公开(公告)号：US20120315450A1

公开(公告)日：2012-12-13

申请号：US13533521

申请日：2012-06-26

申请人： Takatoshi Yamamoto ,  Mitsuru Sato ,  Shintaro Asuke ,  Yoshiaki Mori ,  Kazuhiro Gomi

发明人： Takatoshi Yamamoto ,  Mitsuru Sato ,  Shintaro Asuke ,  Yoshiaki Mori ,  Kazuhiro Gomi

IPC分类号： B32B37/12 ,  B32B3/10 ,  B32B37/06

CPC分类号： C09J5/00 ,  C09J2205/31 ,  Y10T428/24851 ,  Y10T428/31663

摘要： A bonding method of bonding two base members together through a bonding film is provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through the bonding film. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members to form a liquid coating on the surface; drying the liquid coating so that it is transformed into the bonding film on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.

摘要翻译： 提供了通过接合膜将两个基底部件接合在一起的接合方法。 接合方法是通过接合膜将第一基底构件和第二基底构件接合在一起的接合体的形成方法。 接合方法包括：将含有由硅氧烷化合物构成的硅酮材料的液体材料涂覆在第一和第二基底构件中的至少一个的表面上，以在表面上形成液体涂层; 干燥所述液体涂层，使其在所述第一和第二基底构件中的至少一个的表面上转变成粘结膜; 并且向接合膜施加能量，使得在其表面附近形成接合特性，从而通过接合膜将第一和第二基底部件结合在一起。

公开(公告)号：US08211259B2

公开(公告)日：2012-07-03

申请号：US12323562

申请日：2008-11-26

申请人： Mitsuru Sato ,  Takatoshi Yamamoto ,  Shintaro Asuke ,  Yoshiaki Mori ,  Kazuhiro Gomi

发明人： Mitsuru Sato ,  Takatoshi Yamamoto ,  Shintaro Asuke ,  Yoshiaki Mori ,  Kazuhiro Gomi

IPC分类号： B29C65/00

CPC分类号： B32B43/006 ,  B08B7/0057 ,  B09B5/00 ,  B32B37/06 ,  B32B2309/02 ,  B32B2309/105 ,  B32B2310/0831 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1911 ,  Y10T156/1917

摘要： A separating method of a bonded body, the bonded body including two base members and a bonding film through which the base members are boded together, enabling to easily and efficiently separating the bonded body into the two original base members is provided. Further, the bonding film contains a silicone material composed of silicone compounds. The separating method includes: preparing the bonded body with the bonding film; and applying energy for separation to the bonding film so that cleavage is generated within the bonding film due to breakage of a part of molecular bonds of the silicone compounds, to thereby separate the bonded body into the first and second base members.

摘要翻译： 提供了一种接合体的分离方法，所述粘合体包括两个基底构件和接合膜，通过该接合膜将基底构件接合在一起，使得能够容易且有效地将接合体分离成两个原始基底构件。 此外，接合膜含有由硅氧烷化合物构成的硅酮材料。 分离方法包括：用接合膜制备粘合体; 并将能量分离到接合薄膜上，使得由于硅酮化合物的分子键的一部分断裂而在接合薄膜内产生裂纹，从而将粘合体分离成第一和第二基底部件。

公开(公告)号：US08617340B2

公开(公告)日：2013-12-31

申请号：US12323946

申请日：2008-11-26

申请人： Takatoshi Yamamoto ,  Mitsuru Sato ,  Shintaro Asuke ,  Yoshiaki Mori ,  Kazuhiro Gomi

发明人： Takatoshi Yamamoto ,  Mitsuru Sato ,  Shintaro Asuke ,  Yoshiaki Mori ,  Kazuhiro Gomi

IPC分类号： B32B38/00

CPC分类号： C09J5/00 ,  C09J2205/31 ,  Y10T428/24851 ,  Y10T428/31663

摘要： A bonding method of bonding two base members together through a bonding film having a fine pattern at low cost, and a bonded body with the bonding film which is formed using the bonding method are provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through a bonding film having a predetermined pattern. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members using a liquid droplet ejecting method, to form a liquid coating having a pattern corresponding to the predetermined pattern on the surface; drying the liquid coating so that it is transformed into the bonding film having the predetermined pattern on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.

