公开(公告)号：US08975100B2

公开(公告)日：2015-03-10

申请号：US14059243

申请日：2013-10-21

Applicant: Nichia Corporation

Inventor： Masato Fujitomo ,  Hiroto Tamaki ,  Shinji Nishijima ,  Yuichiro Tanda ,  Tomohide Miki

IPC: H01L21/00 ,  H01L33/48 ,  H01L23/00 ,  H01L31/0203 ,  H01L25/16

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L25/167 ,  H01L31/02002 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

Abstract translation: 一种制造光半导体器件的方法，包括在支撑衬底上形成彼此分开设置的多个第一和第二导电构件; 提供由第一和第二导电构件之间的光阻树脂形成的基底构件; 将光学半导体元件安装在第一和/或第二导电构件上; 通过由半透明树脂形成的密封构件覆盖光学半导体元件; 并且在去除支撑衬底之后获得单独的光学半导体器件。

公开(公告)号：US11271144B2

公开(公告)日：2022-03-08

申请号：US16222581

申请日：2018-12-17

Applicant: NICHIA CORPORATION

Inventor： Masato Fujitomo ,  Hiroto Tamaki ,  Shinji Nishijima ,  Yuichiro Tanda ,  Tomohide Miki

IPC: H01L33/48 ,  H01L33/62 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/02 ,  H01L33/52 ,  H01L25/16

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

公开(公告)号：US10164163B2

公开(公告)日：2018-12-25

申请号：US15692542

申请日：2017-08-31

Applicant: NICHIA CORPORATION

Inventor： Masato Fujitomo ,  Hiroto Tamaki ,  Shinji Nishijima ,  Yuichiro Tanda ,  Tomohide Miki

IPC: H01L33/48 ,  H01L33/62 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/02 ,  H01L33/52 ,  H01L25/16

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

公开(公告)号：US09773959B2

公开(公告)日：2017-09-26

申请号：US14603148

申请日：2015-01-22

Applicant: NICHIA CORPORATION

Inventor： Masato Fujitomo ,  Hiroto Tamaki ,  Shinji Nishijima ,  Yuichiro Tanda ,  Tomohide Miki

IPC: H01L33/48 ,  H01L33/62 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/02 ,  H01L33/52 ,  H01L25/16

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L25/167 ,  H01L31/02002 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

公开(公告)号：US09631797B2

公开(公告)日：2017-04-25

申请号：US14546042

申请日：2014-11-18

Applicant: NICHIA CORPORATION

Inventor： Hiroshi Miyairi ,  Takayuki Igarashi ,  Masato Fujitomo ,  Satoshi Shirahama

IPC: F21V19/00 ,  F21V29/70 ,  F21V29/74 ,  F21V29/505 ,  F21Y101/00

CPC classification number: F21V19/003 ,  F21V19/0055 ,  F21V29/505 ,  F21V29/70 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2115/10 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012

Abstract: A light emitting device has a plurality of light emitting elements, a heat spreading member on which the plurality of light emitting elements are mounted, and having a bottom face, an insulating member having a recess that includes side walls and a bottom wall, a top face of the bottom wall being in contact with the bottom face of the heat spreading member, and a circuit board having a circuit that is provided on the heat spreading member and supplies power to the plurality of light emitting elements.