利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

16 条记录 (耗时 0.024 秒)

    Semiconductor package and method for producing heat-radiating substrate for it
    5.
    发明授权
    Semiconductor package and method for producing heat-radiating substrate for it 有权
    半导体封装及其制造用散热基板的方法

    公开(公告)号：US06926861B2

    公开(公告)日：2005-08-09

    申请号：US10671712

    申请日：2003-09-29

    申请人： Norio Hirayama ,  Mitsuo Osada ,  Akira Ichida ,  Yoshinari Amano ,  Kiyoshi Asai ,  Hidetoshi Maesato ,  Tadashi Arikawa ,  Kenji Sakimae

    发明人： Norio Hirayama ,  Mitsuo Osada ,  Akira Ichida ,  Yoshinari Amano ,  Kiyoshi Asai ,  Hidetoshi Maesato ,  Tadashi Arikawa ,  Kenji Sakimae

    IPC分类号： B21B3/00 ,  B22F3/02 ,  B22F3/04 ,  B22F3/26 ,  C04B37/02 ,  H01L21/48 ,  H01L23/02 ,  H01L23/06 ,  H01L23/08 ,  H01L23/373 ,  B22F3/14

    CPC分类号： B22F3/045 ,  B22F3/02 ,  B22F2998/10 ,  H01L21/4871 ,  H01L21/4878 ,  H01L23/3733 ,  H01L2924/0002 ,  B22F3/26 ,  H01L2924/00

    摘要： A package to be mounted with semiconductor chips has a heat-radiating substrate having a thickness of smaller than 0.4 mm of a Cu—Mo composite as prepared by impregnating from 30 to 40% by mass of copper (Cu) melt into a green compact of molybdenum. The heat-radiating substrate is produced by preparing an Mo green compact through isostatic molding, mounting Cu on the Mo green compact, heating it to thereby impregnate copper into the Mo green compact to give a Cu—Mo composite, and rolling the Cu—Mo composite into a sheet substrate. In the isostatic molding process, at least two or more plates 27, 29, 31, 33, 35 and 37 are disposed adjacent to the inner surface of a side wall as divided into at least two portions, Mo powder is filled into the space as formed by those plates 27, 29, 31, 33, 35 and 37 with covering the Mo powder compact with a flexible cover, such as a rubber medium 39 or the like, to prepare a composite, then the resulting composite is put into a pressure tank, an external isostatic pressure is applied thereto against the flexible cover, and the plates are slid via the cover along the side wall thereby compressing the composite between the thus-slid plates into an Mo green compact.

    摘要翻译： 用半导体芯片安装的封装具有厚度小于0.4mm的Cu-Mo复合材料的散热基板，其通过将铜（Cu）熔体的30〜40质量％浸渍成为 钼。 散热基板是通过等静压成型制成Mo压坯，在Mo生坯上安装Cu加热，将铜浸渍到Mo生坯中得到Cu-Mo复合体，将Cu-Mo 复合成片状基材。 在等静压成型工艺中，至少两个或更多个板27,29,31,33,35和37与侧壁的内表面相邻设置，分为至少两部分，Mo粉末被填充到空间中 由这些板27,29,31,33,35和37形成，并用柔性覆盖物（例如橡胶介质39等）覆盖Mo粉末压块以制备复合材料，然后将所得复合材料压入 在其上施加有外部等静压力抵靠柔性盖，并且板沿着侧壁通过盖板滑动，从而将由此滑动的板之间的复合材料压缩成Mo压坯。

    Semiconductor package and method for producing heat-radiating substrate for it
    6.
    发明授权
    Semiconductor package and method for producing heat-radiating substrate for it 有权
    半导体封装及其制造用散热基板的方法

    公开(公告)号：US06693353B1

    公开(公告)日：2004-02-17

    申请号：US09252880

    申请日：1999-02-18

    申请人： Norio Hirayama ,  Mitsuo Osada ,  Akira Ichida ,  Yoshinari Amano ,  Kiyoshi Asai ,  Hidetoshi Maesato ,  Tadashi Arikawa ,  Kenji Sakimae

    发明人： Norio Hirayama ,  Mitsuo Osada ,  Akira Ichida ,  Yoshinari Amano ,  Kiyoshi Asai ,  Hidetoshi Maesato ,  Tadashi Arikawa ,  Kenji Sakimae

    IPC分类号： H01L2348

    CPC分类号： B22F3/045 ,  B22F3/02 ,  B22F2998/10 ,  H01L21/4871 ,  H01L21/4878 ,  H01L23/3733 ,  H01L2924/0002 ,  B22F3/26 ,  H01L2924/00

    摘要： A package to be mounted with semiconductor chips has a heat-radiating substrate having a thickness of smaller than 0.4 mm of a Cu—Mo composite as prepared by impregnating from 30 to 40% by mass of copper (Cu) melt into a green compact of molybdenum. The heat-radiating substrate is produced by preparing an Mo green compact through isostatic molding, mounting Cu on the Mo green compact, heating it to thereby impregnate copper into the Mo green compact to give a Cu—Mo composite, and rolling the Cu—Mo composite into a sheet substrate. In the isostatic molding process, at least two or more plates. 27, 29, 31, 33, 35 and 37 are disposed adjacent to the inner surface of a side wall as divided into at least two portions, Mo powder is filled into the space as formed by those plates 27, 29, 31, 33, 35 and 37 with covering the Mo powder compact with a flexible cover, such as a rubber medium 39 or the like, to prepare a composite, then the resulting composite is put into a pressure tank, an external isostatic pressure is applied thereto against the flexible cover, and the plates are slid via the cover along the side wall thereby compressing the composite between the thus-slid plates into an Mo green compact.

