公开(公告)号：US20080076209A1

公开(公告)日：2008-03-27

申请号：US11850531

申请日：2007-09-05

Applicant: Gerhard KLINK ,  Christof LANDESBERGER ,  Michael FEIL

Inventor： Gerhard KLINK ,  Christof LANDESBERGER ,  Michael FEIL

IPC: H01L21/56

CPC classification number: H01L23/4985 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/2402 ,  H01L2224/76155 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/005 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y10T29/49117 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: The present invention provides a method for producing integrated circuits which are mechanically flexible and can be provided contiguously on a common flexible carrier substrate. The method includes a step of continuously providing a first flexible substrate which has conductor-line patterns, and a step of mounting the integrated circuits on the first flexible substrate and connecting the integrated circuits to the conductor-line patterns of the first flexible substrate, and a step of covering the circuits mounted on the first flexible substrate with a second flexible substrate, recesses being provided in the first or second flexible substrates in order to make the conductor-line patterns of the first flexible substrate accessible. The step of covering has the sub-step of continuously providing a flexible film with recesses and laminating same onto the flexible integrated circuits mounted on the first flexible substrate, or a sub-step of applying, by a printing technique, a cover on the flexible integrated circuits mounted on the first flexible substrate.

Abstract translation: 本发明提供了一种制造集成电路的方法，所述集成电路机械地是柔性的并且可以连续地设置在共同的柔性载体基板上。 该方法包括连续提供具有导线图案的第一柔性基板的步骤，以及将集成电路安装在第一柔性基板上并将集成电路连接到第一柔性基板的导线图案的步骤，以及 利用第二柔性基板覆盖安装在第一柔性基板上的电路的步骤，在第一柔性基板或第二柔性基板中设置凹槽，以使第一柔性基板的导体线图形可访问。 覆盖步骤具有连续地提供具有凹陷的柔性膜并将其层压到安装在第一柔性基板上的柔性集成电路上的子步骤，或者通过印刷技术将柔性涂覆在柔性基板上的盖子的子步骤 集成电路安装在第一柔性基板上。

公开(公告)号：US20110047793A1

公开(公告)日：2011-03-03

申请号：US12943061

申请日：2010-11-10

Applicant: Gerhard KLINK ,  Christof LANDESBERGER ,  Michael FEIL

Inventor： Gerhard KLINK ,  Christof LANDESBERGER ,  Michael FEIL

IPC: H01R43/00

CPC classification number: H01L23/4985 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/2402 ,  H01L2224/76155 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/005 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y10T29/49117 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: The present invention provides a method for producing integrated circuits which are mechanically flexible and can be provided contiguously on a common flexible carrier substrate. The method includes a step of continuously providing a first flexible substrate which has conductor-line patterns, and a step of mounting the integrated circuits on the first flexible substrate and connecting the integrated circuits to the conductor-line patterns of the first flexible substrate, and a step of covering the circuits mounted on the first flexible substrate with a second flexible substrate, recesses being provided in the first or second flexible substrates in order to make the conductor-line patterns of the first flexible substrate accessible. The step of covering has the sub-step of continuously providing a flexible film with recesses and laminating same onto the flexible integrated circuits mounted on the first flexible substrate, or a sub-step of applying, by a printing technique, a cover on the flexible integrated circuits mounted on the first flexible substrate.

Abstract translation: 本发明提供了一种制造集成电路的方法，所述集成电路机械地是柔性的并且可以连续地设置在共同的柔性载体基板上。 该方法包括连续提供具有导线图案的第一柔性基板的步骤，以及将集成电路安装在第一柔性基板上并将集成电路连接到第一柔性基板的导线图案的步骤，以及 利用第二柔性基板覆盖安装在第一柔性基板上的电路的步骤，在第一柔性基板或第二柔性基板中设置凹槽，以使第一柔性基板的导体线图形可访问。 覆盖步骤具有连续地提供具有凹陷的柔性膜并将其层压到安装在第一柔性基板上的柔性集成电路上的子步骤，或者通过印刷技术将柔性涂覆在柔性基板上的盖子的子步骤 集成电路安装在第一柔性基板上。

公开(公告)号：US20080088006A1

公开(公告)日：2008-04-17

申请号：US11844513

申请日：2007-08-24

Applicant: Michael FEIL

Inventor： Michael FEIL

IPC: H01R43/00

CPC classification number: H01L23/49833 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/49855 ,  H01L24/02 ,  H01L24/29 ,  H01L24/31 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/02371 ,  H01L2224/04026 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H01L2224/90 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49117 ,  Y10T29/49222 ,  H01L2924/00014

Abstract: A device has a first terminal, second terminal and at least four lateral faces provided with contact areas, of which two respective ones each are mutually opposite. The contact areas of the mutually opposite lateral faces are connected to different ones of the first and second terminals.

Abstract translation: 一种装置具有第一端子，第二端子和至少四个设置有接触区域的侧面，其中两个相应的接触区域彼此相对。 相互相对的侧面的接触区域连接到第一和第二端子中的不同侧面。