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1.发明授权Photoinitiator compositions including amino acids, coumarin and titanocene and photosensitive materials using the same 失效光引发剂组合物包括氨基酸，香豆素和二茂钛，以及使用其的感光材料
公开(公告)号：US5811218A
公开(公告)日：1998-09-22
申请号：US503274
申请日：1995-07-17
申请人： Makoto Kaji , Yasunori Kojima , Shigeki Katogi , Masataka Nunomura , Hideo Hagiwara , Dai Kawasaki , Mitsumasa Kojima , Hiroshi Suzuki , Hidetaka Satou
发明人： Makoto Kaji , Yasunori Kojima , Shigeki Katogi , Masataka Nunomura , Hideo Hagiwara , Dai Kawasaki , Mitsumasa Kojima , Hiroshi Suzuki , Hidetaka Satou
CPC分类号： G03F7/031 , G03F7/029 , G03F7/037 , Y10S430/12 , Y10S430/122 , Y10S430/125 , Y10S430/126 , Y10S430/127
摘要： An N-aryl-.alpha.-amino acid (I), which is a novel compound, is effective as a photoinitiator. The photoinitiator composition including this photoinitiator is effective for improving photosensitive properties of photosensitive materials containing poly(amic acid) and an addition polymerizable compound used for pattern formation. Further, a photoinitiator composition (A) comprising an N-aryl-.alpha.-amino acid (I) or (I'), a 3-substituted coumarin (II) and/or an azabenzalcyclohexanone (III), or a photoinitiator composition (B) comprising an N-aryl-.alpha.-amino acid (I) or (I'), a 3-substituted coumarin (II) and a titanocene (IV), or a photoinitiator composition (C) comprising a 3-substituted coumarin (II), a titanocene (IV) and an oxime ester (V), is effective for improving photosensitive properties of photosensitive materials containing poly(amic acid) and an addition polymerizable compound used for pattern formation.
摘要翻译： 作为新型化合物的N-芳基-α-氨基酸（I）作为光引发剂是有效的。 包含该光引发剂的光引发剂组合物对于改善含有聚（酰胺酸）的感光材料和用于图案形成的加成聚合性化合物的感光性能是有效的。 此外，包含N-芳基-α-氨基酸（I）或（I'），3-取代香豆素（II）和/或氮杂苯并环己酮（III）的光引发剂组合物（A）或光引发剂组合物 ）包含N-芳基-α-氨基酸（I）或（I'），3-取代香豆素（II）和二茂钛（IV）或包含3-取代香豆素（II）的光引发剂组合物（C） ），二茂钛（IV）和肟酯（V））对于改善含有聚（酰胺酸）的感光材料和用于图案形成的加成聚合性化合物的感光性能是有效的。
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公开(公告)号：US6143475A
公开(公告)日：2000-11-07
申请号：US83056
申请日：1998-05-22
CPC分类号： G03F7/037 , C08G73/10 , C08G73/1053 , C08G73/1082 , G03F7/0387 , H05K3/4676
摘要： A polyimide precursor having repeating units of the formula: ##STR1## wherein R.sup.1 is a tetravalent organic group; and R.sup.2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, said photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.
摘要翻译： 一种具有下式重复单元的聚酰亚胺前体：其中R1是四价有机基团; R2是二价二苯基，图像形成优异，特别适合于使用i线步进机形成图案，并且通过赋予聚酰亚胺前体光敏性得到感光性树脂组合物，所述感光性树脂组合物适于形成表面 用于半导体器件的保护膜或用于多层布线板的层间绝缘膜。
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3.发明授权
公开(公告)号：US6071667A
公开(公告)日：2000-06-06
申请号：US630478
申请日：1996-04-10
CPC分类号： G03F7/037 , C08G73/10 , C08G73/1053 , C08G73/1082 , G03F7/0387 , H05K3/4676
摘要： A polyimide precursor having repeating units of the formula: wherein R.sup.1 is a tetravalent organic group; and R.sup.2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, said photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.
摘要翻译： 一种具有下式重复单元的聚酰亚胺前体：其中R1是四价有机基团; R2是二价二苯基，图像形成优异，特别适合于使用i线步进机形成图案，并且通过赋予聚酰亚胺前体光敏性得到感光性树脂组合物，所述感光性树脂组合物适于形成表面 用于半导体器件的保护膜或用于多层布线板的层间绝缘膜。
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公开(公告)号：US06309791B1
公开(公告)日：2001-10-30
申请号：US09634582
申请日：2000-08-08
IPC分类号： G03F7075
CPC分类号： G03F7/037 , C08G73/10 , C08G73/1053 , C08G73/1082 , G03F7/0387 , H05K3/4676
摘要： A polyimide precursor having repeating units of the formula: wherein R1 is a tetravalent organic group; and R2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, said photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.
摘要翻译： 一种具有下式重复单元的聚酰亚胺前体：其中R1是四价有机基团; R2是二价二苯基，图像形成优异，特别适合于使用i线步进机形成图案，并且通过赋予聚酰亚胺前体光敏性得到感光性树脂组合物，所述感光性树脂组合物适于形成表面 用于半导体器件的保护膜或用于多层布线板的层间绝缘膜。
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公开(公告)号：US07153631B2
公开(公告)日：2006-12-26
申请号：US10713036
申请日：2003-11-17
申请人： Hideo Hagiwara , Makoto Kaji , Masataka Nunomura
发明人： Hideo Hagiwara , Makoto Kaji , Masataka Nunomura
IPC分类号： G03F7/037
CPC分类号： G03F7/0387 , C08G73/10 , G03F7/0125 , G03F7/037 , G03F7/038 , G03F7/075 , H05K3/4676 , Y10S430/106 , Y10S430/107
摘要： There are disclosed a photosensitive resin composition which comprises (A) a polyamic acid having recurring units represented by the formula (I): wherein R1 represents and R2 represents a divalent organic group, and (B) an acryl compound having an amino group, and also a photosensitive resin composition for an i-line stepper which further comprises a photoinitiator in addition to the photosensitive resin composition.