摘要翻译： 提供了一种通过低成本的具有精细图案的接合膜将两个基底部件接合在一起的接合方法，以及使用该接合方法形成的接合膜的接合体。 接合方法是用于形成通过具有预定图案的接合膜将第一基底部件和第二基材部件接合在一起的接合体的方法。 接合方法包括：使用液滴喷射方法将含有硅酮化合物的硅酮材料的液体材料涂覆在至少一个第一和第二基底构件的表面上，以形成具有对应于预定的 表面图案; 干燥所述液体涂层，使其在所述第一和第二基底构件中的至少一个的表面上转变为具有预定图案的接合膜; 并且向接合膜施加能量，使得在其表面附近形成接合特性，从而通过接合膜将第一和第二基底部件结合在一起。

公开(公告)号：US20100201735A1

公开(公告)日：2010-08-12

申请号：US12665284

申请日：2008-06-16

申请人： Mitsuru Sato ,  Yoshiaki Mori

发明人： Mitsuru Sato ,  Yoshiaki Mori

IPC分类号： B41J2/015 ,  H01L21/30

CPC分类号： B41J2/1634 ,  B41J2/161 ,  B41J2/1623 ,  B81C3/001 ,  B81C2203/036 ,  H01L21/187 ,  H01L21/2007 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A bonding method of silicon base members is provided. The bonding method of silicon base members comprises: applying an energy to a surface of a first silicon base member having Si—H bonds on the surface to selectively cut the Si—H bonds so that dangling bonds of the silicon (Si) is exposed on the surface of the first silicon base member; and bonding the surface of the first silicon base member, on which the dangling bonds of the silicon has been exposed, and a surface of a second silicon base member on which dangling bonds of silicon are exposed so that the surface of the first silicon base member and the surface of the second silicon base member are bonded together through their dangling bonds.

摘要翻译： 提供硅基部件的接合方法。 硅基部件的接合方法包括：向表面上具有Si-H键的第一硅基部件的表面施加能量以选择性地切割Si-H键，使得硅（Si）的悬挂键暴露在 第一硅基部件的表面; 并且将暴露了硅的悬挂键的第一硅基部件的表面与硅的悬垂键露出的第二硅基部件的表面接合，使得第一硅基部件的表面 并且第二硅基材的表面通过它们的悬挂键结合在一起。

公开(公告)号：US20100183885A1

公开(公告)日：2010-07-22

申请号：US12665028

申请日：2008-06-16

申请人： Mitsuru Sato ,  Yoshiaki Mori

发明人： Mitsuru Sato ,  Yoshiaki Mori

IPC分类号： B32B37/02 ,  B32B38/00 ,  B05B1/00 ,  B32B9/04

CPC分类号： C09J5/02 ,  B23K26/0624 ,  B23K26/244 ,  B23K26/26 ,  B23K2101/42 ,  B23K2103/56 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1634 ,  B81B2201/052 ,  B81C3/001 ,  B81C2203/036 ,  C09J2400/146 ,  H01L21/187 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T156/10 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A bonding method of silicon base members is provided. The bonding method of silicon base members comprises: applying an energy to a first silicon base member including Si—H bonds to selectively cut the Si—H bonds so that the first silicon base member is cleaved and divided to one silicon base member and the other silicon base member, and the one silicon base member having a cleavage surface and dangling bonds of silicon obtained by cutting the Si—H bonds; and bonding the cleavage surface of the one silicon base member and a surface of a second silicon base member on which dangling bonds of silicon are exposed to thereby bond the cleavage surface and the surface together through their dangling bonds.

