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公开(公告)号：US09837732B2
公开(公告)日：2017-12-05
申请号：US14237456
申请日：2012-08-01
申请人： Mitja Rateiczak , Bernhard Reul
发明人： Mitja Rateiczak , Bernhard Reul
CPC分类号： H01R4/58 , B32B17/10174 , B32B17/1022 , C23C4/06 , C23C24/04 , H01R4/04 , H05B3/84 , H05B2203/016 , Y10T428/12493
摘要： An electrical contact composite is described. The electrical contact composite has a substrate and an electrically conductive coating applied to the substrate, which coating is connected to an electrode. A metal contact element is connected to the electrode, which contact element is used to connect the conductive coating to a current/voltage source. Furthermore, at least one sprayed layer produced by means of a thermal spraying method, in particular gas dynamic cold spray, and is provided with at least one metal and/or metal alloy, the sprayed layer being arranged between the conductive coating and the contact element. The sprayed layer has a coefficient of thermal expansion that is between the coefficients of thermal expansion of the carrier and of the contact element. The sprayed layer can also be used as the electrode for the conductive coating.
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公开(公告)号：US09155206B2
公开(公告)日：2015-10-06
申请号：US12744054
申请日：2008-12-05
申请人： Mitja Rateiczak , Bernhard Reul , Cornelia Retsch
发明人： Mitja Rateiczak , Bernhard Reul , Cornelia Retsch
IPC分类号： H05K1/11 , H01R12/00 , H05K1/00 , H01R11/11 , H01R9/24 , H01R13/02 , H05K3/32 , H05B3/84 , H01R4/02 , H05K1/03 , H05K3/34
CPC分类号： H05K3/32 , H01R4/02 , H05B3/84 , H05B2203/016 , H05K1/0306 , H05K3/3421 , H05K2201/0979 , H05K2201/1031 , H05K2201/10962 , Y02P70/611
摘要： In a solder connection element (1), which is intended in particular for soldering onto a brittle substrate such as a window pane, for connecting an electrical component, which solder connection element has a body (2) provided for connecting purposes and at least two solder feet (3) protruding therefrom, a respective elastically deformable connecting part which is suitable for accommodating differences in thermal expansion extending between the body and the solder feet, more than two solder feet (3) are provided according to the invention for soldering onto a surface, wherein differences in thermal expansion and effects of mechanical forces from the component to be connected can be accommodated in at least two coordinate directions parallel to the substrate surface by way of resilience of the solder feet (3) and/or the connecting parts relative to the body (2) and/or the solder connection element (1). The body (2) itself can also be configured so as to be resilient by way of incisions (6) and/or equipped with a plug-in lug (5).
摘要翻译： 在焊接连接元件（1）中，其特别地用于焊接到诸如窗玻璃的脆性基板上，用于连接电气部件，该焊料连接元件具有用于连接目的的主体（2）和至少两个 从其突出的焊脚（3），相应的可弹性变形的连接部分，其适于适应在主体和焊脚之间延伸的热膨胀差异，根据本发明提供了多于两个焊脚（3），用于焊接到 表面，其中热膨胀的差异和来自待连接部件的机械力的影响可以通过焊脚（3）和/或连接部件相对的弹性而平行于基板表面的至少两个坐标方向被适应 （2）和/或焊料连接元件（1）。 本体（2）本身也可以被配置为通过切口（6）和/或配备有插入式凸耳（5）而具有弹性。
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3.发明申请ELECTRICAL CONTACT COMPOSITES AND METHOD FOR PRODUCING ELECTRICAL CONTACT COMPOSITES 有权电接触复合材料和生产电接触复合材料的方法公开(公告)号：US20140227551A1
公开(公告)日：2014-08-14
申请号：US14237456
申请日：2012-08-01
申请人： Mitja Rateiczak , Bernhard Reul
发明人： Mitja Rateiczak , Bernhard Reul
CPC分类号： H01R4/58 , B32B17/10174 , B32B17/1022 , C23C4/06 , C23C24/04 , H01R4/04 , H05B3/84 , H05B2203/016 , Y10T428/12493
摘要： An electrical contact composite is described. The electrical contact composite has a substrate and an electrically conductive coating applied to the substrate, which coating is connected to an electrode. A metal contact element is connected to the electrode, which contact element is used to connect the conductive coating to a current/voltage source. Furthermore, at least one sprayed layer produced by means of a thermal spraying method, in particular gas dynamic cold spray, and is provided with at least one metal and/or metal alloy, the sprayed layer being arranged between the conductive coating and the contact element. The sprayed layer has a coefficient of thermal expansion that is between the coefficients of thermal expansion of the carrier and of the contact element. The sprayed layer can also be used as the electrode for the conductive coating.
