公开(公告)号：US07655155B2

公开(公告)日：2010-02-02

申请号：US12173237

申请日：2008-07-15

申请人： Myung Sup Jung ,  Chung Kun Cho ,  Yong Ho Ahn ,  Seo Won Jang ,  Jin Hae Chang ,  Mahn Jong Kim ,  Chung Won Park

发明人： Myung Sup Jung ,  Chung Kun Cho ,  Yong Ho Ahn ,  Seo Won Jang ,  Jin Hae Chang ,  Mahn Jong Kim ,  Chung Won Park

IPC分类号： C09K19/38 ,  C09K19/34 ,  C09K19/32 ,  C09K19/20 ,  C07D207/452 ,  C08G73/14 ,  C08G73/16 ,  C08F126/06

CPC分类号： C09K19/3483 ,  C07D207/452 ,  C07D209/52 ,  C08G73/122 ,  C08L79/085 ,  C09K19/3809

摘要： A liquid crystal thermoset (LCT) monomer or oligomer having both ends capped with maleimide having at least one methyl group, represented by Formula 1: wherein R1 and R2 are each independently CH3 or H, and at least one of R1 and R2 is a methyl group, and Ar1 is a divalent organic group containing one or more structural units selected from the group consisting of ester, amide, ester amide, ester imide and ether imide units, and Ar1 has a molecular weight not greater than 5,000.

摘要翻译： 由式1表示的具有至少一个甲基的马来酰亚胺封端的液晶热固性（LCT）单体或低聚物：其中R 1和R 2各自独立地为CH 3或H，并且R 1和R 2中的至少一个为甲基 并且Ar 1是含有一个或多个选自酯，酰胺，酯酰胺，酯酰亚胺和醚酰亚胺单元的结构单元的二价有机基团，Ar 1的分子量不大于5,000。

公开(公告)号：US20090224203A1

公开(公告)日：2009-09-10

申请号：US12173237

申请日：2008-07-15

申请人： Myung Sup Jung ,  Chung Kun Cho ,  Mahn Jong Kim ,  Chung Won Park ,  Yong HO Ahn ,  Seo Won Jang ,  Jin Hae Chang

发明人： Myung Sup Jung ,  Chung Kun Cho ,  Mahn Jong Kim ,  Chung Won Park ,  Yong HO Ahn ,  Seo Won Jang ,  Jin Hae Chang

IPC分类号： C09K19/38 ,  C07D403/12 ,  C08G73/00

CPC分类号： C09K19/3483 ,  C07D207/452 ,  C07D209/52 ,  C08G73/122 ,  C08L79/085 ,  C09K19/3809

摘要： A liquid crystal thermoset (LCT) monomer or oligomer having both ends capped with maleimide having at least one methyl group, represented by Formula 1: wherein R1 and R2 are each independently CH3 or H, and at least one of R1 and R2 is a methyl group, and Ar1 is a divalent organic group containing one or more structural units selected from the group consisting of ester, amide, ester amide, ester imide and ether imide units, and Ar1 has a molecular weight not greater than 5,000.

摘要翻译： 由式1表示的具有至少一个甲基的马来酰亚胺封端的液晶热固性（LCT）单体或低聚物：其中R 1和R 2各自独立地为CH 3或H，并且R 1和R 2中的至少一个为甲基 并且Ar 1是含有一个或多个选自酯，酰胺，酯酰胺，酯酰亚胺和醚酰亚胺单元的结构单元的二价有机基团，Ar 1的分子量不大于5,000。

公开(公告)号：US20090308643A1

公开(公告)日：2009-12-17

申请号：US12332931

申请日：2008-12-11

申请人： Chung Kun CHO ,  Myung Sup Jung ,  Mahn Jong Kim ,  Jin Young Bae ,  Chung Won Park

发明人： Chung Kun CHO ,  Myung Sup Jung ,  Mahn Jong Kim ,  Jin Young Bae ,  Chung Won Park

IPC分类号： H05K1/03 ,  C07C233/65 ,  C09K19/06

CPC分类号： C09K19/22 ,  C07C233/65 ,  C09K19/3842 ,  H05K1/0353 ,  H05K2201/0141 ,  Y10T428/31681 ,  Y10T428/31692

摘要： Disclosed herein is a crosslinkable thermoset monomer. The crosslinkable thermoset monomer has acetylene groups as crosslinking groups introduced at both ends of the backbone. Also disclosed herein is a composition for producing a printed circuit board which comprises the crosslinkable thermoset monomer. The composition exhibits excellent mechanical and thermal properties. Therefore, the composition can be used as a material for next-generation boards that are becoming lighter in weight and smaller in size and thickness. Also disclosed herein is a printed circuit board using the composition.

