公开(公告)号：US20240113084A1

公开(公告)日：2024-04-04

申请号：US18471517

申请日：2023-09-21

Applicant: NANOSYS, INC.

Inventor： Brian KIM

IPC: H01L25/075 ,  H01L27/12 ,  H01L33/48 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H10K50/86 ,  H10K59/00 ,  H10K59/12

CPC classification number: H01L25/0753 ,  H01L27/1214 ,  H01L33/483 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H10K50/865 ,  H10K59/00 ,  H10K59/12 ,  H01L25/167 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light emitting device includes a backplane, an array of light emitting diodes attached to a front side of the backplane, a transparent conductive layer contacting front side surfaces of the light emitting diodes, an optical bonding layer located over a front side surface of the transparent conductive layer, a transparent cover plate located over a front side surface of the optical bonding layer, and a black matrix layer including an array of openings therethrough, and located between the optical bonding layer and the transparent cover plate.

公开(公告)号：US20220223769A1

公开(公告)日：2022-07-14

申请号：US17551578

申请日：2021-12-15

Applicant: NANOSYS, INC.

Inventor： Brian KIM ,  Ivan HUANG ,  Saket CHADDA

IPC: H01L33/58 ,  H01L27/15 ,  H01L33/32

Abstract: A light-emitting device includes a backplane, light-emitting diodes (LEDs) located over a front side of the backplane, and microlenses respectively disposed over the LEDs. Each microlens includes a back surface having a first surface area and configured to receive light emitted from a corresponding LED, an opposing front surface having a second surface area and configured to emit the received light, and at least one sidewall extending from the front surface to the back surface. The second surface area is greater than the first surface area.

公开(公告)号：US20230155079A1

公开(公告)日：2023-05-18

申请号：US17980683

申请日：2022-11-04

Applicant: NANOSYS, INC.

Inventor： Brian KIM ,  Homer ANTONIADIS

IPC: H01L33/50

CPC classification number: H01L33/507 ,  H01L33/502

Abstract: A light emitting device includes a light emitting diode configured to emit blue or ultraviolet radiation incident photons, a color conversion material located over the light emitting diode and configured to absorb the incident photons emitted by the light emitting diode and to generate converted photons having a longer peak wavelength than a peak wavelength of the incident photons, and at least one light extracting feature located between the light emitting diode and the color conversion material.

公开(公告)号：US20230066558A1

公开(公告)日：2023-03-02

申请号：US17818097

申请日：2022-08-08

Applicant: NANOSYS, INC.

Inventor： Brian KIM

IPC: H01L33/56 ,  H01L33/10 ,  H01L33/00 ,  H01L27/15

Abstract: A light emitting device includes a backplane, an array of light emitting diodes attached to a front side of the backplane, such that each of the light emitting diodes includes a stack of a first doped semiconductor layer, a second doped semiconductor layer and an active region located between the first and the second doped semiconductor layers, and a conductive encapsulation layer in contact with sidewalls of the first doped semiconductor layers of the array of light emitting diodes.

公开(公告)号：US20220122949A1

公开(公告)日：2022-04-21

申请号：US17563472

申请日：2021-12-28

Applicant: NANOSYS, INC.

Inventor： Brian KIM

IPC: H01L25/075 ,  H01L27/12 ,  H01L33/48 ,  H01L33/54 ,  H01L33/62 ,  H01L33/58 ,  H01L27/32 ,  H01L51/52

Abstract: A light emitting device includes a backplane, an array of light emitting diodes attached to a front side of the backplane, a transparent conductive layer contacting front side surfaces of the light emitting diodes, an optical bonding layer located over a front side surface of the transparent conductive layer, a transparent cover plate located over a front side surface of the optical bonding layer, and a black matrix layer including an array of openings therethrough, and located between the optical bonding layer and the transparent cover plate.

公开(公告)号：US20230378404A1

公开(公告)日：2023-11-23

申请号：US18057914

申请日：2022-11-22

Applicant: NANOSYS, INC.

Inventor： Brian KIM

IPC: H01L33/58 ,  H01L25/075

CPC classification number: H01L33/58 ,  H01L25/0753 ,  H01L33/32

Abstract: A light emitting device includes a substrate, a plurality of light emitting diodes located over the substrate, and a plurality of micro-lenses. Each of the plurality of micro-lenses is located over a respective one of the plurality of light emitting diodes. Each of the plurality of micro-lenses has a first symmetry axis, each of the plurality of light emitting diodes has a second symmetry axis, and at least some of the plurality of micro-lenses have the first symmetry axis which is laterally displaced relative to the second symmetry axis of the respective one of the plurality of light emitting diodes.

公开(公告)号：US20230155075A1

公开(公告)日：2023-05-18

申请号：US18055572

申请日：2022-11-15

Applicant: NANOSYS, INC.

Inventor： Jason HARTLOVE ,  Saket CHADDA ,  Ernest C. LEE ,  Brian KIM ,  Homer ANTONIADIS ,  Ravisubhash TANGIRALA ,  David OLMEIJER

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/60

CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L33/507 ,  H01L33/60 ,  H01L33/32

Abstract: A light emitting device includes a first optical cavity bounded by cavity walls, a first light emitting diode located in the first optical cavity and configured to emit blue or ultraviolet radiation first incident photons, a first color conversion material located over the first light emitting diode and configured to absorb the first incident photons emitted by the light emitting diode and to generate first converted photons having a longer peak wavelength than a peak wavelength of the first incident photons, and a first color selector located over the first color conversion material and configured to absorb or reflect the first incident photons and to transmit the first converted photons.