    摘要翻译： 用半导体芯片安装的封装具有厚度小于0.4mm的Cu-Mo复合材料的散热基板，其通过将铜（Cu）熔体的30〜40质量％浸渍成为 钼。 散热基板是通过等静压成型制成Mo压坯，在Mo生坯上安装Cu加热，将铜浸渍到Mo生坯中得到Cu-Mo复合体，将Cu-Mo 复合成片状基材。 在等静压成型工艺中，至少有两个以上的板。 27,29,31,33,35,37与侧壁的内表面相邻设置，分为至少两部分，Mo粉末被填充到由这些板27,29,31,33,33形成的空间中， 35和37，用橡胶介质39等柔性盖覆盖Mo粉末压块以制备复合材料，然后将所得的复合材料放入压力罐中，对其施加外部等静压 盖板，并且板沿着侧壁通过盖板滑动，从而将由此滑动的板材之间的复合材料压缩成Mo压坯。

    Glass-melting device for producing glass fiber and method for producing glass fiber
    9.
    发明授权
    Glass-melting device for producing glass fiber and method for producing glass fiber 有权
    玻璃纤维玻璃熔融装置及玻璃纤维的制造方法

    公开(公告)号：US08689586B2

    公开(公告)日：2014-04-08

    申请号：US13255463

    申请日：2010-03-08

    申请人： Norio Hirayama ,  Naohiro Miyanaga ,  Masahiko Takahashi ,  Kentarou Ogawa

    发明人： Norio Hirayama ,  Naohiro Miyanaga ,  Masahiko Takahashi ,  Kentarou Ogawa

    IPC分类号： C03B37/085

    CPC分类号： C03B5/2252 ,  C03B5/182 ,  C03B5/207 ,  C03B7/07 ,  C03B37/02 ,  C03B37/085 ,  Y02P40/57

    摘要： A glass-melting device for producing glass fibers capable effectively reducing inclusion of bubbles into glass fibers to be spun, and a method for producing glass fibers using the same are provided.A glass-melting device 100 for producing glass fibers comprises: a first glass-melting tank 12; a conduit 14 extending downward from the first glass-melting tank 12; a sucking device 18 for exposing the first glass-melting tank 12 to a reduced-pressure atmosphere; a second glass-melting tank 20 provided on a lower portion of the conduit 14 and exposed to an atmospheric-pressure atmosphere; and a bushing 22 provided at a bottom portion of the second glass-melting tank 20 and equipped with a number of nozzles 22a.

    摘要翻译： 提供一种用于生产能够有效地减少气泡混入待纺丝的玻璃纤维中的玻璃纤维的玻璃熔化装置，以及使用该玻璃纤维的玻璃纤维的制造方法。 用于制造玻璃纤维的玻璃熔化装置100包括：第一玻璃熔化槽12; 从第一玻璃熔化槽12向下延伸的导管14; 用于将第一玻璃熔化槽12暴露于减压气氛的吸入装置18; 第二玻璃熔池20设置在导管14的下部并暴露于大气压气氛中; 以及设置在第二玻璃熔化槽20的底部并配备有多个喷嘴22a的套管22。

    Method for Producing Fiber-Reinforced Thermally Meltable Epoxy Resin
    10.
    发明申请
    Method for Producing Fiber-Reinforced Thermally Meltable Epoxy Resin 审中-公开
    生产纤维增强热熔胶环氧树脂的方法

    公开(公告)号：US20090215929A1

    公开(公告)日：2009-08-27

    申请号：US11920497

    申请日：2006-05-12

    申请人： Hirofumi Nishida ,  Norio Hirayama

    发明人： Hirofumi Nishida ,  Norio Hirayama

    IPC分类号： C08L63/00

    CPC分类号： C08G59/62 ,  C08G59/245 ,  C08G59/621 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/02

    摘要： Disclosed herein are a method for producing a fiber-reinforced thermally meltable epoxy resin having excellent heat resistance using a thermally meltable epoxy resin having a high melting initiation temperature and a fiber-reinforced plastic molded by the method. The method for producing a fiber-reinforced thermally meltable epoxy resin comprises the steps of: (I) impregnating reinforcing fibers with a compound (A) having two epoxy groups in one molecule and a compound (B) having two phenolic hydroxyl groups in one molecule; and (II) linearly polymerizing the compounds (A) and (B) impregnated into the reinforcing fibers by polyaddition reaction, wherein at least a part of the compound (A) and/or at least a part of the compound (B) are/is a compound having a fluorene skeleton, and the compound (A) and the compound (B) are mixed in such a ratio that the number of moles of epoxy groups in the compound (A) is 0.9 to 1.1 times the number of moles of phenolic hydroxyl groups in the compound (B).

    摘要翻译： 本文公开了一种使用具有高熔融起始温度的热熔性环氧树脂和通过该方法成型的纤维增强塑料来制造具有优异耐热性的纤维增强的热熔性环氧树脂的方法。 纤维增强热熔性环氧树脂的制造方法包括以下步骤：（I）在一分子中用具有两个环氧基的化合物（A）和在一个分子中具有两个酚羟基的化合物（B））浸渍增强纤维 ; 和（II）通过加聚反应线性聚合浸渍到增强纤维中的化合物（A）和（B），其中化合物（A）和/或至少部分化合物（B）的至少一部分为/ 是具有芴骨架的化合物，化合物（A）和化合物（B）以使化合物（A）中的环氧基的摩尔数为0.9〜1.1倍摩尔数的比例混合 化合物（B）中的酚羟基。