摘要翻译： 描述了一种电接触复合材料。 电接触复合材料具有衬底和施加到衬底的导电涂层，该涂层连接到电极。 金属接触元件连接到电极，该接触元件用于将导电涂层连接到电流/电压源。 此外，通过热喷涂方法，特别是气体动态冷喷涂制备的至少一个喷涂层，并且设置有至少一种金属和/或金属合金，所述喷涂层布置在导电涂层和接触元件之间 。 喷涂层的热膨胀系数在载体和接触元件的热膨胀系数之间。 喷涂层也可以用作导电涂层的电极。
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公开(公告)号：US20140158424A1
公开(公告)日：2014-06-12
申请号：US14125904
申请日：2012-05-29
IPC分类号： H01R4/02
CPC分类号： H01R4/02 , B23K1/0008 , B23K1/19 , B23K35/0244 , B23K35/26 , B23K35/36 , B23K35/362 , B23K35/40 , B23K2101/006 , C22C12/00 , C22C13/00 , C22C38/18 , H01R43/0256 , H05B3/84 , H05B2203/016
摘要： A method of producing a pane having at least one electrical connection element is described. The method includes: applying soldering compound to at least one contact face of the connection element, arranging the connection element over the soldering compound on a region of an electrically conductive structure on a substrate, and connecting the connection element to the electrically conductive structure by means of the soldering compound with introduction of heat.
摘要翻译： 描述了生产具有至少一个电连接元件的窗格的方法。 该方法包括：将焊接化合物施加到连接元件的至少一个接触面上，将连接元件布置在焊接化合物上的导电结构的区域上，并将连接元件连接到导电结构上 的焊接化合物引入热量。
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公开(公告)号：US10355378B2
公开(公告)日：2019-07-16
申请号：US14115844
申请日：2012-04-17
摘要： A pane having at least one electrical connection element is described. The pane has a substrate, an electrically conductive structure on a region of the substrate, a layer of a solder material on a region of the electrically conductive structure, and at least two soldering points of a connection element on the solder material. The at least two soldering points define at least one contact surface between the connection element and the electrically conductive structure, and a shape of the at least one contact surface has at least one segment of an oval, an ellipse, or a circle with a central angle α of at least 90°.
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公开(公告)号：US09370048B2
公开(公告)日：2016-06-14
申请号：US13501452
申请日：2010-12-03
CPC分类号： H05B3/84 , H05B2203/016 , Y10T29/49117
摘要： The invention relates to a pane, wherein an electrically conductive structure is applied to a glass pane. At least one intermediate layer is applied to the electrically conductive structure, at least one electrical connecting element is attached to the intermediate layer, and the intermediate layer, electrical connecting element and electrically conductive structure form at least one hollow space comprising an electrically conductive mass. A method for the production and use thereof is also described.
摘要翻译： 本发明涉及一种窗格，其中将导电结构施加到玻璃板上。 至少一个中间层施加到导电结构，至少一个电连接元件附接到中间层，并且中间层，电连接元件和导电结构形成至少一个包含导电块的中空空间。 还描述了其生产和使用的方法。
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公开(公告)号：US08816215B2
公开(公告)日：2014-08-26
申请号：US13580741
申请日：2011-02-15
IPC分类号： H05K1/03 , H05K1/09 , B32B15/01 , H05B3/84 , B23K35/26 , C22C12/00 , C22C13/00 , C22C38/10 , C22C38/08 , H01R13/03 , H01R4/02
CPC分类号： H05B3/84 , B23K35/262 , B23K35/264 , B32B15/018 , C22C12/00 , C22C13/00 , C22C38/08 , C22C38/10 , H01R4/028 , H01R13/03 , H01R2201/02 , H01R2201/26 , H05B2203/016
摘要： The present invention relates to a disk with an electrical connection element, having a substrate with a first coefficient of thermal expansion, an electrically conductive structure on a region of the substrate, and a connection element with a second coefficient of thermal expansion.
