摘要:
An installation structure of countertop faucet includes a base having an insertion section extending through a mounting hole formed in a counter to engage a locking nut to be secured. The insertion section has a top end forming a receiving bore of which a circumferential wall forming two positioning holes communicating with the receiving bore. Each positioning hole receives therein a releasing module. The bottom of the base forms two water inlet passages communicating with the receiving bore and receiving stop valves therein and coupled to couplers for connection with water inlet tubes. A faucet has a joint section received in the receiving bore and having water guide tubes fit into the water inlet passages. The joint section forms two receiving apertures receiving therein positioning modules respectively engageable with the positioning holes to fix the faucet and being released by the releasing module to detach the faucet from the base.
摘要:
An LED structure includes a first substrate; an adhering layer formed on the first substrate; first ohmic contact layers formed on the adhering layer; epi-layers formed on the first ohmic contact layers; a first isolation layer covering the first ohmic contact layers and the epi-layers at exposed surfaces thereof; and first electrically conducting plates and second electrically conducting plates, both formed in the first isolation layer and electrically connected to the first ohmic contact layers and the epi-layers, respectively. The trenches allow the LED structure to facilitate complex serial/parallel connection so as to achieve easy and various applications of the LED structure in the form of single structures under a high-voltage environment.
摘要:
An LED structure includes a first substrate; an adhering layer formed on the first substrate; first ohmic contact layers formed on the adhering layer; epi-layers formed on the first ohmic contact layers; a first isolation layer covering the first ohmic contact layers and the epi-layers at exposed surfaces thereof; and first electrically conducting plates and second electrically conducting plates, both formed in the first isolation layer and electrically connected to the first ohmic contact layers and the epi-layers, respectively. The first trenches or the second trenches allow the LED structure to facilitate complex serial/parallel connection so as to achieve easy and various applications of the LED structure in the form of single structures under a high-voltage environment.
摘要:
An optical polarization beam combiner includes a polarization beam displacer or a birefringent crystal that is provided with a deflecting edge having two slant deflecting faces. The deflecting edge economically replaces for the wedged crystals of the prior art to modify the transmission directions of the incidental and/or emerging light beams.
摘要:
A low-light-emitting-angle high-luminance ultraviolet (UV) light-emitting diode (LED) nail lamp structure and an LED light source module thereof are provided. The UV LED nail lamp structure includes a housing and an LED light source module. The LED light source module is provided in the housing and has a plurality of UV LEDs, wherein the light-emitting angle of each UV LED ranges between 25° and 80°. The UV LED nail lamp structure features high luminance and enhanced lighting effect.
摘要:
A manufacturing method and a structure of a light-emitting diode (LED) chip are disclosed. The method includes the steps of: providing a conductive block; providing an epitaxial block; bonding; removing an epitaxial substrate; making independent LEDs; forming a dielectric layer; and making electrical connection. A first LED, a second LED, and a third LED are formed on the conductive block, wherein the first and second LEDs are electrically connected in series, and the second and third LEDs are electrically connected in parallel. Thus, a basic unit with a flexible design of series- and parallel-connected LEDs can be formed to increase the variety and application of LED chip-based designs.
摘要:
A manufacturing method for an axially symmetric light-emitting diode assembly disclosed herein includes steps of: providing a substrate; and forming a plurality of light-emitting areas on the substrate. The substrate has a central axis. The light-emitting areas are arranged with axial symmetry around the central axis while being insulated from each other. Each of the light-emitting areas has at least one light-emitting diode, and the light-emitting diodes are electrically connected to each other. Since the light-emitting areas are formed on the substrate with the axially symmetric arrangement, the axially symmetric light-emitting diode assembly can present a well symmetric light pattern.
摘要:
A halation-free light-emitting diode holder includes a body and a retaining portion. The body has a die holder, which includes a first surface, a second surface, and an opened end. The retaining portion is provided on the second surface. By using the retaining portion, the optical gel in the die holder is blocked from capillary movement up along the second surface. Furthermore, having nano-material layers further formed on the second surface or having the area of the first surface made greater than the area of the opened-end also prevents the optical gel from climbing along the second surface. Thereby, a light halation circling a light pattern of the resultant light-emitting diode is avoided and the light-emitting diode is improved in luminance uniformity.
摘要:
A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer interposed therebetween. The two silicon based materials of silicon-on-insulator substrate are etched to form a reflective cavity and an insulation trench, respectively, for dividing the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes. A plurality of metal lines are then formed to electrically connect the two silicon based materials such that the LED chip can be mounted on the reflective cavity and electrically connected to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines. Thus the properties of heat resistance and heat dispersal can be improved and the process can be simplified.
摘要:
A MEMS differential actuated nano probe includes four suspension beams arranged in parallel, a connecting base connecting to the suspension beams, a nano probe. Two of the suspension beams elongate due to thermal expansion to allow the deflection of the probe. By heating the suspension beams at different positions, the MEMS differential actuated nano probe can move in two directions with two degrees of freedom. The deflection of the MEMS differential actuated nano probe can be also achieved in piezoelectric or electrostatic way.