摘要翻译： 提供硅基部件的接合方法。 硅基部件的接合方法包括：向包括Si-H键的第一硅基部件施加能量以选择性地切割Si-H键，使得第一硅基部件被切割并分成一个硅基部件，而另一个硅基部件 硅基部件和具有通过切割Si-H键获得的硅的断裂面和悬挂键的一个硅基部件; 并且将一个硅基部件的解理面和硅的悬挂键露出的第二硅基部件的表面接合，从而通过其悬挂键将解理面和表面结合在一起。

公开(公告)号：US07148148B2

公开(公告)日：2006-12-12

申请号：US10309198

申请日：2002-12-04

申请人： Yoshiaki Mori ,  Takuya Miyakawa ,  Mitsuru Sato ,  Shintaro Asuke ,  Kenichi Takagi

发明人： Yoshiaki Mori ,  Takuya Miyakawa ,  Mitsuru Sato ,  Shintaro Asuke ,  Kenichi Takagi

IPC分类号： H01L21/302

CPC分类号： H01L21/76838 ,  C25D5/022 ,  C25D7/12 ,  H01L21/0272 ,  H01L21/0274 ,  H01L21/288 ,  H01L21/31127 ,  H01L21/31133

摘要： A mask forming method that can reduce manufacturing cost is disclosed. The method forms a mask on the surface of a member to be processed in order to form a desired pattern using liquid material for patterning. The method also includes applying resist to the entire surface of the member to be processed, drying the applied resist, patterning by removing the resist in a pattern-formation area using photolithography, and heating the resist.

摘要翻译： 公开了一种降低制造成本的掩模形成方法。 该方法在待加工构件的表面上形成掩模，以便使用液体材料形成图案化所需的图案。 该方法还包括将抗蚀剂施加到待加工构件的整个表面，干燥所施加的抗蚀剂，通过使用光刻法去除图案形成区域中的抗蚀剂，并加热抗蚀剂来进行图案化。

公开(公告)号：US07098121B2

公开(公告)日：2006-08-29

申请号：US10367854

申请日：2003-02-19

申请人： Yoshiaki Mori ,  Takuya Miyakawa ,  Mitsuru Sato ,  Shintaro Asuke ,  Kenichi Takagi

发明人： Yoshiaki Mori ,  Takuya Miyakawa ,  Mitsuru Sato ,  Shintaro Asuke ,  Kenichi Takagi

IPC分类号： H01L21/22

CPC分类号： H01L21/3127 ,  H01L21/0212 ,  H01L21/02274 ,  H01L21/0272 ,  H01L21/0273 ,  H01L21/288 ,  H01L21/76838 ,  H01L27/1292

摘要： An object is to provide a mask formation method, which can curtail a manufacturing cost.A method of forming a film of predetermined pattern on the front surface of a member to-be-processed is so constructed as to carry out the step (S178) of improving the adherence of a pattern material solution to the member to-be-processed, the step (S180) of filling up a pattern forming recess provided in a mask on the surface of the member to-be-processed with a pattern material solution, the step (S186) of improving the film quality of the pattern film to-be-formed by processing the pattern material solution, the step (S188) of removing the pattern material solution having adhered on the mask, the step (S190) of drying the pattern material solution, and the step (S196) of subjecting the pattern film to annealing processing.

摘要翻译： 目的在于提供掩模形成方法，可以减少制造成本。 在待处理构件的正面上形成预定图案的膜的方法被构造成执行改善图案材料溶液与要被加工的构件的粘附的步骤（S 178） 在图案材料溶液的待处理部件的表面上填充设置在掩模中的图案形成用凹部的工序（S180），提高图案的膜质量的工序（S188） 通过处理图案材料溶液形成的薄膜，去除已经粘附在掩模上的图案材料溶液的步骤（S 188），干燥图案材料溶液的步骤（S190）和步骤（S1996） ）对图案膜进行退火处理。

公开(公告)号：US08679283B2

公开(公告)日：2014-03-25

申请号：US13533521

申请日：2012-06-26

申请人： Takatoshi Yamamoto ,  Mitsuru Sato ,  Shintaro Asuke ,  Yoshiaki Mori ,  Kazuhiro Gomi

发明人： Takatoshi Yamamoto ,  Mitsuru Sato ,  Shintaro Asuke ,  Yoshiaki Mori ,  Kazuhiro Gomi

IPC分类号： B32B38/00

CPC分类号： C09J5/00 ,  C09J2205/31 ,  Y10T428/24851 ,  Y10T428/31663

摘要： A bonding method of bonding two base members together through a bonding film is provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through the bonding film. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members to form a liquid coating on the surface; drying the liquid coating so that it is transformed into the bonding film on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.

