摘要:
An apparatus for testing a memory of an integrated circuit for a defect. The apparatus includes a test unit for testing a redundant memory element only when the redundant memory element has been enabled to replace a failed memory element.
摘要:
Methods and apparatuses for enabling a redundant memory element (20) during testing of a memory array (14). The memory array (14) includes general memory elements (18) and redundant memory elements (20). The general memory elements (18) are tested and any defective general memory elements (18) are replaced with redundant memory elements (20). The redundant memory elements (20) are tested only when they are enabled.
摘要:
A memory array for an integrated circuit includes a plurality of memory elements includes at least one redundant memory element for exchanging with a failed memory element in the plurality of memory elements. A failing address repair register is provided, having a register for controlling enablement of a corresponding redundant memory element and compare logic for determining whether an address of a failing memory element is stored in the register.
摘要:
A method for verifying the accuracy of memory testing software is disclosed. A built-in self test (BIST) fail control function is utilized to generate multiple simulated memory fails at various predetermined locations within a memory array of a memory device. The memory array is then tested by a memory tester. Afterwards, a bit fail map is generated by the logical-to-physical mapping software based on all the memory fails indicated by the memory tester. The bit fail map provides all the fail memory locations derived by the logical-to-physical mapping software. The fail memory locations derived by the logical-to-physical mapping software are then compared to the predetermined memory locations to verify the accuracy of the logical-to-physical mapping software.
摘要:
A design structure embodied in a machine readable medium for designing, manufacturing, testing and/or enabling a redundant memory element (20) during testing of a memory array (14), and a method of repairing a memory array.
摘要:
A method of manufacturing a device having embedded memory including a plurality of memory cells. During manufacturing test, a first test stress is applied to selected cells of the plurality of memory cells with a built-in self test. At least one weak memory cell is identified. The at least one weak memory cell is repaired. A second test stress is applied to the selected cells and the repaired cells with the built-in self test.
摘要:
A structure comprising a memory chip and a tester for testing the memory chip, and a method for operating the structure. The memory chip comprises a BIST (Built-in Self Test) circuit, a plurality of RAMs (Random Access Memories). A first RAM is selected for testing by scanning in a select value into a RAM select register in the BIST. While the BIST performs a first testing pass for the first RAM, the tester collects cycle numbers of the failing cycles. Then, the BIST performs a second testing pass for the first RAM. At each failing cycle identified during the first testing pass, the BIST pauses so that the content of the location of the first RAM associated with the failing cycle and the state of the BIST can be extracted out of the memory chip. The testing procedures for the other RAMs are similar to that of the first RAM.
摘要:
Self-test architectures are provided to implement data column and row redundancy with a totally integrated self-test and repair capability in a Random Access Memory (RAM), either a Dynamic RAM (DRAM) or a Static Ram (SRAM), and are particularly applicable to compileable memories and to embedded RAM within microprocessor or logic chips. The invention uses two passes of self-test of a memory. The first pass of self-test determines the worst failing column, the column with the largest number of unique failing row addresses. After completion of the first pass of self-test, the spare column is allocated to replace the worst failing column. In the second pass of self-test, the BIST (Built In Self-Test) collects unique failing row addresses as it does today for memories with spare rows only. At the completion of the second pass of self-test, the spare rows are then allocated. Once the second pass of self-test is completed, the column and unique failing row addresses are transported to the e-fuse macros and permanently stored in the chip.
摘要:
A design structure embodied in a machine readable medium for designing, manufacturing, testing and/or enabling a redundant memory element (20) during testing of a memory array (14), and a method of repairing a memory array.