公开(公告)号：US20190189572A1

公开(公告)日：2019-06-20

申请号：US15846966

申请日：2017-12-19

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： CHING-WEN CHIANG ,  YEN-CHENG KUAN ,  CHIA-JEN LIANG ,  CHIEN-TE YU

IPC: H01L23/66 ,  H01L23/538 ,  H01L23/31 ,  H01L23/552 ,  H01L21/683 ,  H01L21/56 ,  H01L21/48 ,  H01Q1/22

CPC classification number: H01L23/66 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/5226 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2223/6677 ,  H01L2223/6688 ,  H01L2224/16235 ,  H01L2224/221 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81005 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/247 ,  H01Q1/526 ,  H01Q21/28

Abstract: A multi-band antenna package structure includes a first redistribution layer; an integrated circuit layer, formed on the first redistribution layer, comprising at least one metal via, at least one metal pillar, an integrated circuit chip, and a molding layer, wherein the molding layer is used to fill openings formed by the metal via, the metal pillar and the integrated circuit chip which are disposed on the first redistribution layer, the metal via is electrically connected to one of the first metal patterns of the first redistribution layer; a second redistribution layer, formed on the integrated circuit layer; and a first antenna unit layer, comprising a first dielectric layer and third metal patterns formed in openings of the first dielectric layer, wherein at least one of the third metal patterns is electrically connected to one of the second metal patterns, and the third metal patterns form a first antenna unit.

公开(公告)号：US20190189556A1

公开(公告)日：2019-06-20

申请号：US15848026

申请日：2017-12-20

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： CHIA-JEN LIANG ,  YEN-CHENG KUAN ,  CHING-WEN CHIANG ,  CHIEN-TE YU

IPC: H01L23/522 ,  H01F21/12 ,  H01L27/07

CPC classification number: H01L23/5227 ,  H01F21/12 ,  H01L27/0705

Abstract: A variable inductor which comprises a primary conductor, first and second secondary conductors and one or more switch. The primary conductor has a first node and a second node, wherein the first node is used to connect a first external component and the second node is used to connect a second external component. The first and second secondary conductors magnetically couple to the primary conductor. The one or more switch has two sides connected to the first or second secondary conductor, respectively. The first and second secondary conductors are formed a single-loop structure with two or more changeable current paths which are operated by the states of the one or more switch. An integrated circuit using the variable inductor is also introduced.

公开(公告)号：US20190189342A1

公开(公告)日：2019-06-20

申请号：US15847960

申请日：2017-12-20

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： CHIA-JEN LIANG ,  YEN-CHENG KUAN ,  CHING-WEN CHIANG ,  CHIEN-TE YU

IPC: H01F29/02 ,  H01L49/02 ,  H01L27/06

CPC classification number: H01F29/025 ,  H01F21/12 ,  H01F2021/125 ,  H01L27/0617 ,  H01L28/10

Abstract: A variable inductor comprises a primary conductor, a first secondary conductor and one or more switch. The primary conductor has a first node and a second node, wherein the first node is used to connect a first external component and the second node is used to connect a second external component. The first secondary conductor magnetically couples to the primary conductor. The one or more switch has two sides connected to the first secondary conductor, respectively. The first secondary conductor is formed a single-loop structure with two or more changeable current paths which are operated by the states of the one or more switch. An integrated circuit using the variable inductor is also introduced.

公开(公告)号：US20190333883A1

公开(公告)日：2019-10-31

申请号：US16504539

申请日：2019-07-08

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： CHING-WEN CHIANG ,  YEN-CHENG KUAN ,  CHIA-JEN LIANG ,  CHIEN-TE YU

IPC: H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/22 ,  H01Q21/28 ,  H01L23/538 ,  H01L23/522 ,  H01L23/498 ,  H01L23/31 ,  H01L23/552 ,  H01L21/683

Abstract: Method for manufacturing a multi-band antenna package structure includes providing a first temporary substrate; forming a first dielectric material layer, and first metal patterns; forming at least one metal via; forming at least one metal pillar, and disposing an integrated circuit chip; forming a molding layer; thinning down the molding layer thus forming an integrated circuit chip layer; forming a first redistribution layer; forming a first antenna unit layer; forming a first protection layer, thus a first stacked structure formed; removing the first temporary substrate, and facing down the first stacked structure to adhere it on a second temporary substrate with a second glue layer; forming a second redistribution layer; forming a second protection layer; forming bump balls, thus a second stacked structure formed; removing the second temporary substrate with the second glue layer, facing down and mounting the second stacked structure on a substrate through the bump balls.