摘要:
Between the two acoustic tracks of a SAW filter constructed on the surface of a piezoelectric substrate, a metallic shielding structure is positioned and connected to ground in order to shield two transducers positioned in different tracks. In this way crosstalk within a filter is prevented and the stop-band selection is improved.
摘要:
A surface acoustic wave (SAW) filter includes a piezoelectric substrate, and acoustic tracks on the piezoelectric substrate. The acoustic tracks are adjacent and electrically interconnected. The acoustic tracks include electro-acoustic transducers. The electro-acoustic transducers include an input transducer and an output transducer. The SAW filter also includes a shielding structure that is metallic and that is connected to ground. The shielding structure is between the acoustic tracks. The shielding structure shields a first electro-acoustic transducer in a first acoustic track from a second electro-acoustic transducer in a second acoustic track.
摘要:
The invention relates to a micro-acoustic filter having a first and a second converter, in which the electromagnetic and capacitive cross-talk between the first and second converters is compensated for by providing additional coupling capacitors and additional current loops. Additional coupling capacitors and current loops are arranged in such a manner that they can counteract the sign of the natural coupling specified by the design and thus completely compensate for said coupling.
摘要:
A stable electrical component includes a carrier substrate and a chip (2) mounted thereon. The component has a reactance element and a supporting element, which are at least partly arranged between the carrier substrate and the chip. The reactance element is at least partly realized by means of at least one conductor track. The reactance element includes a coil, a capacitor or a transmission line.
摘要:
A component includes a first filter configured to work with acoustic waves. The first filter includes a first sub-filter on a first chip and a second sub-filter on a second chip separate from the first chip. The first filter if a different type of filter, has a different layer structure, or has a different layer thicknesses for at least one layer in comparison to the second filter.
摘要:
A substrate with an HF-compatible line arranged in this substrate will be proposed that is formed similar to a tri-plate strip line in which, however, at least one of the ground planes has a slot that follows the profile of the signal line arranged between two ground planes. With the aid of this slot, the capacitive constant of the line can be lowered and thus the impedance of the line can be increased.
摘要:
A stable electrical component includes a carrier substrate and a chip (2) mounted thereon. The component has a reactance element and a supporting element, which are at least partly arranged between the carrier substrate and the chip. The reactance element is at least partly realized by means of at least one conductor track. The reactance element includes a coil, a capacitor or a transmission line.
摘要:
A surface acoustic wave (SAW) filter having an improved edge steepness includes at least three resonators connected in series and/or parallel with one another. An edge steepness of a pass band is improved if a plurality of resonators with different finger periodicities of interdigital transducers are provided.
摘要:
An electrical component includes a first signal path and a second signal path electrically connected to a common signal path. The electrical component also includes a first filter in the first signal path and a second filter in the second signal path. The electrical component also includes a first matching circuit comprising a shunt arm to ground. The first matching circuit is electrically connected to the first signal path, the second signal path, and the common signal path.
摘要:
An electrical component, e.g., a diplexer or a duplexer, can have one of a number of diverse arrangements for terminal surfaces on the substrate bottom. For example, the terminal surfaces for first and second filters are not disposed at the maximum distance from one another. First and second filters can be disposed as one or two discrete components on the substrate, wherein one filter can be implemented as being integrated in a multilayer substrate.