摘要翻译： 本发明涉及具有电连接元件的盘，具有第一热膨胀系数的衬底，在衬底的区域上的导电结构以及具有第二热膨胀系数的连接元件。
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公开(公告)号：US08485840B2
公开(公告)日：2013-07-16
申请号：US13595383
申请日：2012-08-27
申请人： Stefan Ziegler , Mitja Rateiczak , Bernhard Reul
发明人： Stefan Ziegler , Mitja Rateiczak , Bernhard Reul
IPC分类号： H01R4/38
CPC分类号： H05B3/84 , H05B2203/016 , Y10T29/49117 , Y10T29/49208
摘要： An electrical connecting element is described, designed to be welded or soldered onto an electrically conductive component of a window pane. A body of the electrically connecting element has an electrically conductive foil with a thickness between 1 and 500 μm and intermediate means that serve as shock-absorbing means between a stiff section of the body and the window pane.
摘要翻译： 描述了一种电连接元件，被设计为焊接或焊接在窗玻璃的导电部件上。 电连接元件的主体具有厚度在1至500μm之间的导电箔，并且在身体的刚性部分和窗玻璃之间用作减震装置的中间装置。
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公开(公告)号：US20120298416A1
公开(公告)日：2012-11-29
申请号：US13575566
申请日：2011-02-15
CPC分类号： H05B3/84 , B23K35/262 , B23K35/264 , B32B15/018 , C22C12/00 , C22C13/00 , C22C38/08 , C22C38/10 , H01R4/028 , H01R13/03 , H01R2201/02 , H01R2201/26 , H05B2203/016
摘要： A pane with an electrical connection element is described, including a substrate made of glass with a first coefficient of thermal expansion, an electrically conductive structure with a layer thickness of 5 μm to 40 μm on a region of the substrate, a connection element with a second coefficient of thermal expansion, and a layer of a solder material that connects the connection element electrically to subregions of the electrically conductive structure.
摘要翻译： 描述了具有电连接元件的窗格，包括由第一热膨胀系数的玻璃制成的基板，在基板的区域上具有5μm至40μm的层厚度的导电结构，具有 第二热膨胀系数，以及将连接元件电连接到导电结构的子区域的焊料材料层。
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公开(公告)号：US09425517B2
公开(公告)日：2016-08-23
申请号：US14125904
申请日：2012-05-29
IPC分类号： H01R4/02 , B23K1/00 , B23K35/26 , B23K35/40 , H05B3/84 , B23K35/36 , B23K35/362 , B23K35/02 , H01R43/02 , B23K1/19 , C22C12/00 , C22C13/00 , C22C38/18
CPC分类号： H01R4/02 , B23K1/0008 , B23K1/19 , B23K35/0244 , B23K35/26 , B23K35/36 , B23K35/362 , B23K35/40 , B23K2101/006 , C22C12/00 , C22C13/00 , C22C38/18 , H01R43/0256 , H05B3/84 , H05B2203/016
摘要： A method of producing a pane having at least one electrical connection element is described. The method includes: applying soldering compound to at least one contact face of the connection element, arranging the connection element over the soldering compound on a region of an electrically conductive structure on a substrate, and connecting the connection element to the electrically conductive structure by means of the soldering compound with introduction of heat.
摘要翻译： 描述了生产具有至少一个电连接元件的窗格的方法。 该方法包括：将焊接化合物施加到连接元件的至少一个接触面上，将连接元件布置在焊接化合物上的导电结构的区域上，并将连接元件连接到导电结构上 的焊接化合物引入热量。
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