摘要翻译： 本文公开了可交联的热固性单体。 可交联热固性单体具有在骨架两端引入的交联基团的乙炔基。 本文还公开了一种用于生产包含可交联热固性单体的印刷电路板的组合物。 该组合物表现出优异的机械和热性能。 因此，该组合物可以用作重量更轻，尺寸和厚度更小的下一代板的材料。 本文还公开了使用该组合物的印刷电路板。

公开(公告)号：US08932705B2

公开(公告)日：2015-01-13

申请号：US12645967

申请日：2009-12-23

申请人： Chung-Kun Cho ,  Myung-Sup Jung ,  Kwang-Hee Kim ,  Jae-Jun Lee ,  Kalinina Fedosya ,  Mahn Jong Kim ,  Chung Won Park

发明人： Chung-Kun Cho ,  Myung-Sup Jung ,  Kwang-Hee Kim ,  Jae-Jun Lee ,  Kalinina Fedosya ,  Mahn Jong Kim ,  Chung Won Park

IPC分类号： B32B3/26 ,  B32B15/08 ,  C08K7/22 ,  C08K7/24 ,  C08K7/26 ,  H05K1/03 ,  C08K7/28 ,  C08K5/1515 ,  C08K5/3415

CPC分类号： H05K1/0373 ,  C08K5/1515 ,  C08K5/3415 ,  C08K7/28 ,  H05K2201/0209 ,  H05K2201/0254 ,  Y10T428/249953 ,  Y10T428/249971 ,  Y10T428/31678 ,  Y10T428/31681

摘要： Disclosed is a thermosetting resin composition including a thermosetting aromatic oligomer represented by the following Chemical Formula 1, a hollow particle, and solvent, and a board comprising the same. In the above Chemical Formula 1, wherein B, L1, L2, Z1 and Z2 are the same as in defined in the specification.

摘要翻译： 公开了一种热固性树脂组合物，其包含由以下化学式1表示的热固性芳族低聚物，中空颗粒和溶剂，以及包含该热固性树脂组合物的板。 在上述化学式1中，其中B，L1，L2，Z1和Z2与说明书中定义相同。

公开(公告)号：US08440313B2

公开(公告)日：2013-05-14

申请号：US12332931

申请日：2008-12-11

申请人： Chung Kun Cho ,  Myung Sup Jung ,  Mahn Jong Kim ,  Jin Young Bae ,  Chung Won Park

发明人： Chung Kun Cho ,  Myung Sup Jung ,  Mahn Jong Kim ,  Jin Young Bae ,  Chung Won Park

IPC分类号： B32B15/08 ,  B32B15/20 ,  C08L49/00

CPC分类号： C09K19/22 ,  C07C233/65 ,  C09K19/3842 ,  H05K1/0353 ,  H05K2201/0141 ,  Y10T428/31681 ,  Y10T428/31692

摘要： Disclosed herein is a crosslinkable thermoset monomer. The crosslinkable thermoset monomer has acetylene groups as crosslinking groups introduced at both ends of the backbone. Also disclosed herein is a composition for producing a printed circuit board which comprises the crosslinkable thermoset monomer. The composition exhibits excellent mechanical and thermal properties. Therefore, the composition can be used as a material for next-generation boards that are becoming lighter in weight and smaller in size and thickness. Also disclosed herein is a printed circuit board using the composition.

摘要翻译： 本文公开了可交联的热固性单体。 可交联热固性单体具有在骨架两端引入的交联基团的乙炔基。 本文还公开了一种用于生产包含可交联热固性单体的印刷电路板的组合物。 该组合物表现出优异的机械和热性能。 因此，该组合物可以用作重量更轻，尺寸和厚度更小的下一代板的材料。 本文还公开了使用该组合物的印刷电路板。

公开(公告)号：US09161443B2

公开(公告)日：2015-10-13

申请号：US14113336

申请日：2011-11-28

申请人： Yang Seob Kim ,  Bon Hyeok Gu ,  Mi Jeong Kim ,  Mahn Jong Kim

发明人： Yang Seob Kim ,  Bon Hyeok Gu ,  Mi Jeong Kim ,  Mahn Jong Kim

IPC分类号： C08G64/00 ,  H05K1/05 ,  C08J5/18 ,  H05K1/03 ,  C08G69/44 ,  C08L77/12 ,  C08G63/02 ,  H05K3/02

CPC分类号： H05K1/056 ,  B32B15/08 ,  B32B15/20 ,  B32B27/34 ,  B32B27/36 ,  B32B2307/734 ,  B32B2457/08 ,  C08G69/44 ,  C08J5/18 ,  C08J2377/12 ,  C08L77/12 ,  H05K1/0353 ,  H05K1/0393 ,  H05K3/022 ,  Y10T428/31681

