摘要:
An electrostatic discharge (ESD) includes a semiconductor substrate having the first conductive type, a well having the first conductive type, a buried layer having the second conductive type and a well having the second conductive type. The buried layer having a second conductive type is disposed in the semiconductor substrate under the well having the first conductive type. The well having the second conductive type disposed to divide the well having the first conductive type into a first well and a second well. The well having the second conductive type contacts the buried layer, and the well having the second conductive type and the buried layer are jointly used to isolate the first well from the second well.
摘要:
An electrostatic discharge (ESD) includes a semiconductor substrate having the first conductive type, a well having the first conductive type, a buried layer having the second conductive type and a well having the second conductive type. The buried layer having a second conductive type is disposed in the semiconductor substrate under the well having the first conductive type. The well having the second conductive type disposed to divide the well having the first conductive type into a first well and a second well. The well having the second conductive type contacts the buried layer, and the well having the second conductive type and the buried layer are jointly used to isolate the first well from the second well.
摘要:
A handset device including a ground plane, an antenna, a first conductive strip and a second conductive strip is provided. The antenna is electrically connected to the ground plane and forms a current loop with the ground plane. The ground plane forms a current area according to the current loop. The first conductive strip is electrically connected to the current area and changes a current distribution on the ground plane to increase a current density passing through the current area.
摘要:
A light emitting diode (LED) package includes a LED package substrate, first LED chips and second LED chips. The LED package substrate includes a substrate, a first bonding pad, second bonding pads and a third bonding pad. The first, second and third bonding pads are disposed on the substrate. The second bonding pads are arranged in an array. The first and third bonding pads are located adjacent respectively to first and last column of the array. The first LED chips are die-bonded on the first bonding pad and wire-bonded respectively to the second bonding pads arranged in first column of the array. The second LED chips are die-bonded on the second bonding pads respectively. In each row except last column, each second LED chip is wire-bonded to the second bonding pad arranged in next column. The second LED chips located in last column are wire-bonded to the third bonding pad.
摘要:
A light-emitting diode (LED) street lamp is applicable for street lighting. The LED street lamp includes a casing, an LED module, and a heat dissipation module. The LED module and the heat dissipation module are arranged inside the casing. The LED module includes a frame, a circuit board carrying a plurality of LEDs, and a light regulation mechanism. The frame and the circuit board are set opposing each other with the light regulation mechanism arranged therebetween to interfere with emission light from the LEDs. The emission light, after being interfered with, is projected outside the casing to realize lighting. The heat dissipation module is in physical engagement with the LED module to remove heat generated by the LEDs. As such, the LED street lamp is provided with a broader range of illumination angle and more uniform brightness, so that the same LED street lamp is applicable to various sites and the heat generated by the LEDs can be efficiently dissipated.
摘要:
An etching process of a metal layer of a display panel is provided. First, a substrate with at least one display panel region, a testing device region, and a non-device region is provided. Then, a metal layer is formed over the substrate to cover the display panel region, the testing device region, and the non-device region. Next, a mask is formed on the metal layer to expose a portion of the metal layer. The area of the metal layer exposed by the mask substantially occupies 70%˜88% of the total area of the metal layer. Thereafter, a wet etching process is performed to remove the metal layer exposed by the mask.
摘要:
The invention discloses a photovoltaic cell with a high photocurrent. The photovoltaic cell comprises a first electrode, a second electrode, a photoactive layer between the first and second electrodes, and a polar organic layer between the photoactive layer and at least one of the first and second electrodes.