摘要翻译： 提供了通过接合膜将两个基底部件接合在一起的接合方法。 接合方法是通过接合膜将第一基底构件和第二基底构件接合在一起的接合体的形成方法。 接合方法包括：将含有由硅氧烷化合物构成的硅酮材料的液体材料涂覆在第一和第二基底构件中的至少一个的表面上，以在表面上形成液体涂层; 干燥所述液体涂层，使其在所述第一和第二基底构件中的至少一个的表面上转变成粘结膜; 并且向接合膜施加能量，使得在其表面附近形成接合特性，从而通过接合膜将第一和第二基底部件结合在一起。

公开(公告)号：US09006555B2

公开(公告)日：2015-04-14

申请号：US13571267

申请日：2012-08-09

申请人： Yoshiaki Mori

发明人： Yoshiaki Mori

IPC分类号： G10H1/32 ,  G10H3/00 ,  G10H3/14

CPC分类号： G10H3/14 ,  G10H3/146 ,  G10H2230/275 ,  G10H2230/301 ,  Y10T29/49574

摘要： A percussion instrument that suppresses erroneous detection by a rim sensor includes a first plate affixed to a frame, a second plate elastically supported on the first plate by one or more elastic members, and a rim sensor attached to the second plate. Large vibrations of the frame from an impact of a strike on the rim are transmitted to the second plate, and the rim sensor provides an output corresponding to the striking force. Also, vibrations of the frame generated by striking sound or external sound is attenuated by the elastic member, to suppress transmission of such vibrations to the second plate.

摘要翻译： 抑制由轮辋传感器错误检测的打击乐器包括固定在框架上的第一板，通过一个或多个弹性构件弹性地支撑在第一板上的第二板，以及附着到第二板的轮辋传感器。 来自轮辋撞击的冲击的框架的大的振动被传递到第二板，并且轮辋传感器提供对应于打击力的输出。 此外，由弹性构件衰减由打击声或外部声音产生的框架的振动，以抑制这种振动向第二板的传播。

公开(公告)号：US08686264B2

公开(公告)日：2014-04-01

申请号：US13545913

申请日：2012-07-10

申请人： Yutaka Morita ,  Yoshiaki Mori

发明人： Yutaka Morita ,  Yoshiaki Mori

IPC分类号： G10D13/02

CPC分类号： G10D13/02 ,  G10H1/32 ,  G10H2230/275

摘要： A percussion instrument includes a mainframe having a bottom part defining a lower surface. A head is tensioned over an inner part of the mainframe. A hoop structure is arranged over the outer periphery of the head and applies tension to the head. The hoop structure has a lower surface provided with a plurality of recesses. Female threaded connector parts are contained within the recesses. A plurality of bolts extend through the bottom part of the mainframe and engage the female threaded connector parts, to affix the hoop structure to the mainframe. The bolts extend into the bottom part of the mainframe, such that exposure of the bolts on the upper surface side of the hoop structure can be avoided.

摘要翻译： 打击乐器包括具有限定下表面的底部的主机。 头部张紧在主机的内部。 环形结构布置在头部的外周边上并向头部施加张力。 环形结构具有设置有多个凹部的下表面。 内螺纹连接器部件包含在凹部内。 多个螺栓延伸穿过主机的底部并与内螺纹连接器部分接合，以将箍结构固定在主机上。 螺栓延伸到主机的底部，从而可以避免螺栓在箍结构的上表面侧的暴露。