公开(公告)号：US10283688B2

公开(公告)日：2019-05-07

申请号：US15680984

申请日：2017-08-18

Applicant: NICHIA CORPORATION

Inventor： Akira Goto ,  Kunihito Sugimoto

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  F21V19/00 ,  H01L25/075 ,  F21Y115/10

Abstract: A light emitting device includes a mounting board, a first light emitting element and a second light emitting element. The mounting board includes an insulator which includes a front face and a back face, a pair of front face wiring parts disposed on the front face of the insulator, a connection wiring part disposed on the front face of the insulator and spaced apart from the front face wiring parts, a pair of back face terminals disposed on the back face of the insulator, first interlayer wiring parts penetrating the insulator and electrically connecting the front face wiring parts and the back face terminals, and one or more second interlayer wiring parts embedded in the insulator to be in contact with the connection wiring part, and spaced apart from the back face terminals.

公开(公告)号：US20180053886A1

公开(公告)日：2018-02-22

申请号：US15680984

申请日：2017-08-18

Applicant: Nichia Corporation

Inventor： Akira Goto ,  Kunihito Sugimoto

IPC: H01L33/64 ,  H05K1/02 ,  H05K1/18 ,  H05K1/03 ,  H05K1/09 ,  F21V19/00 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L33/647 ,  F21V19/0025 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K2201/0187 ,  H05K2201/09636 ,  H05K2201/10106 ,  H05K2201/10674

Abstract: A light emitting device includes a mounting board, a first light emitting element and a second light emitting element. The mounting board includes an insulator which includes a front face and a back face, a pair of front face wiring parts disposed on the front face of the insulator, a connection wiring part disposed on the front face of the insulator and spaced apart from the front face wiring parts, a pair of back face terminals disposed on the back face of the insulator, first interlayer wiring parts penetrating the insulator and electrically connecting the front face wiring parts and the back face terminals, and one or more second interlayer wiring parts embedded in the insulator to be in contact with the connection wiring part, and spaced apart from the back face terminals.

公开(公告)号：US10330852B2

公开(公告)日：2019-06-25

申请号：US15783354

申请日：2017-10-13

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Akira Goto

IPC: F21V21/03 ,  F21V8/00 ,  H01L33/00 ,  H01L33/50

Abstract: A light-emitting device includes a light-emitting element, first and second light-transmissive members disposed on the light-emitting element, a light-guiding member, and a light-reflective member. A perimeter of a lower surface of the first light-transmissive member is disposed inwardly of a perimeter of an upper surface of the light-emitting element in a plan view. The light-guiding member covers the upper surface of the light-emitting element and the lower surface and lateral surfaces of the first light-transmissive member. The light-guiding member does not cover an upper surface of the second light-transmissive member and at least a portion of a lateral surface of the second light-transmissive member continuous. The light-reflective member covers lateral surfaces of the light-guiding member and at least the portion of the lateral surface of the second light-transmissive member exposed from the light-guiding member. The light-reflective member does not cover the upper surface of the second light-transmissive member.

公开(公告)号：US11024771B2

公开(公告)日：2021-06-01

申请号：US16803589

申请日：2020-02-27

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Akira Goto

IPC: H01L33/38 ,  H01L33/48 ,  H01L33/50 ,  H01L23/00 ,  H01L33/00 ,  H01L33/60 ,  H01L33/36 ,  H01L33/52 ,  H01L33/62

Abstract: A method for manufacturing a light emitting device includes: providing a substrate defining a mounting region having a wiring pattern on an upper face thereof; forming a plurality of bumps arranged in a plurality of columns extending parallel to each other with a distance between adjacent ones of the bumps in one of the columns arranged closest to an outer edge of the mounting region is larger than a distance between adjacent ones of the bumps arranged on an inner side in a plan view, and the bumps include first bumps and second bumps with the first bumps including first large bumps and first small bumps, with all the bumps in the one of the columns arranged closest to the outer edge are the same size; mounting the light emitting element onto the bumps in a flip-chip manner; and forming a cover member.

公开(公告)号：US10243106B2

公开(公告)日：2019-03-26

申请号：US15841769

申请日：2017-12-14

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Akira Goto

IPC: H01L33/38 ,  H01L33/48 ,  H01L33/50 ,  H01L23/00 ,  H01L33/00 ,  H01L33/60 ,  H01L33/36 ,  H01L33/62

Abstract: A light emitting device includes a substrate, a light emitting element, a plurality of bumps and a cover member. The bumps are disposed between the substrate and the light emitting element to mount the light emitting element on the substrate. The bumps include a plurality of first bumps bonded to a first electrode of the light emitting element, and a plurality of second bumps bonded to a second electrode of the light emitting element. The first bumps are spaced apart from exposed portions of a first semiconductor layer of the light emitting element. The first bumps include a plurality of large bumps and a plurality of small bumps each having a smaller surface area than each of the large bumps in a plan view. The cover member covers the light emitting element, the bumps, and the substrate.

公开(公告)号：US20180106942A1

公开(公告)日：2018-04-19

申请号：US15783354

申请日：2017-10-13

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Akira Goto

IPC: F21V8/00

CPC classification number: G02B6/005 ,  G02B6/0018 ,  G02B6/002 ,  G02B6/0065 ,  G02B6/0068 ,  H01L25/0753 ,  H01L33/501 ,  H01L33/502 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62

Abstract: A light-emitting device includes a light-emitting element, first and second light-transmissive members disposed on the light-emitting element, a light-guiding member, and a light-reflective member. A perimeter of a lower surface of the first light-transmissive member is disposed inwardly of a perimeter of an upper surface of the light-emitting element in a plan view. The light-guiding member covers the upper surface of the light-emitting element and the lower surface and lateral surfaces of the first light-transmissive member. The light-guiding member does not cover an upper surface of the second light-transmissive member and at least a portion of a lateral surface of the second light-transmissive member continuous. The light-reflective member covers lateral surfaces of the light-guiding member and at least the portion of the lateral surface of the second light-transmissive member exposed from the light-guiding member. The light-reflective member does not cover the upper surface of the second light-transmissive member.