摘要： Provided are a wholly aromatic polyester amide copolymer resin, a polymer film containing the wholly aromatic polyester amide copolymer resin, a flexible metal clad laminate containing the polymer film, and a flexible printed circuit board employing the flexible metal clad laminate. The disclosed wholly aromatic polyester amide copolymer resin includes 5-25 parts by mole of a repeating unit (A) derived from an aromatic hydroxy carboxylic acid; 20-40 parts by mole of at least one repeating unit selected from the group consisting of a repeating unit (B) derived from an aromatic amine having a phenolic hydroxyl group and a repeating unit (B′) derived from an aromatic diamine; 20-40 parts by mole of a repeating unit (C) derived from an aromatic dicarboxylic acid; 5-20 parts by mole of a repeating unit (D) derived from an aromatic diol; and 5-20 parts by mole of a repeating unit (E) derived from an aromatic amino carboxylic acid.

摘要翻译： 提供了全芳族聚酯酰胺共聚物树脂，含有全芳族聚酯酰胺共聚物树脂的聚合物膜，含有该聚合物膜的柔性金属覆层层压板，以及采用该柔性覆金属层压板的柔性印刷电路板。 所公开的全芳族聚酯酰胺共聚物树脂包括5-25摩尔份由芳族羟基羧酸衍生的重复单元（A）; 20-40份摩尔的至少一种选自由具有酚羟基的芳族胺衍生的重复单元（B）和衍生自芳族二胺的重复单元（B'）的重复单元; 20-40份摩尔衍生自芳族二羧酸的重复单元（C）; 5-20份摩尔衍生自芳族二醇的重复单元（D）; 和5-20份（摩尔）衍生自芳族氨基羧酸的重复单元（E）。

公开(公告)号：US20140284085A1

公开(公告)日：2014-09-25

申请号：US14113336

申请日：2011-11-28

申请人： Yang Seob Kim ,  Bon Hyeok Gu ,  Mi Jeong Kim ,  Mahn Jong Kim

发明人： Yang Seob Kim ,  Bon Hyeok Gu ,  Mi Jeong Kim ,  Mahn Jong Kim

IPC分类号： H05K1/05 ,  H05K1/03

CPC分类号： H05K1/056 ,  B32B15/08 ,  B32B15/20 ,  B32B27/34 ,  B32B27/36 ,  B32B2307/734 ,  B32B2457/08 ,  C08G69/44 ,  C08J5/18 ,  C08J2377/12 ,  C08L77/12 ,  H05K1/0353 ,  H05K1/0393 ,  H05K3/022 ,  Y10T428/31681

摘要： Provided are a wholly aromatic polyester amide copolymer resin, a polymer film containing the wholly aromatic polyester amide copolymer resin, a flexible metal clad laminate containing the polymer film, and a flexible printed circuit board employing the flexible metal clad laminate. The disclosed wholly aromatic polyester amide copolymer resin includes 5-25 parts by mole of a repeating unit (A) derived from an aromatic hydroxy carboxylic acid; 20-40 parts by mole of at least one repeating unit selected from the group consisting of a repeating unit (B) derived from an aromatic amine having a phenolic hydroxyl group and a repeating unit (B′) derived from an aromatic diamine; 20-40 parts by mole of a repeating unit (C) derived from an aromatic dicarboxylic acid; 5-20 parts by mole of a repeating unit (D) derived from an aromatic diol; and 5-20 parts by mole of a repeating unit (E) derived from an aromatic amino carboxylic acid.

摘要翻译： 提供了全芳族聚酯酰胺共聚物树脂，含有全芳族聚酯酰胺共聚物树脂的聚合物膜，含有该聚合物膜的柔性金属覆层层压板，以及采用该柔性覆金属层压板的柔性印刷电路板。 所公开的全芳族聚酯酰胺共聚物树脂包括5-25摩尔份由芳族羟基羧酸衍生的重复单元（A）; 20-40份摩尔的至少一种选自由具有酚羟基的芳族胺衍生的重复单元（B）和衍生自芳族二胺的重复单元（B'）的重复单元; 20-40份摩尔衍生自芳族二羧酸的重复单元（C）; 5-20份摩尔衍生自芳族二醇的重复单元（D）; 和5-20份（摩尔）衍生自芳族氨基羧酸的重复单元（E）。

