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公开(公告)号：US11437214B2
公开(公告)日：2022-09-06
申请号：US17078598
申请日：2020-10-23
发明人： Toru Kimura , Misao Iseki , Hideyuki Obata
摘要： An electron gun comprising a cathode having an electron emitting surface and whose planar shape is circular, a heater to increase the temperature of the cathode, and an anode to apply a positive electric potential relative to the cathode to extract electrons in a predetermined direction is provided. The cathode comprises a through hole at a central portion thereof along a central axis of the cathode, and either the cathode comprises a no-emitting layer at at least one of an opening edge on the electron emitting surface side of the through hole and an inner surface of the through hole, or the opening edge on the electron emitting surface side of the through hole is a chamfered C surface or a chamfered R surface.
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公开(公告)号：US20210125805A1
公开(公告)日：2021-04-29
申请号：US17078598
申请日：2020-10-23
发明人： Toru Kimura , Misao Iseki , Hideyuki Obata
摘要： An electron gun comprising a cathode having an electron emitting surface and whose planar shape is circular, a heater to increase the temperature of the cathode, and an anode to apply a positive electric potential relative to the cathode to extract electrons in a predetermined direction is provided. The cathode comprises a through hole at a central portion thereof along a central axis of the cathode, and either the cathode comprises a no-emitting layer at at least one of an opening edge on the electron emitting surface side of the through hole and an inner surface of the through hole, or the opening edge on the electron emitting surface side of the through hole is a chamfered C surface or a chamfered R surface.
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公开(公告)号：US10418507B2
公开(公告)日：2019-09-17
申请号：US16060006
申请日：2015-12-08
发明人： Fumiaki Ohno , Seiji Koike
IPC分类号： H01L27/14 , H01L31/173 , G01S7/481 , H01L23/00 , H01L25/16 , G01S17/46 , H01L23/552 , H01L33/48 , H01L33/54
摘要： To achieve an opto-reflector in which a distance to a detection target is shortened to be able to detect the position of the closer detection target, and thereby contributing to the reduction of the arrangement space. The opto-reflector (10) includes a plate-shaped substrate (11); a light emitting element (13) and a light receiving element (14) mounted on the substrate (11); light transmitting resin layer (12) which seals the light emitting element (13) and the light receiving element (14); and a light shielding portion (21) provided between the light emitting element (13) and the light receiving element (14). The light shielding portion (21) is formed at a height such that a part of light beam can be directly transferred between the light emitting element (13) and the light receiving element (14) via the light transmitting resin layer (12).
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公开(公告)号：US20190170872A1
公开(公告)日：2019-06-06
申请号：US16205486
申请日：2018-11-30
发明人： Nobumitsu HIRANO , Hajime FUJIWARA , Kenji TAKEBUCHI , Hiroyuki KUCHIJI , Akira SESHIMOTO , Kimiyoshi YAMASAKI , Kenichi TAGUCHI , Masaya OTOKAWA
CPC分类号： G01S15/04 , B06B1/02 , B06B1/0215 , B06B2201/70 , E05F15/40 , E05F15/73 , E05F2015/763 , E05Y2400/53 , E05Y2400/54 , E05Y2900/531 , G01S7/521 , G01S15/003
摘要： An ultrasonic sensor in the invention includes an ultrasonic transmitter, an ultrasonic receiver, and a detector. The ultrasonic transmitter transmits pulse-shaped ultrasonic waves to a thin plate to excite the thin plate. The ultrasonic receiver receives direct waves and reflected waves among the ultrasonic waves propagating in the thin plate excited by the pulse-shaped ultrasonic waves, the direct waves propagating only in the thin plate, and the reflected waves radiating outward, then reflected by the object, and returning to the thin plate. The detector detects the object present near the thin plate on the basis of a difference between a time at which the ultrasonic receiver receives the direct waves and a time at which the ultrasonic receiver receives the reflected waves.
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公开(公告)号：US20180309391A1
公开(公告)日：2018-10-25
申请号：US15770149
申请日：2016-10-18
发明人： Yasuyuki ENDOU , Toshio IMANISHI , Hitoshi MATSUNO
CPC分类号： H02N2/008 , B06B1/0269 , B06B1/06 , B06B1/0644 , H02N2/06
摘要： A self-oscillating piezoelectric actuator drive circuit includes a integrating circuit; an inverter (INV1), inverters (INV2 and INV3) inverting an output signal of the inverter (INV1), sense resistors (Rs1 and Rs2) connected to output sides of the inverters (INV2 and INV3), a positive feedback resistor (Rfb2) feeding back an output signal of the inverters (INV2 and INV3) to the integrating circuit; and a negative feedback resistor (Rfb1) feeding back a voltage generated from the sense resistors (Rs1 and Rs2, Rs1
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公开(公告)号：US20180307260A1
公开(公告)日：2018-10-25
申请号：US15959649
申请日：2018-04-23
发明人： Toshiyuki NAGAI
摘要： According to one embodiment, a constant-voltage power supply circuit includes: an error amplifier including an inverting input terminal and a noninverting input terminal, a reference voltage source connected with the inverting input terminal of the error amplifier, an output transistor, the transistor having a source connected with a power supply terminal, a drain connected with a circuit output terminal, and a gate connected with an output terminal of the error amplifier, and an output voltage detecting circuit, the circuit being connected between the circuit output terminal and a power supply terminal, detecting voltage of the circuit output terminal to apply the detected voltage to the noninverting input terminal of the error amplifier. The constant-voltage power supply circuit further includes a positive feedback circuit connected between the output terminal of the error amplifier and the gate of the output transistor.
