travelling table. After the film is pressed by a compression-bonding element at the position B, a chip is mounted on the film-shaped organic die-bonding material 2.

摘要翻译： PCT No.PCT / JP95 / 02691 Sec。 371日期：1997年6月25日 102（e）日期1997年6月25日PCT 1995年12月26日PCT PCT。 公开号WO96 / 29730 日期1996年9月26日提供层压方法和机器，用于在引线框上以良好的生产率连续加热和压接粘合材料，但没有空隙，并且进一步避免了在安装芯片时的封装破裂。 引线框架7放置在行进台8上并在那里被加热。 将膜状有机芯片接合材料2冲压出来，将所得的薄膜粘合到引线框架上的芯片焊盘上。 然后将其上粘贴有胶片的引线框架通过移动台移动到位置b。 在位置B的压接元件压制薄膜后，在薄膜状有机芯片接合材料2上安装芯片。

公开(公告)号：US5605763A

公开(公告)日：1997-02-25

申请号：US560182

申请日：1995-11-20

申请人： Masami Yusa ,  Shinji Takeda ,  Takashi Masuko ,  Yasuo Miyadera ,  Mitsuo Yamazaki

发明人： Masami Yusa ,  Shinji Takeda ,  Takashi Masuko ,  Yasuo Miyadera ,  Mitsuo Yamazaki

IPC分类号： C09J7/00 ,  C08J5/18 ,  C08K3/08 ,  C08L79/08 ,  C09J7/02 ,  C09J161/06 ,  C09J163/00 ,  C09J179/08 ,  H01B1/22 ,  H01B5/14 ,  H01L21/52 ,  H05K3/38 ,  B32B27/18 ,  C90J7/00

CPC分类号： C08J5/18 ,  C08K3/08 ,  C08L79/08 ,  H01B1/22 ,  H01L24/29 ,  C08J2379/08 ,  H01L2924/01322 ,  H01L2924/10253 ,  Y10S428/901 ,  Y10S525/928 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/31681 ,  Y10T428/31721

摘要： Described is an electrically conductive bonding film useful in bonding an IC or LSI with a lead frame. The film comprises (A) a polyimide resin obtained by reacting a tetracarboxylic dianhydride component, in which the content of a tetracarboxylic dianhydride represented by the following formula (I): ##STR1## wherein n stands for an integer of 2-20 amounts to at least 70 mole %, with a diamine; (B) an electrically conductive filler, and a thermoset resin. Optionally, the film may further comprises a thermosetting resin or an imide compound having at least two thermally-crosslinking imido groups per molecule.

摘要翻译： 描述了可用于将IC或LSI与引线框架接合的导电接合膜。 该膜包含（A）通过使四羧酸二酐组分反应得到的聚酰亚胺树脂，其中由下式（I）表示的四羧酸二酐的含量：其中n表示2-20的整数 至少70摩尔％，与二胺; （B）导电填料和热固性树脂。 任选地，该膜还可以包含每分子具有至少两个热交联酰亚胺基的热固性树脂或酰亚胺化合物。

公开(公告)号：US20060263599A1

公开(公告)日：2006-11-23

申请号：US11494708

申请日：2006-07-28

申请人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

发明人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

IPC分类号： B32B7/12

CPC分类号： H05K3/323 ,  B32B7/12 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/305 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0329 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1189 ,  Y10T428/12569 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

摘要： The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.

摘要翻译： 本发明涉及一种连接电极的方法，包括：插入由式（I）表示的多苯酞：其中R表示二价芳族烃基或含二价杂环的芳族基团，R 1表示 烷基，氟化烷基，烷氧基或卤原子，其中R 1的数目为0至4，X表示O或NR 3，提供 R 3表示以下基团之一，Y表示SO 2或Co，n表示聚合物中的重复单元数，作为压敏导电性聚合物 最少部分地彼此相对的电极; 并且施加压力以固定两个电极，包括形成在电极部分的至少一部分表面上的由式（I）表示的多苯酞的表面处理布线板，包含由式（I）表示的粘合剂和多苯酞的粘合剂膜 （I），以及使用其的电极连接结构。