公开(公告)号：US20120037848A1

公开(公告)日：2012-02-16

申请号：US13260194

申请日：2010-04-02

申请人： Youn Eung Lee ,  Sang Hyuk Suh ,  Young Hak Shin ,  Jin Kyu Lee ,  Mahn Jong Kim

发明人： Youn Eung Lee ,  Sang Hyuk Suh ,  Young Hak Shin ,  Jin Kyu Lee ,  Mahn Jong Kim

IPC分类号： C09K19/38 ,  C09K19/54

CPC分类号： C08L23/10 ,  C08K7/14 ,  C08L23/02 ,  C08L23/04 ,  C08L23/06 ,  C08L67/00 ,  C08L67/03 ,  C08L91/06 ,  C08L2666/06

摘要： A wholly aromatic liquid crystalline polyester resin compound and a method of preparing the same. The wholly aromatic liquid crystalline polyester resin compound includes at least one of a polyethylene-based resin and a polypropylene-based resin as an additive. The method of preparing the wholly aromatic liquid crystalline polyester resin compound includes adding at least one of a polyethylene-based resin and a polypropylene-based resin as an additive.

摘要翻译： 全芳族液晶聚酯树脂化合物及其制备方法。 全芳族液晶聚酯树脂化合物包括聚乙烯类树脂和聚丙烯类树脂中的至少一种作为添加剂。 制备全芳族液晶聚酯树脂化合物的方法包括加入聚乙烯类树脂和聚丙烯类树脂中的至少一种作为添加剂。

公开(公告)号：US08894880B2

公开(公告)日：2014-11-25

申请号：US13808883

申请日：2011-06-14

申请人： Young Hak Shin ,  Youn Eung Lee ,  Myung Se Lee ,  Jin Kyu Lee ,  Mahn Jong Kim

发明人： Young Hak Shin ,  Youn Eung Lee ,  Myung Se Lee ,  Jin Kyu Lee ,  Mahn Jong Kim

IPC分类号： C09K19/38 ,  C09K19/54 ,  H01B3/04 ,  H01B3/42 ,  C08L63/02 ,  C08K3/34 ,  H01B3/00 ,  H01B3/47 ,  C09K19/52

CPC分类号： C09K19/54 ,  C08K3/34 ,  C08K7/02 ,  C08K7/14 ,  C09K19/3809 ,  C09K2019/521 ,  H01B3/006 ,  H01B3/42 ,  H01B3/423 ,  H01B3/47 ,  C08L67/03

摘要： Provided is a wholly aromatic liquid crystalline polyester resin compound having excellent electrical insulating properties, heat resistance, and mechanical strength due to the inclusion of an inorganic filler having low electrical conductivity, high heat resistance, and high mechanical strength.

摘要翻译： 提供一种由于包含导电性低，耐热性高，机械强度高的无机填料而具有优异的电绝缘性，耐热性和机械强度的全芳香族液晶聚酯树脂化合物。

公开(公告)号：US08603356B2

公开(公告)日：2013-12-10

申请号：US13260213

申请日：2010-04-02

申请人： Sang Hyuk Suh ,  Youn Eung Lee ,  Young Hak Shin ,  Jin Kyu Lee ,  Mahn Jong Kim

发明人： Sang Hyuk Suh ,  Youn Eung Lee ,  Young Hak Shin ,  Jin Kyu Lee ,  Mahn Jong Kim

IPC分类号： C09K19/52 ,  C09K19/54 ,  C09K19/20 ,  C08L67/03

CPC分类号： C08L67/03 ,  C08K3/013 ,  C08L2666/18

摘要： Provided are a wholly aromatic liquid crystalline polyester resin compound and a method of preparing the same. The wholly aromatic liquid crystalline polyester resin compound comprises a first wholly aromatic liquid crystalline polyester resin with a low melting point, a second wholly aromatic liquid crystalline polyester resin with a high melting point, and an additive, wherein the amount of the first wholly aromatic liquid crystalline polyester resin is 5 to 10 parts by weight with respect to 100 parts by weight of the second wholly aromatic liquid crystalline polyester resin.

摘要翻译： 提供一种全芳族液晶聚酯树脂化合物及其制备方法。 全芳族液晶聚酯树脂化合物包括具有低熔点的第一全芳族液晶聚酯树脂，具有高熔点的第二全芳族液晶聚酯树脂和添加剂，其中第一全芳族液体 结晶性聚酯树脂相对于100重量份的第二全芳族液晶聚酯树脂为5〜10重量份。