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公开(公告)号：US09245954B2
公开(公告)日：2016-01-26
申请号：US13692101
申请日：2012-12-03
发明人： Yoshio Fujii
CPC分类号： H01L29/1608 , H01L21/02697 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05624 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48247 , H01L2224/48458 , H01L2224/4847 , H01L2224/48472 , H01L2224/48505 , H01L2224/48724 , H01L2224/48824 , H01L2224/73265 , H01L2924/10272 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/20757 , H01L2924/00015 , H01L2924/00012
摘要： An aluminum material can be used on a surface of the electrode of a semiconductor element, this aluminum layer need not be formed thick unnecessarily, a copper wire is bonded strongly to the semiconductor element irrespective of a diameter of the wire, and high heat resistance can be achieved. Silicon carbide (SiC) is used as a substrate of the semiconductor element 10, the titanium layer 20 and the aluminum layer 21 are formed as the electrode 15 on the silicon carbide substrate, and by a ball bonding or a wedge bonding of the copper wire 16 to the aluminum layer 21 of the electrode 15 while applying ultrasonic wave, the copper-aluminum compound layer 23 (Al4Cu9, AlCu or the like) is formed between the copper wire 16 and the titanium layer 20.
摘要翻译： 可以在半导体元件的电极的表面上使用铝材料，该铝层不需要不必要地形成，铜线与导线的直径无关地与半导体元件结合，并且高耐热性能 实现。 使用碳化硅（SiC）作为半导体元件10的基板，将钛层20和铝层21形成为碳化硅基板上的电极15，通过铜线的球接或楔形接合 16同时施加超声波，在铜线16和钛层20之间形成铜 - 铝化合物层23（Al4Cu9，AlCu等）。
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公开(公告)号：US09245830B2
公开(公告)日：2016-01-26
申请号：US14574547
申请日：2014-12-18
发明人： Yoshio Fujii , Eisuke Mori , Hideki Muto , Shinji Hara
IPC分类号： H01L23/495 , H01L21/48 , H01L23/31 , H01L21/56 , H01L23/00
CPC分类号： H01L23/49541 , H01L21/4821 , H01L21/4842 , H01L21/561 , H01L21/565 , H01L23/3107 , H01L23/49582 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/96 , H01L24/97 , H01L2224/16245 , H01L2224/2919 , H01L2224/29294 , H01L2224/2939 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48245 , H01L2224/73265 , H01L2224/83101 , H01L2224/97 , H01L2924/12042 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2224/83 , H01L2224/85
摘要： A circuit package having an inner lead, an outer lead and a circuit element is provided, in which the circuit element is connected a first surface of the inner lead. The circuit package has a first molded resin portion and second molded resin portions. The first molded resin portion is formed from a second surface, opposite to the first surface, of the inner lead toward the first surface inner lead embedding the inner lead and the circuit element. And the second molded resin portions are formed on side portions of the outer lead excluding the first and second surfaces of the outer lead.
摘要翻译： 提供具有内引线，外引线和电路元件的电路封装，其中电路元件连接在内引线的第一表面上。 电路封装具有第一模制树脂部分和第二模制树脂部分。 第一模制树脂部分由内引线的与第一表面相对的第二表面形成为嵌入内引线和电路元件的第一表面内引线。 并且第二模制树脂部分形成在除了外部引线的第一和第二表面之外的外部引线的侧部。
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公开(公告)号：US20130306985A1
公开(公告)日：2013-11-21
申请号：US13692101
申请日：2012-12-03
发明人： Yoshio FUJII
CPC分类号： H01L29/1608 , H01L21/02697 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05624 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48247 , H01L2224/48458 , H01L2224/4847 , H01L2224/48472 , H01L2224/48505 , H01L2224/48724 , H01L2224/48824 , H01L2224/73265 , H01L2924/10272 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/20757 , H01L2924/00015 , H01L2924/00012
摘要： An aluminum material can be used on a surface of the electrode of a semiconductor element, this aluminum layer need not be formed thick unnecessarily, a copper wire is bonded strongly to the semiconductor element irrespective of a diameter of the wire, and high heat resistance can be achieved. Silicon carbide (SiC) is used as a substrate of the semiconductor element 10, the titanium layer 20 and the aluminum layer 21 are formed as the electrode 15 on the silicon carbide substrate, and by a ball bonding or a wedge bonding of the copper wire 16 to the aluminum layer 21 of the electrode 15 while applying ultrasonic wave, the copper-aluminum compound layer 23 (Al4Cu9, AlCu or the like) is formed between the copper wire 16 and the titanium layer 20.
摘要翻译： 可以在半导体元件的电极的表面上使用铝材料，该铝层不需要不必要地形成，铜线与导线的直径无关地与半导体元件结合，并且高耐热性能 实现。 使用碳化硅（SiC）作为半导体元件10的基板，将钛层20和铝层21形成为碳化硅基板上的电极15，通过铜线的球接或楔形接合 16同时施加超声波，在铜线16和钛层20之间形成铜 - 铝化合物层23（Al4Cu9，AlCu等）。
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公开(公告)号：US11971469B2
公开(公告)日：2024-04-30
申请号：US17514377
申请日：2021-10-29
发明人： Kazuo Oikawa , Satoshi Sasaki
CPC分类号： G01S13/505 , G01S7/354 , G06F3/017
摘要： A contactless switch device including a reflected signal acquisition unit that acquires a reflected signal of a Doppler radar or a distance measurement radar, an approach and recede detection unit that detects an approach and a recede of a target based on the reflected signal, a target identification unit that identifies the target as a hand waving left and right, up and down, or back and forth, or a thing other than the hand based on a repeated pattern of the approach and the recede of the target, and a switch control unit that executes on-and-off controls on a switch-controlled object based on whether the target is the hand waving left and right, up and down, or back and forth, or the thing other than the hand.
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