摘要翻译： 公开了一种光敏树脂组合物，其包含（A）具有由式（I）表示的重复单元的聚酰胺酸：其中R 1表示，R 2表示二价 有机基团和（B）具有氨基的丙烯酸类化合物，以及除了感光性树脂组合物之外，还含有光引发剂的i线步进机用感光性树脂组合物。
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公开(公告)号：US06194126B1
公开(公告)日：2001-02-27
申请号：US09136610
申请日：1998-08-20
申请人： Hideo Hagiwara , Makoto Kaji , Masataka Nunomura
发明人： Hideo Hagiwara , Makoto Kaji , Masataka Nunomura
IPC分类号： G03F730
CPC分类号： G03F7/0387 , C08G73/10 , G03F7/0125 , G03F7/037 , G03F7/038 , G03F7/075 , H05K3/4676 , Y10S430/106 , Y10S430/107
摘要： There are disclosed a photosensitive resin composition which comprises (A) a polyamic acid having recurring units represented by the formula (I): wherein R1 represents and R2 represents a divalent organic group, and (B) an acryl compound having an amino group, and also a photosensitive resin composition for an i-line stepper which further comprises a photoinitiator in addition to the photosensitive resin composition.
摘要翻译： 公开了一种感光性树脂组合物，其包含：（A）具有式（I）表示的重复单元的聚酰胺酸：其中R1表示并且R2表示二价有机基团，（B）具有氨基的丙烯酸化合物， 除了感光性树脂组合物之外，还具有光引发剂的i线步进机用感光性树脂组合物。
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公开(公告)号：US5856059A
公开(公告)日：1999-01-05
申请号：US664515
申请日：1996-06-17
申请人： Hideo Hagiwara , Makoto Kaji , Masataka Nunomura
发明人： Hideo Hagiwara , Makoto Kaji , Masataka Nunomura
IPC分类号： G03F7/008 , C08G73/10 , G03F7/012 , G03F7/027 , G03F7/028 , G03F7/037 , G03F7/038 , G03F7/075 , H01L21/027 , H01L21/312 , H05K1/00
CPC分类号： G03F7/0387 , C08G73/10 , G03F7/0125 , G03F7/037 , G03F7/038 , G03F7/075 , H05K3/4676 , Y10S430/106 , Y10S430/107
摘要： There are disclosed a photosensitive resin composition which comprises(A) a polyamic acid having recurring units represented by the formula (I): ##STR1## represents a divalent organic group, and (B) an acryl compound having an amino group, and also a photosensitive resin composition for an i-line stepper which further comprises a photoinitiator in addition to the photosensitive resin composition.
摘要翻译： 公开了一种感光性树脂组合物，其含有（A）具有式（I）表示的重复单元的聚酰胺酸：（I）表示二价有机基团，（B）具有式 氨基，以及除了感光性树脂组合物之外，还含有光引发剂的i线步进机用感光性树脂组合物。
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公开(公告)号：US5668248A
公开(公告)日：1997-09-16
申请号：US517583
申请日：1995-08-22
CPC分类号： C08G73/1025 , C07C275/40 , C08G73/0677 , C08G73/10 , C08G73/1042 , C08G73/1067 , C08G73/1071 , C08G73/1085 , C08G73/16 , G03F7/0387
摘要： A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: ##STR1## and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion.
摘要翻译： 一种感光性树脂组合物，其包含作为其主要成分的由式（I）表示的二氨基化合物构成的聚（酰胺酸）树脂和任选使用的其它二氨基化合物和四羧酸二酐作为其构成单体和/ 或通过将所述聚（酰胺酸）树脂和/或通过所述聚（酰胺酸）树脂或聚（酰胺酸）的脱水或醇消除闭环反应获得的聚酰胺树脂和/或聚酰亚胺树脂酯化获得的聚（酰胺酸） ）酯树脂具有优异的显影性和高的膜强度，并且可以形成低热膨胀的浮雕图案。
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公开(公告)号：US5847071A
公开(公告)日：1998-12-08
申请号：US843860
申请日：1997-04-17
CPC分类号： C08G73/1025 , C07C275/40 , C08G73/0677 , C08G73/10 , C08G73/1042 , C08G73/1067 , C08G73/1071 , C08G73/1085 , C08G73/16 , G03F7/0387
摘要： A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: ##STR1## and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion.
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公开(公告)号：US5472823A
公开(公告)日：1995-12-05
申请号：US5210
申请日：1993-01-15
CPC分类号： C08G73/1025 , C07C275/40 , C08G73/0677 , C08G73/10 , C08G73/1042 , C08G73/1067 , C08G73/1071 , C08G73/1085 , C08G73/16 , G03F7/0387
摘要： A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: ##STR1## and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion.
摘要翻译： 一种感光性树脂组合物，其包含作为其主要成分的由式（I）表示的二氨基化合物构成的聚（酰胺酸）树脂和任选使用的其它二氨基化合物和四羧酸二酐作为其构成单体和/ 或通过将所述聚（酰胺酸）树脂和/或通过所述聚（酰胺酸）树脂或聚（酰胺酸）的脱水或醇消除闭环反应获得的聚酰胺树脂和/或聚酰亚胺树脂酯化获得的聚（酰胺酸） ）酯树脂具有优异的显影性和高的膜强度，并且可以形成低热膨胀的浮雕图案。
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