公开(公告)号：US20130306985A1

公开(公告)日：2013-11-21

申请号：US13692101

申请日：2012-12-03

申请人： NEW JAPAN RADIO CO., LTD.

发明人： Yoshio FUJII

IPC分类号： H01L29/16 ,  H01L21/02

CPC分类号： H01L29/1608 ,  H01L21/02697 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/48458 ,  H01L2224/4847 ,  H01L2224/48472 ,  H01L2224/48505 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/73265 ,  H01L2924/10272 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/00012

摘要： An aluminum material can be used on a surface of the electrode of a semiconductor element, this aluminum layer need not be formed thick unnecessarily, a copper wire is bonded strongly to the semiconductor element irrespective of a diameter of the wire, and high heat resistance can be achieved. Silicon carbide (SiC) is used as a substrate of the semiconductor element 10, the titanium layer 20 and the aluminum layer 21 are formed as the electrode 15 on the silicon carbide substrate, and by a ball bonding or a wedge bonding of the copper wire 16 to the aluminum layer 21 of the electrode 15 while applying ultrasonic wave, the copper-aluminum compound layer 23 (Al4Cu9, AlCu or the like) is formed between the copper wire 16 and the titanium layer 20.

摘要翻译： 可以在半导体元件的电极的表面上使用铝材料，该铝层不需要不必要地形成，铜线与导线的直径无关地与半导体元件结合，并且高耐热性能 实现。 使用碳化硅（SiC）作为半导体元件10的基板，将钛层20和铝层21形成为碳化硅基板上的电极15，通过铜线的球接或楔形接合 16同时施加超声波，在铜线16和钛层20之间形成铜 - 铝化合物层23（Al4Cu9，AlCu等）。

公开(公告)号：US20150262921A1

公开(公告)日：2015-09-17

申请号：US14574547

申请日：2014-12-18

申请人： NEW JAPAN RADIO CO., LTD

发明人： Yoshio FUJII ,  Eisuke MORI ,  Hideki MUTO ,  Shinji HARA

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31

CPC分类号： H01L23/49541 ,  H01L21/4821 ,  H01L21/4842 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/2939 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48245 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85

摘要： There is provided a circuit package which makes it possible to reduce equipment investment and production cost, change a package size easily according to specifications, and produce a lead frame having an outer lead with a proper length. In the circuit package in which a circuit element is connected to the top surface of the inner lead of the lead frame, the circuit package has a first molded resin portion formed at an upper side of a bottom surface of the lead frame so as to cover the inner lead of the lead frame and a portion of the circuit element to be connected to the inner lead and a second molded resin portion formed at side portions of the outer lead except the top and bottom surfaces of the outer lead.

摘要翻译： 提供了一种电路封装，其可以减少设备投资和生产成本，根据规格容易地改变封装尺寸，并且生产具有适当长度的外引线的引线框架。 在其中电路元件连接到引线框架的内引线的顶表面的电路封装中，电路封装具有形成在引线框架的底表面的上侧的第一模制树脂部分，以便覆盖 引线框架的内引线和要连接到内引线的电路元件的一部分，以及形成在除外导线的顶表面和底表面之外的外引线的侧部处的第二模塑树脂部分。

公开(公告)号：US20150342025A1

公开(公告)日：2015-11-26

申请号：US14618284

申请日：2015-02-10

申请人： NEW JAPAN RADIO CO., LTD.

发明人： Yoshio FUJII ,  Shinji HARA

IPC分类号： H05K1/02

CPC分类号： H05K1/0203 ,  H01L23/13 ,  H01L23/36 ,  H01L23/4951 ,  H01L2924/0002 ,  H05K1/021 ,  H05K1/183 ,  H05K2201/09072 ,  H01L2924/00

摘要： There is provided a mounting structure of electronic components wherein the heat sink is disposed so as to allow a high heat releasing property to be achieved and ensure that manufacturing is easy. The resin film is provided at the lower surface side of the whole circuit element to which the lead is connected; a molding resin is molded at the upper side from the lower surface of the lead including the side portions of the lead, the circuit element and the connecting portions of the lead and the circuit element; the lead is connected to the electrode of the circuit board so that flattened back surfaces of a plurality of one side resin-molded elements are on the same horizontal plane; and a single heat sink is mounted on the back surfaces of the plurality of one side resin-molded elements.

摘要翻译： 提供了一种电子部件的安装结构，其中设置散热器以便实现高的散热性能并且确保制造容易。 树脂膜设置在引线连接的整个电路元件的下表面侧; 在包括引线，电路元件和引线和电路元件的连接部分的引线的侧部的引线的下表面的上侧的上侧模制成型树脂; 引线连接到电路板的电极，使得多个单侧树脂模制元件的平坦的后表面在同一水平面上; 并且单个散热器安装在多个一侧树脂成型元件的背面上。

公开(公告)号：US20160211200A1

公开(公告)日：2016-07-21

申请号：US14988450

申请日：2016-01-05

申请人： NEW JAPAN RADIO CO., LTD.

发明人： Yuya OHASHI ,  Jun YAMASHITA ,  Yoshio FUJII ,  Kohei SHIROKURA

IPC分类号： H01L23/495

CPC分类号： H01L23/49517 ,  H01L23/3107 ,  H01L23/49551 ,  H01L23/49558 ,  H01L23/49575 ,  H01L23/5228 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/0002 ,  H01L2924/181 ,  H03K19/00 ,  H03K19/00346 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： One embodiment provides a semiconductor device having a first chip for lowering an input voltage and a second chip for performing signal processing, mounted on a die pad. Lead terminals are divided into a first lead row and a second lead row. The first lead row are connected with the first chip, the first chip are connected with the second chip or the second lead row, and the second chip are connected with the second lead row. A distance between the lead terminals of the first lead row is set longer than a distance between the lead terminals of the second lead row, and a sealing resin is provided to fill at least between the lead terminals of the first lead row.

摘要翻译： 一个实施例提供一种半导体器件，其具有用于降低输入电压的第一芯片和用于执行信号处理的第二芯片，其安装在芯片焊盘上。 引线端子分为第一引线列和第二引线列。 第一引线与第一芯片连接，第一芯片与第二芯片或第二引线连接，第二芯片与第二引线相连接。 第一引线列的引线端子之间的距离被设定为比第二引线列的引线端子之间的距离长，并且提供密封树脂以填充至少在第一引线行的引线端子之间。