摘要:
A method for making a series of nanoscale microstructures, including helical microstructures and cylindrical microstrustures. This method includes the steps of: (1) forming a chiral block copolymer containing a plurality of chiral first polymer blocks and a second polymer blocks wherein the chiral first polymer blocks have a volume fraction ranging from 20 to 49%; (2) causing a phase separation in the chiral block copolymer. In a preferred embodiment, the chiral block copolymer is poly(styrene)-poly(L-lactide) (PS-PLLA) chiral block copolymer, and the copolymerization process is a living copolymerization process which includes the following steps: (a) mixing styrene with BPO and 4-OH-TEMPO to form 4-hydroxy-TEMPO-terminated polystyrene; and (2) mixing the 4-hydroxy-TEMPO-terminated polystyrene with [η3-EDBP)Li2]2[(η3-nBu)Li(0.5Et2O)]2 and L-lactide in an organic solvent preferably CH2Cl2 to form the poly(styrene)-poly(L-lactide) chiral block copolymer. Transmission electron microscopy (TEM) and small X-ray scattering (SAXS) studies show that when the volume fraction of poly(L-lactide) is about 35–37%, nanoscale helices with a pitch of 43.8 nanometers and a diameter of 34.4 nanometers were observed.
摘要翻译:一种制备一系列纳米级微观结构的方法,包括螺旋微结构和圆柱形微结构。 该方法包括以下步骤:(1)形成含有多个手性第一聚合物嵌段的手性嵌段共聚物和第二聚合物嵌段,其中手性第一聚合物嵌段具有20至49%的体积分数; (2)引起手性嵌段共聚物中的相分离。 在优选的实施方案中,手性嵌段共聚物是聚(苯乙烯) - 聚(L-丙交酯)(PS-PLLA)手性嵌段共聚物,共聚方法是一种活性共聚方法,其包括以下步骤:(a) 用BPO和4-OH-TEMPO形成4-羟基-TEMPO封端的聚苯乙烯; 和(2)将4-羟基-TEMPO封端的聚苯乙烯与[η3 -EDBP] Li 2 N 2 [2] 优选的有机溶剂中的L 3→N 2→Bu)Li(0.5E 2 O 2)2 N 2和L-丙交酯 CH 2 2 Cl 2以形成聚(苯乙烯) - 聚(L-丙交酯)手性嵌段共聚物。 透射电子显微镜(TEM)和小X射线散射(SAXS)研究表明,当聚(L-丙交酯)的体积分数为约35-37%时,具有43.8纳米的间距和34.4纳米的直径的纳米级螺旋 被观察到。
摘要:
A method for processing natural language Chinese sentences can transform a Chinese sentence into a Triple representation using shallow parsing techniques. The method is concerned with parsing Chinese sentences by employing lexical and syntactical information to extract more prominent entities in a Chinese sentence, and the sentence is then transformed into a Triple representation by employing the Triple rules referring to elemental Chinese syntax—SVO (subject, verb, and object in order). The lexical and syntactical information in our method is referring a lexicon possessed of part-of-speech (POS) information and phrase-level syntax in Chinese respectively. The Triple representation consists of three elements which are agent, predicate, and patient in a sentence.
摘要:
A novel trivalent Group IVB metal complex for preparing syndiotactic vinyl aromatic polymers is disclosed which is coordinated by a bidentate ligand and is represented by the formula (I):(C.sub.5 R.sub.n H.sub.5-n)M(BD).sub.m Y.sub.p (I)wherein C.sub.5 R.sub.n H.sub.5-n is a substituted or unsubstituted cyclopentadienyl group, n is an integer between 0 and 5, and R is C.sub.1 to C.sub.12 alkyl, aryl, substituted alkyl, or substituted aryl; M is a trivalent Group IVB metal; (BID) is a bidentate ligand with -1 valence, having a coordinating group which is capable of forming a coordinating bond or a chelating bond with the metal M; Y is selected from the group consisting of alkyl, aryl, aralkyl, halogen and hydrogen; m is an integer of 1 or 2; and m+p=2.
摘要翻译:公开了一种用于制备间同立构乙烯基芳族聚合物的新型三价IVB族金属络合物,其由二齿配体配位并由式(I)表示:(C5RnH5-n)M(BD)mYp(I)其中C5RnH5-n为 取代或未取代的环戊二烯基,n为0至5的整数,R为C 1至C 12烷基,芳基,取代的烷基或取代的芳基; M是三价IVB族金属; (BID)是具有-1价的双齿配体,具有能够与金属M形成配位键或螯合键的配位基; Y选自烷基,芳基,芳烷基,卤素和氢; m为1或2的整数; m + p = 2。