GAS LASER DEVICE
    4.
    发明申请

    公开(公告)号:US20220094129A1

    公开(公告)日:2022-03-24

    申请号:US17439815

    申请日:2019-05-17

    IPC分类号: H01S3/034 H01S3/13

    摘要: A gas laser device includes a shielding plate that is a first shielding member, and a shielding plate that is a second shielding member. The first shielding member includes a first opening, and a second opening. A laser beam that is to be propagated to discharge regions passes through the first opening. The laser beam that has taken a round trip through the discharge regions after passing through the first opening passes through the second opening. The second shielding plate faces the first shielding member the discharge regions located therebetween. The shielding plate includes an opening that is a third opening. The laser beam that has been propagated through the first opening and the discharge regions, and the laser beam that is to be propagated to the second opening through the discharge regions pass through the third opening. A plane shape of the third opening includes a rectilinear segment.

    LASER DEVICE
    8.
    发明申请

    公开(公告)号:US20210391683A1

    公开(公告)日:2021-12-16

    申请号:US17281579

    申请日:2018-10-10

    IPC分类号: H01S3/123 H01S3/11

    摘要: A laser device includes: a first mirror and a second mirror that cause resonance of a plurality of beams having different wavelengths from one another; a diffraction grating that causes the beams that are incident from the first mirror with directions of beam central axes being different from one another to travel to the second mirror while aligning the beam central axes with one another, and causes the beams that are incident from the second mirror with the beam central axes being aligned with one another to travel to the first mirror while causing the directions of the beam central axes to be different from one another; and a housing unit housing a laser medium that is a medium through which the beams traveling between the first mirror and the diffraction grating pass, and has a discrete gain spectrum in which a peak occurs at each wavelength of the beams.

    LASER MACHINING APPARATUS AND LASER MACHINING METHOD

    公开(公告)号:US20190193197A1

    公开(公告)日:2019-06-27

    申请号:US16323916

    申请日:2017-09-05

    IPC分类号: B23K26/064 B23K26/082

    摘要: A laser machining apparatus includes: a laser oscillator to emit a laser beam; a focusing lens to irradiate a workpiece with the laser beam; a focus position control mechanism disposed between the laser oscillator and the focusing lens and disposed on the optical path of the laser beam and that controls the divergence angle of the laser beam and the incident diameter of the laser beam incident on the focusing lens; a laser beam deflector to deflect the laser beam before the laser beam is incident on the focusing lens; and an emitting angle control mechanism to control the emitting angle of the laser beam that exits from the focusing lens after being deflected by the laser beam deflector.